Reduced capacity carrier, transport, load port, buffer system

ABSTRACT

In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of U.S. Provisional PatentApplication Ser. No. 60/838,906 (now expired), filed Aug. 18, 2006 andis a continuation of U.S. patent application Ser. No. 11/891,835 (nowU.S. Pat. No. 8,272,827) filed on Aug. 13, 2007 which is a continuationin part of U.S. application Ser. No. 11/803,077, filed May 11, 2007which is a continuation in part of U.S. patent application Ser. No.11/787,981 (now abandoned), filed Apr. 18, 2007 which is a continuationin part of U.S. patent application Ser. No. 11/594,365 (now U.S. Pat.No. 7,798,758), filed Nov. 7, 2006 which is a continuation of U.S.patent application Ser. No. 11/556,584 (now abandoned), filed Nov. 3,2006 which claims the benefit of U.S. Provisional Patent Application No.60/733,813 (now expired), filed Nov. 7, 2005, all of which areincorporated by reference herein in their entirety.

FIELD

The exemplary embodiments described herein are related to substrateprocessing systems and particularly to substrate transport systems,transport carriers, transport to processing tool interfaces andarrangements.

EARLIER RELATED EMBODIMENTS

The prime forces on the fabrication of electronic devices are theconsumer desire for more capable, and smaller electronic devices atlower costs. The primal forces translate to an impetus on manufacturersfor further miniaturization and improvements in fabrication efficiency.Manufacturers, thus seek gains wherever possible. In the case ofsemiconductor devices, the conventional fabrication facility or FAB hasat its heart (or base organizational structure) the discrete processingtool, for example a cluster tool, for performing one or more processesto semiconductor substrates. Conventional FABs are hence organizedaround the processing tool, that may be arranged in desiredconfigurations to transform the semiconductor substrates into desiredelectronic devices. For example, the processing tool may be arrayed inthe conventional FAB in processing bays. As may be realized, betweentools, substrates may be held in carriers, such as SMF's, FOUP's, sothat between tools substrates in process may remain in substantiallysimilar cleanliness conditions as within the tools. Communicationbetween tools may be provided by handling systems (such as automatedmaterial handling systems, AMHS) capable of transporting substratecarriers to the desired processing tools in the FAB. Interface betweenthe handling system and processing tool may be considered for examplepurposes as having generally two parts, interface between handlingsystem and tool to load/unload carriers to the loading stations of theprocessing tool, and interface of the carriers (i.e. (individually or ingroups) to the tool to allow loading and unloading or substrates betweencarrier and tool. There are numerous conventional interface systemsknown that interface the processing tools to carriers and to materialhandling systems. Many of the conventional interface systems suffer fromcomplexity resulting in one or more of the process tool interface, thecarrier interface or the material handling system interface havingundesired features that increase costs, or otherwise introduceinefficiencies in the loading and unloading of substrates in processingtools. The exemplary embodiments described in greater detail belowovercome the problems of conventional systems.

Industry trends indicate that future IC devices may have about a 45 nmarchitecture or smaller. In order to increase efficiency and lowerfabrication costs, it is desired that IC devices of this scale bemanufactured using semiconductor substrates or wafers as large aspossible. Conventional FABs are generally capable of handling 200 mm or300 mm wafers. Industry trends indicate that in the future, it may bedesirable that FABs handle wafers that may be larger than 300 mm wafers,such as 450 mm wafers. As may be realized, the use of larger wafers mayresult in longer processing times per wafer. Accordingly, with theemployment of larger wafers, such as wafers of 300 mm or greater it maybe desired to use smaller lot sizes for wafer processing in order toreduce work in process (WIP) in the FAB. Also smaller wafer lot sizesmay be desired for specialty lot processing of wafers of any size, orfor processing of any other substrates or flat panels including forexample flat panels for flat screen displays. Though reduced WIP andefficient specialty lot processing is enabled by their use, neverthelessemployment of small processing lots in the FAB may have a deleteriouseffect on conventional FAB throughput. For example smaller lot size, ascompared to larger lot sizes, tend to increase the transport systemburden for a transport system (transporting wafer lots) of a givencapacity. This is illustrated in the graph shown in FIG. 51A. The graphin FIG. 51A illustrates the relationship between lot size and transportrate (expressed as moves per hour) for a number of different fab rates(expressed as wafer starts per desired periods such as per month, e.g.WSPM). The graph in FIG. 51A also shows a line indicating the maximumcapacity of a conventional FAB handling system (e.g. about 6000-7000moves per hour). Thus, the intersection between the handing systemcapacity line and the FAB rate curves identify the surfaces to lot sizeavailable. For example, to achieve a FAB rate of about 24,000 WSPM, withthe given conventional transport system, the smallest lot size is about15 wafers. The use of smaller wafer lots causes a reduction in FAB rate.Hence, it is desired to provide a system in which the wafer carrier, theinterface between the carrier and processing tool, the carrier transportsystem (transporting carriers between tools, storage locations, etc.within the FAB) be arranged to allow use of wafer lots as small as oneand as large as desired, without adversely impacting FAB rate.

SUMMARY OF THE EXEMPLARY EMBODIMENT(S)

In accordance with an exemplary embodiment a semiconductor workpieceprocessing system comprising at least one processing tool for processingsemiconductor workpieces, a container for holding at least onesemiconductor workpiece therein for transport to and from the at leastone processing tool and a first transport section elongated and defininga travel direction. The first transport section has parts that interfacethe container, supporting and transporting the container along thetravel direction to and from the at least one processing tool. Thecontainer is in substantially continuous transport at a substantiallyconstant rate in the travel direction, when supported by the firsttransport section. A second transport section is connected to the atleast one process tool for transporting the container to and from the atleast one processing tool. The second transport section is separate anddistinct from the first transport section and interfaces the firsttransport section for loading and unloading the container to and fromthe parts of the first transport section.

In accordance with another exemplary embodiment a semiconductorworkpiece processing system is provided. The system comprises at leastone processing tool for processing semiconductor workpieces, a containerfor holding at least one semiconductor workpiece therein for transportto and from the at least one processing tool. A first transport sectionelongated and defining a travel direction. The first transport sectionhas parts that interface the container, supporting and transporting thecontainer along the travel direction to and from the at least oneprocessing tool. The system has a second transport section connected tothe at least one processing tool and first transport section interfacingthe container between the at least one processing tool and firsttransport section. When supported by the first transport section thecontainer travels at a substantially constant rate in the traveldirection. The constant rate of travel of the container is substantiallyindependent of an interface rate between the second transport sectionand the at least one processing tool.

BRIEF DESCRIPTION OF DRAWINGS

The foregoing aspects and other features of the present invention areexplained in the following description, taken in connection with theaccompanying drawings, wherein:

FIG. 1 is a schematic elevation view of a workpiece carrierincorporating features in accordance with an exemplary embodiment, and aworkpiece or substrate S positioned on the carrier; and FIGS. 1A-1B arerespectively schematic partial plan and elevation views of a workpiecesupport of the carrier in accordance with another exemplary embodiment;

FIG. 2A is a schematic cross-sectional elevation view of the carrier inFIG. 1 and a tool port interface in accordance with another exemplaryembodiment;

FIG. 2B is another schematic cross-section elevation of a tool portinterface and carrier in accordance with another exemplary embodiment;

FIGS. 3A-3C are schematic cross-section elevation views respectivelyillustrating a tool port interface and carrier, in accordance withanother exemplary embodiment, in three different positions;

FIG. 4 is a schematic elevation view of a carrier and tool interface inaccordance with yet another exemplary embodiment, and FIGS. 4A-4C arerespectively enlarged cross-sectional views of a portion of theinterface between carrier and tool each illustrating the interfaceconfiguration in accordance with different exemplary embodiments;

FIGS. 5A-5C are schematic partial elevation views of a carrier and toolinterface in accordance with yet another exemplary embodiment, showingthe carrier and tool interface in three respective positions.

FIG. 6A-6B are respectively schematic elevation views of workpiececarriers in accordance with other different exemplary embodiments;

FIGS. 7A-7C are schematic elevation views of a workpiece carrier, inaccordance with another exemplary embodiment, respectively showing thecarrier in different positions;

FIG. 8 is another schematic elevation view of tool interface and carrierin accordance with another exemplary embodiment;

FIG. 9 is another schematic elevation view of tool interface and carrierin accordance with another exemplary embodiment;

FIG. 10 is another schematic elevation view of tool interface andcarrier in accordance with another exemplary embodiment, and FIG. 10A isa schematic partial elevation of a process tool and carrier interfacedtherewith in accordance with another exemplary embodiment;

FIG. 11 is a schematic elevation view of a process tool section andcarrier interface therewith in accordance with another exemplaryembodiment;

FIGS. 12A-12B are schematic bottom views of the carrier (workpiecetransfer) opening and carrier door of the carrier in FIG. 11;

FIGS. 13A-13B are schematic top plan views of the interface and a toolto carrier door interface of the tool section in FIG. 11;

FIG. 14 is a schematic elevation of a process tool and carrierinterfaced therewith in accordance with still another exemplaryembodiment;

FIG. 15 is a schematic elevation view of a tool interface and carrier inaccordance with yet another exemplary embodiment;

FIGS. 16A-16B are schematic elevation views of a tool interface andcarrier respectively shown on two different positions in accordance withanother exemplary embodiment;

FIG. 17 is a schematic side view of a carrier, and FIGS. 17A-17C areother schematic elevation views of the carrier and a tool interface anda plan view of the tool interface in accordance with another exemplaryembodiment;

FIGS. 18-19 are schematic elevation views of a tool interface andcarrier in accordance with another exemplary embodiment;

FIG. 20 is a schematic plan view of a transport system in accordancewith another exemplary embodiment;

FIGS. 20A-20B are schematic partial plan views of portions of thetransport system track in FIG. 10; and FIGS. 20C-20D are schematicbottom views of a different payloads of the transport system inaccordance with other exemplary embodiments;

FIG. 21 is a schematic partial plan view of another portion of thetransport system in accordance with another exemplary embodiment;

FIGS. 22-24 are other schematic partial plan views of portions of thetransport system in accordance with other exemplary embodiments;

FIGS. 25A-25B respectively show different elevation views of a transportsystem and processing tool in accordance with another exemplaryembodiment;

FIGS. 26A-26B respectively show different schematic elevation views of atransfer interface system for transferring carriers between transportsystem and tool in accordance with another exemplary embodiment;

FIG. 27 is a schematic partial elevation view of a transport system inaccordance with another exemplary embodiment and FIGS. 27A-27B are otherschematic partial elevations of the transport system in differentpositions;

FIG. 28 is another schematic elevation view of a transport system inaccordance with another exemplary embodiment;

FIGS. 29A-29B are schematic plan views of transport systems inaccordance with another exemplary embodiment;

FIG. 29C is a schematic plan view of a transport system and processingtools in accordance with another exemplary embodiment;

FIG. 30 is a schematic partial elevation of the transport system andprocessing tools in FIG. 29C;

FIG. 31 is another schematic partial elevation of the transport system;

FIG. 32 is another schematic partial elevation of the transport systemin accordance with another exemplary embodiment;

FIGS. 33-34 are respectively schematic plan and elevation views ofanother transport system in accordance with other exemplary embodiments;

FIG. 35 is yet another schematic plan view of a transport system inaccordance with another exemplary embodiment;

FIGS. 36A-36C are respectively bottom perspective, elevation and bottomplan views of a transport device in accordance with another exemplaryembodiment;

FIG. 36D is another bottom plan view of a transport device in accordancewith another exemplary embodiment;

FIG. 36E is a schematic cross-sectional view of a portion of a compliantkinematic coupling;

FIGS. 37A-37D are respectively a perspective, end and side elevations,and top plan views of a tool loading station in accordance with anexemplary embodiment;

FIG. 37E is a plan view of another tool load station in accordance withanother exemplary embodiment;

FIG. 37F is a plan view of still another tool loading station inaccordance with still another exemplary embodiment;

FIG. 37G is a plan view of yet another tool loading station inaccordance with yet another exemplary embodiment;

FIGS. 38A-38C are flow diagrams respectively graphically illustratingdifferent processes in accordance with different exemplary embodiments;

FIG. 39 is cross sectional view of a tool loading station in accordancewith another exemplary embodiment;

FIGS. 40A-40D are schematic cross sectional views of substrate supportsin accordance with different respective exemplary embodiments;

FIGS. 41 and 41A-41B are respectively a schematic perspective view, anend elevation view and a top plan view of a processing system inaccordance with still another exemplary embodiment;

FIG. 42 is a schematic exploded perspective view of sections of thesystem in FIG. 41;

FIGS. 42A-42B are respectively schematic partial perspective views ofanother section of the transport system in FIG. 41 and carrier indifferent positions, and FIGS. 42C-42D are respectively schematicperspective and top plan views of a carrier gripper section of thetransport system in FIG. 41;

FIGS. 43-47 respectively are schematic views illustrating differentselectable arrangements of the system in accordance with differentexemplary embodiments;

FIG. 48 is a schematic elevation view of the system in accordance withstill another exemplary embodiment;

FIG. 49 is a schematic a partial perspective view of the system inaccordance with yet another exemplary embodiment;

FIG. 50 is another schematic plan view of a processing system inaccordance with another exemplary embodiment; and

FIG. 51 is a schematic plan view of a transport system in accordancewith another exemplary embodiment;

FIG. 51A is a graph that illustrates the relationship between lot sizeand transport rate.

FIGS. 52-52A are schematic partial plan views respectively showing aportion of the transport system in accordance with other exemplaryembodiments;

FIG. 52B is another partial plan view of the transport system inaccordance with another exemplary embodiment;

FIG. 53 is a schematic plan view of a vehicle of the transport systemshown in FIG. 51; and

FIG. 54 is a schematic end elevation view of the transport system inaccordance with still another embodiment.

FIG. 55 is a schematic end elevation view of a transport system inaccordance with yet another exemplary embodiment,

FIGS. 55A-55D respectively are a schematic partial side perspective viewof the transport system, partial plan views of the transport systemshowing a carrier transported by the transport system in differentpositions, and a side elevation view of an interface portion of thetransport system; and

FIGS. 56-56A respectively are schematic plan view and end elevation viewof a transport system in accordance with yet still another exemplaryembodiment.

FIG. 57 is a schematic elevation view of a carrier in accordance withyet still another exemplary embodiment, and FIG. 57A is a partialschematic view of a portion of a carrier door interface;

FIG. 58 is yet another schematic elevation view of a carrier inaccordance with another exemplary embodiment;

FIGS. 59A-59D are respectively schematic cross sectional views of acarrier to load port interface in accordance with different respectiveexemplary embodiments;

FIGS. 60-62 are partial cross sectional views of a carrier and load portrespectively showing the carrier and load port in three differentpositions;

FIG. 63 is a partial schematic cross sectional view of another carrierto load port interface in accordance with another exemplary embodiment;

FIGS. 64A-E are schematic cross sectional views of carrier to load portinterface in accordance with different respective exemplary embodiments.

DESCRIPTION OF THE EMBODIMENT(S)

Still referring to FIG. 1, the workpiece carrier 200 defines a chamber202 in which workpieces S may be carried in an environment capable ofbeing isolated from the atmosphere exterior to the chamber. The shape ofthe carrier 200 shown in FIG. 1 is merely exemplary, and in alternateembodiments the carrier may have any other desired shape. The carrier200 may be capable of accommodating a cassette 210 inside the chamberfor supporting the workpieces S within the carrier as shown. Thecassette 210 generally has elongated supports 210S (in the embodimenttwo are shown for example) with workpiece support shelves 210Vdistributed thereon to provide a row or stack of supports, or shelves onwhich one or more workpieces may be individually supported as shown. Thecassette may be mounted or otherwise attached to the carrier structure,and will be described in greater detail below. In alternate embodiments,the carrier may not have a cassette, and the workpiece supports may beintegral or formed as a unitary construction with the carrier structure.The workpieces are shown as flat/substrate elements, such as 350 mm, 300mm, 200 mm or any desired size and shape semiconductor wafers, orreticles/masks or flat panels for displays or any other suitable items.The carrier may be a reduced or small lot size carrier, relative toconventional 13 or 25 wafer carriers. The carrier may be configured tocarry a small lot with as few as one workpiece, or may be configured tocarry small lots of less than ten workpieces. Suitable examples ofreduced capacity carriers, similar to carrier 200, are described andshown in U.S. patent application Ser. No. 11/207,231, filed Aug. 19,2005, titled “Reduced Capacity Carrier and Method of Use’, incorporatedby reference herein in its entirety. Suitable examples of interfacesbetween the carrier, similar to carrier 200, and processing tools (e.g.semiconductor fabrication tools, stockers, sorters, etc.), and transportsystems are described and shown in U.S. patent application Ser. No.11/210,918, filed Aug. 23, 2005, titled “Elevator Bases Tool Loading andBuffering System”; and Ser. No. 11/211,236, filed Aug. 24, 2005, titled“Transportation System”, both of which are incorporated by referenceherein in their entirety. Another suitable example of a carrier, withfeatures similar to carrier 200, is described and shown in U.S.application Ser. No. 10/697,528, filed Oct. 30, 2003, titled “AutomatedMaterial Handling System” and also incorporated by reference herein inits entirety. As may be realized, a reduced size carrier, similar tocarrier 200, allows reduction of work in process in the FAB as theworkpieces forming smaller lots may be immediately (upon completion ofprocessing at a given workstation) transported to following workstationsin the FAB without waiting for completion of processing of otherworkpieces as would occur in larger lots. Though the features of theexemplary embodiments are described and shown with specific reference tosmall capacity carriers, the features of the exemplary embodiments applyequally to any other suitable carrier, such as carriers capable ofhousing 13, or 25, or any other desired number of workpieces therein.

Referring still to FIG. 1, in the exemplary embodiment, carrier 200 maybe shaped to hold the workpieces in a vertical (i.e. Z axis) stack.Carrier 200 may be a bottom or top opening or bottom and top openingcarrier. In the exemplary embodiment shown, top and bottom are disposedalong the vertical or Z axis, though in alternate embodiments top andbottom may be oriented along any other axis. Top and bottom openings,which will be described in greater detail below, means that theopening(s) 204 of the carrier (though which workpieces S moved in andout of the chamber 202, defined by the carrier) are substantiallyaligned with the planar surface of the workpieces held in the carrier(in this embodiment substantially orthogonal to Z axis). Carrier 200 aswill also be seen below, generally has a casing 212 with a base and aclosable or removable door. When closed, the door may be locked andsealed to the base. The seal between door and base may allow the chamber202 to be isolated from the exterior atmosphere. The isolated chamber202 may hold any desired isolated atmosphere, such as clean air, aninert gas, or may be capable of holding a vacuum. The door may be openedto allow workpieces to be loaded/unloaded from the carrier. In theexemplary embodiment, door means a removable or removed portion when thecarrier is opened to access the workpieces/workpiece support shelvestherein. In the exemplary embodiment shown in FIG. 1, casing 200generally has a generally recessed or hollow portion (referred tohereafter as the shell) 214 capable of receiving the workpieces therein,and a wall (cap/cover, etc.) 216. As will be described below, eitherwall 216, or shell 214 may operate as the carrier door. The wall andshell are mated to close the carrier, and are separated to open thecarrier. In the exemplary embodiment, the shell and wall may be metal,such as an aluminum alloy, or stainless steel made by any suitableprocess. The wall or shell or both may be one piece members (unitaryconstruction). In alternate embodiments, the carrier casing may be madeof any other suitable materials including suitable non metallicmaterials. Cassette 210 may be mounted to the wall 216, though inalternate embodiments the cassette may be mounted to the shell. Mountingof the cassette to either the shell or door may be selected tofacilitate ease of removal of the cassette, or substrates therein fromthe carrier when the door is opened. Though in the embodiment shown wall216 is located on top of the shell, in alternate embodiments the carriercasing may have a configuration with the shell on top and wall on thebottom. In still other embodiments, the shell may have a removable wallboth on top and bottom (i.e. carrier with top and bottom openings). Inother alternate embodiments, the removable wall may be located on alateral side of the carrier. In the exemplary embodiment, the door maybe a passive component (for example, substantially without moving partsor components to effect closing and opening between door and carrier andbetween door and tool interface as will be described further below).

Referring now to FIG. 2A, carrier 200 is shown positioned at a tool portinterface 2010 of a suitable processing tool. The processing tool may beof any desired type, for example a sorter, stocker, or a tool capable ofone or more processes, such as material deposition, lithography,masking, etching, polishing, metrology, or a tool with one or moreprocess modules or chambers such as a load lock. The processing tool mayhave a controlled atmosphere, at least in part, and the tool interface2010 allows loading/unloading of workpieces between tool and carrier 200without compromising the controlled atmosphere in tool or carrier 200.In the exemplary embodiment, the port interface 2010 may generally havea port or opening 2012, through which substrates may be loaded into theprocessing tool, and a door, cover or removable portion 2014 closing theport. In alternate embodiments the removable portion may block theopening in part. In FIG. 2A, the port door 2014 is shown in closed andopen positions for example purposes. In the embodiment shown in FIG. 2A,the carrier 200 may be bottom loaded (i.e. moved in Z direction) tointerface with the tool port 2012 as will be described below. FIG. 2Ashows top wall 216 operating as the door for carrier 200. For example,wall 216 may be connected to the port door 2014 and removed in unisonwith removal of the port door, for example into the tool, to open thetool port interface. Removal of the wall 216, causes removal of thecassette (mounted thereon) and workpieces thereon from the carrier (foraccess by a workpiece transport/robot). Referring again to FIG. 1, theconfiguration of cassette 210 with opposing supports 210S, provideaccess areas 210A, 210B on more than one side of the cassette (in theexemplary embodiment two sides) which workpiece robot(s) (see also FIG.2A) may load/unload workpieces onto the cassette shelves. In alternateembodiments the carrier may have any desired number of workpiece accessareas. The access areas may be arranged symmetrically around theperimeter of the carrier, or may be disposed in an asymmetricconfiguration. In the exemplary embodiment shown in FIG. 2A, the toolmay have more than one workpiece handling robot 2016A, 2016B to accessfor example the workpieces V in the more than one access areas 210A,210B. In alternate embodiments, the tool may have more or fewerworkpiece transport robots. Multiside robot access to the cassette mayallow workpiece hand off between robots at the cassette. Also,multisided robot access to workpieces delimits the orientation of thecarrier when transported or interfaced to tool port. Accordingly, thecarrier 200 may be mated to the tool interface in more than oneorientation relative to the tool interface. The carrier is closed byreturning the port door to its closed position which returns the carrierwall 216 to mate with shell 214.

Referring to FIG. 2B, there is shown the interface of carrier 200 with atool port interface 2010′ in accordance with another exemplaryembodiment. In this embodiment, the shell 214 of the carrier may operateas the door. In the embodiment shown the tool port door 2014′ may have ashape generally conformal to the carrier shell, to surround and sealaround the shell in order to prevent exposure inside the tool interiorto contamination on the outside of the shell. In the exemplaryembodiment, the carrier 200 may be top loaded, (i.e. moved down along(−) Z direction) such as when the carrier is being lowered from anoverhead transport system. To open the carrier 200, the port door ismoved down (direction (−)Z), for example into the tool interior,simultaneously removing the shell 214 from the carrier. This may bereferred to as bottom opening the carrier, in that the carrier door here(i.e. shell 214) is located on the bottom and opens the carrier bydownward movement. The opening of the carrier, exposes the workpieces inthe cassette, which remain with wall 216. In this embodiment, the robot(similar to robot(s) 2016A, 2016B in FIG. 2A) may be provided withdegree of freedom in Z axis to access the vertically spaced cassetteshelves or workpieces therein. The robot may have a mapper (not shown)thereon. In alternate embodiments, the shell 216 may have an integralmapper, such as a through beam mapper allowing mapping of the cassetteon removal of the shell. FIGS. 2A-2B illustrate that carrier 200 may beboth top and bottom opening. In other alternate embodiments, the shelland wall orientation may be reversed (shell on top of wall) and thecarrier may be top opening in a similar but mirror image to FIG. 2B(i.e. lifting shell up) and bottom opening in a manner similar butopposite to FIG. 2A (i.e. lowering wall down).

Referring again to FIG. 1, as noted before the wall 216 and shell 214may be passive structures, without movable elements, such as locks,which have the potential for generating contamination by actuationwithin the tool or container clean space. For example, the wall andshell may be magnetically locked to each other. Magnetic locks forexample, may have permanent or electromagnetic elements 226, 228 or acombination thereof may be positioned as desired in wall 216 and shell214 to lock and release wall and shell. The magnetic locks may forexample have a reversible magnetic element that is switched (i.e. toopen or close) by passing a charge through the reversible element. Forexample, the wall 216 may include magnetic elements 228 (for exampleferrous material) and the shell 214 may have a magnetic switch elements226 actuated to lock and unlock the wall and shell. In the exemplaryembodiment shown in FIGS. 2A, 2B, the magnetic elements in the wall, andthe operable magnets in the shell may be configured to allow cooperationwith magnetic locks 2028′, 2026′ in the port door interface 2010, 2010′so that locking the carrier door (either wall or shell, see FIGS. 2A-2B)to the port door causes unlocking of the carrier door from the rest ofthe carrier. In alternate embodiments, the magnetic locks between walland shell may have any other desired configuration. In the exemplaryembodiment shown in FIG. 23 the carrier may include mechanical couplingelements 230, such as actuated pins, piezo coupling devices or shapememory devices to engage mating coupling features 2030 on the portinterface and interlock the carrier to the port interface. In theexemplary embodiment, the devices are shown located in the wall portion,but in alternate embodiments the devices may be locked in the shell. Asmay be realized from FIG. 24, the actuable devices are enclosed in thesealed interface between the removable wall portion and port doortrapping potential particulates, that may arise by operation of thedevices therein. The passive carrier and carrier door provide a clean,washable carrier that is vacuum compatible.

As noted before, the carrier door and base (i.e. wall 216 and shell 224)may be sealed to isolate the carrier chamber 202. Also, when the carrieris interfaced with the port of a tool, (for example a load port module),the carrier door and base may each have sealing interfaces forrespectively sealing the carrier door (i.e. wall 216 or shell 214 inFIG. 1) to the port door and the carrier base to the port. Further, theport door may have a seal interface to the port.

FIGS. 3A-3C show a carrier 200′, similar to carrier 200, beinginterfaced to tool port 2220 in accordance with an exemplary embodimentwhere the respective seal interfaces (221′ carrier door to carrier, 222′carrier to port, 223′ port door to port and 224′ port door to carrierdoor) form a combined seal 222′ with what may be referred to forconvenience as a general X configuration (seen best in FIG. 3B). In theexemplary embodiment shown, the carrier seal interfaces are shown at thetop opening for example purposes, and in alternate embodiments whereinthe carrier has multiple openings (similar to opening 204 shown in FIG.1, (e.g. top and bottom) sealing interfaces may be provided at eachopening. As may be realized, the general X configuration is merely aschematic representation of the sealing interface surface and inalternate embodiments the sealing interface surfaces may have anysuitable arrangement, for example the seal interface surfaces may becurved. The generally X shaped seal configuration defines multiple sealinterfaces (e.g. 221′-222′) with substantially zero (0) trapped volumebetween the interfaces. Hence, opening of any sealed interface will notresult in a release of contaminants into the space opened on opening ofthe seal interface. Moreover, in other alternate embodiments the sealmay have any desired orientation (e.g. the seal interfaces beingoriented horizontally or vertically in a general+pattern). In theexemplary embodiment, the carrier 200′ is illustrated as a top opening(wall 216′ is door opened by lifting upwards similar to the embodimentillustrated in FIG. 2A) and the port 2220 is configured for bottomloading (lifter lifts carrier 220′ upwards to dock to tool port) forexample purposes. The shell 214′ in this embodiment may have a sealinginterface 2141′ generally beveled sealing faces 221C′, 222C′. Though thesealing faces 222C′, 221C′ on the shell are shown substantially flat, inalternate embodiments the sealing faces may have inclusive or exclusiveangles or other shapes formed therein for enhanced sealing though thesurface is generally pitched to result in the generally X shape sealconfiguration. The wall 216′ of the carrier in this embodiment hassealing interface 216I′ oriented (in the exemplary embodiment shown inFIG. 3A, beveled) generally to define sealing faces 221CD′ and 224CD′.As seen in FIG. 3A, the respective shell and wall sealing faces 221C′,221CD′ are generally complementary defining seal interface 221′ whenwall and shell are closed. The faces 221C′ on the carrier interface 214′form a general wedge providing a guide for the wall 216′ when beingseated onto the shell (see for example FIG. 3C). Also, in the exemplaryembodiment the carrier door to carrier seal interface 221′ may bepositioned so that the weight of the wall 216′ acts to increase sealingpressure on the interface. As may be realized, the cassette andworkpieces supported from the wall 216′ in this embodiment aid insealing the carrier door to carrier. As seen in FIGS. 3A-3B, sealingfaces 222C′ and 224CD′ are disposed to complement the sealing faces222P′, 224PD′ respectively on the port 2220 and port door 2214. FIG. 3Bshows the carrier 200′ docked to the port 2220, and seals 221′, 224′closed. Closure of seals 222′, 224′ seals off and isolates all exposedsurfaces (i.e. surfaces exterior of controlled or isolated chambersinside the carrier or tool) with potential contamination from theinterior/chambers of the tool and carrier. As seen best in FIG. 3B, thegenerally X shape seal 220′ provides for optimal cleanliness as it formswhat may be referred to as a substantially zero lost volume interface.This as noted before means that the seal geometry of seal 220′ does notgenerate substantial pockets or spaces having exterior surfaces that areexposed (i.e. become interior surfaces) when either the carrier door orthe port door is opened. This is best seen in FIG. 3C, wherein removalof the port door 2214, thereby removing the carrier door 216′ does notcause exposure of any previously unsealed/exterior surfaces to thecarrier/process tool interiors.

As seen in FIG. 3C, top opening of the carrier door results, in thisembodiment, in the carrier chamber 202′ being located under the raisedcassette supported from the wall 216′. The carrier chamber 202′ is incommunication with the tool interior, that may have a forced aircirculation system (not shown), which may cause a general venturi flowwithin the carrier chamber. In this embodiment, the circulatory air flowwithin the carrier chamber is located below the workpieces on the raisedcassette (hanging from wall 216′) with minimum potential for depositionof particulates disturbed by the circulation (which settle down awayfrom the workpieces above). In the exemplary embodiment shown in FIGS.3A-3C, the carrier 200′ may be raised, to interface with and dock withthe port 2220 by a suitable lifting device LD. Suitable registrationfeatures LDR may be provided on carrier and lifting device to positionthe carrier on the device and hence position the carrier relative to theport. In alternate embodiments the carrier may be held at the port inany suitable manner. The carrier door 216′ may be locked to the portdoor 2214 via a magnetic lock, mechanical interlocks (e.g. positioned inthe sealed interface between doors) or vacuum suction generated in thesealed interface between doors. The port door 2214 may be opened/closedby a suitable device that may be capable of indexing the cassette(similar to cassette 210 in FIG. 1) past a desired mapping sensor (notshown).

Referring now to FIG. 4, there is shown a carrier 300 in accordance withanother exemplary embodiment, Carrier 300 is generally similar butinverse to carrier 200 with the shell 314 on top of wall 316. Similar tocarrier 200, carrier 300 may be either top (shell operates as door) orbottom (wall operates as door) opening. In the exemplary embodimentshown, the carrier 300 may have integral transport components 300M. Forexample, the carrier shell (or wall) 314, 316 may have transport motivesupports such as rollers or air bearings and a reactive member capableof being motivated by a drive or motor to cause the carrier to be selftransportable (i.e. without using an independent transport vehicle)within the FAB. FIG. 4 illustrates the carrier 300 positioned at aloading port 3010 (generally similar to port 2010 described before) forexample purposes. In the exemplary embodiment shown, the carrier 300 maybe top loaded onto the port interface. The carrier door 316 may bepositioned against or adjacent (to form an interface with) the port door3014, and the shell 314 may interface the port 3012. Carrier 300 andport interface may also have a three, four or five way “cross” type (orzero lost volume) seal similar to the general X seal 220′ shown in FIG.3B. FIG. 4A shows a cross sectional view of the seal 320 in accordancewith one embodiment. In the exemplary embodiment seal 320 may be a fourway seal for a bottom opening configuration but otherwise generallysimilar to seal 220′.

FIG. 4B shows another cross-section of the interface between carrier andport, and the seal therebetween in accordance with another exemplaryembodiment. In this embodiment, seal 320′ is substantially similar toseal 320. FIG. 4B further shows that the shell interface 3141′ may havesupporting flanges/features 326′, 328′. Flange 326′ in this embodimentmay operate wall 316′, for example the flange may overlap a portion ofthe carrier door (though in the embodiment shown the feature defines adoor contact surface, in alternate embodiments, the feature may notcontact the door) and locate a magnetic lock 326M′ to hold the wall 316′to shell 314′ when the carrier door is closed. Further, feature 326′ mayoverlap magnetic lock 3040′ in the port door 3014. The magnetic lock3040′ in the port door may operate for locking the wall 316′ to the portdoor 3014′ for carrier door removal. The position of the carrier shellfeature 326′ may enable the activation of the port door lock 3040′(locking wall 316′ to the port door) and for example cause substantiallysimultaneous unlocking/deactivation of the wall 316′ to shell 314′ lock.Conversely, upon closing of the port door 3014′, unlocking/deactivationof the port door lock 3040′ may cause the magnetic latch 326M′ betweenwall 316′ and shell 314′ to lock. In the exemplary embodiment, exteriorfeature 328′ on the shell may engage a locating/centering feature 3012C′of the port 3010′ to locate the carrier when seated. The shape ofexterior feature 328′ illustrated in FIG. 4B is merely exemplary, and inalternate embodiments the carrier may have any desired locatingfeatures. As noted before, the X configuration of seal 320′ mayeliminate purging the seal interface prior to opening the carrier doorbecause the seal interface may have substantially zero purge volume. Inalternate embodiments, (see for example FIG. 4B), the port may include apurge line 3010A. The purge line 3010A may be on any of the sealinterfaces or between them. FIG. 4C shows another cross section of thecarrier to tool port interface in accordance with another exemplaryembodiment. The carrier to port interface has seal 320″ generallysimilar to seal 320 described before. In this embodiment, the carriershell 314″ may have a support 328″ for seating the carrier 300″ on theport without loading the port door 3014″ (i.e. supporting the carrier300″ on the port without distributing carrier weight onto the port door3014″) with the carrier door (wall) 316″. Sealing contact at port doorto carrier door seal 321″ remains substantially constant when openingand closing the carrier door.

FIGS. 5A-5C illustrate a carrier 300A, similar to carrier 300, mated toa tool port in accordance with another exemplary embodiment. Carrier300A in this embodiment may be top opening and bottom loaded (in thedirection indicated by arrow +z in FIG. 5A). Carrier shell 316A mayoperate as the carrier door. The seal interface 320A, seen best in FIG.5B is what may be referred to as a three way seal (with substantiallyzero purge or lost volume, similar to seal 320, 220 described before),with a general Y configuration (interface 321A, wall to shell, interface322A wall to port, interface 323A port 3012A to port door 3014A). Inthis embodiment, the port door 3014A may be generally conformal to theshell 316A. For example, shell 316A may be nested in the port door3014A. In the exemplary embodiment, the fit and placement of the shell316A and port door 3014A minimizes the volume at the interface inbetween. A seal (not shown) may be provided between shell 316A and portdoor to seal the interface therebetween. As seen in FIG. 5B, the portdoor, 3014A in this embodiment, may have a vacuum port 3010V to purgethe port door to carrier door interface volume.

Referring again to FIGS. 2A-2B, the carrier to port interface is shownaccording to still other exemplary configurations. Interface 220, 220′is substantially similar in the exemplary embodiments shown in FIGS. 2A,2B (bottom load/top opening, top load/bottom opening respectively). Sealinterface 220, 220′ may be a four way seal with a general “cross” or Xconfiguration (interface 221 wall 216 to shell 214, interface 222 shell214 to port, interface 223 port 2012 to port door 2014 and interface 224port door to wall 216). As seen in FIG. 2A, in this embodiment sealinterfaces 222, 224 may be positioned (e.g. vertically) substantiallyparallel to direction of relative motion of interfacing surfaces (suchas during loading of the carrier, and during closing of the port door).In other words, movement of the carrier or carrier door to closedposition does not generate sealing closure. In this embodiment, one ormore of the faces forming seal interfaces 222, 224, for example, may beprovided with actuable seals such as inflatable seal, piezo actuatedseal or shape memory members to actuate the seal sections and close theseal interface without substantial rubbing contact at the sealinterface. The seal configurations described are merely exemplary.

Referring again to FIG. 1, carrier shell 214 may have external supports240 for handling the carrier. Supports 240 are shown, for example ashandles, but may have any suitable form. In the exemplary embodiment,supports 240 may be located on opposite side of the shell as far apartas desired to optimize handling stability of the carrier. In alternateembodiments more or fewer supports may be provided. Referring now toFIG. 6A, carrier shell 220A may have a perforated or recessed member,membrane or filter 260A located proximate the bottom of the shell. Theperforations or recesses in the member are sized and shaped to mitigateor reduce the strength of venturi or vortex flows induced in the shellwhen the carrier door is open. In alternate embodiments the venturi orvortex flow mitigation elements may be located in any other suitablelocation in the carrier. Carrier 200A is shown with the shell on bottomfor example purposes, and in alternate embodiments the carrier may be ontop. Further flow straightening spaces and/or vanes (not shown) may beprovided within the tool interior to aid maintaining substantiallysmooth/laminar flow over the workpieces when positioned inside the tool.FIG. 6B shows a carrier 200B in accordance with another exemplaryembodiment. The carrier 200B may have a thermal regulator 250 formaintaining the workpieces within the chamber at a different temperaturethen ambient temperature. For example, the carrier shell or wall 214B,216B may have a thermoelectric module connected thermally to theworkpieces, such as via the cassette supports, to heat/raise thetemperature of the workpieces over ambient. Higher workpiece temperaturethan ambient drives particles and water molecules away from theworkpiece via thermophoresis, preventing contamination when workpiecesare out of carrier, or the carrier door is opened. In alternateembodiments, any other desired thermal regulator may be used such asmicrowave energy. In other alternate embodiments, an electrostatic fieldmay be generated around each workpiece to repel contamination by watermolecules and particulates.

Referring now to FIGS. 1A-1B, in the exemplary embodiment the cassette210 (see also FIG. 1) may have nested shelves 210V for 360° positiverestraint of the workpiece supported by the shelf. Each shelf 210V maybe formed by one or more shelf seats or supports 210C. As seen in FIG.1A, in the exemplary embodiment the cassette shelf supports 210C may belocated so that the workpiece is generally straddled by the supports.Each shelf 210V may have a raised surface to form a perimeter constraintfor the workpiece S seated on the shelf. The raised surface may beinclined (relative to the vertical) to form a locating guide 210L forseating the workpiece S. The seating surface of the shelf 210V may bepitched (relative to the bottom surface of the workpiece, forming forexample a pitch angle of about 1° to the workpiece bottom surface) toensure contact with the bottom of the workpiece for example within theperimeter exclusion zone. In alternate embodiments, the workpieceshelves may have any suitable configuration defining passive workpiecerestraints. In other alternate embodiments, the shelves may not havepassive workpiece restraints.

Referring now to FIGS. 7A-7B, the carrier 200C, in accordance withanother exemplary embodiment which is similar to carrier 200 shown inFIG. 1, is shown respectively in closed and opened positions. Cassette210B in this embodiment is capable of variable height. When the carrier200B is closed, cassette 210B may be at a min height, and when thecarrier door (e.g. wall 216B) is opened, the cassette may be expanded toa maximum height. The pitch between workpiece/shelves of the cassette isincreased when cassette expands from min to max height thereby allowingmin carrier height, with maximum space between workpieces when accessed.In this embodiment, the cassette supports 210SB may have a generalbellows configuration. The supports may be made for example of aluminumsheet, or any other suitable material (e.g. shape memory material),allowing sufficient flexibility without articulated joints. As shown,the cassette supports may be supported at the top to the carrier wall216B. Top opening of the carrier (removing wall 216B as shown in FIG.7B) or bottom opening (removing shell 214B similar to that shown in FIG.2B) causes the cassette (bellows) supports 210SB to expand undergravity. The cassette bellows is compressed by closing the carrier door.As seen in FIG. 7C, the bellows 210SB may have workpiece supports 210VBon which the workpieces rest. In the exemplary embodiment, the workpiecesupports 210VB may be shaped, relative to adjoining portions 210PB ofthe bellows, to remain in a substantially constant radial position(hence avoiding relative radial movement between workpiece and workpieceseat) when the bellows expands/collapses. As may be realized, thebellows cassette may be collapsed so that the workpieces in the cassetteare actively clamped between adjacent pleat section 210PB of thebellows. As may be realized, the upper clamping portions may contactworkpiece along its peripheral edge. As seen in FIG. 7B, in theexemplary embodiment a through beam mapper 2060B, or other suitabledevice in the tool or carrier may be provided to determine the locationsof the workpieces S when the cassette is expanded. The workpiece robot(not shown) may also have a sensor for detecting proximity of workpieceto ensure proper positioning for workpiece pick.

As noted before, the carrier with passive carrier door and seal issuitable for direct interface to a vacuum capable chamber such as a loadlock. FIG. 8 shows a carrier 200′ (top opening) to be mated directly toa port interface 4010 of a vacuum capable chamber (referred to forconvenience as load lock) 400 in accordance with another exemplaryembodiment. Carrier 200′ shown in FIG. 8 may be generally similar tocarrier 200, 300 described before. The load lock, in the exemplaryembodiment, has an indexer 410 that operates to open/close the port door4014, and hence open/close the carrier door (in this embodiment top wall216′) and raise/lower cassette 210′. In the exemplary embodiment, theindexer 410 may be configured to provide the load lock chamber with alow or minimal Z-height. For example, the indexer 410 may be positionedexterior to the load lock chamber 400C and arranged alongside the loadlock chamber to reduce overall height of chamber and load lock. In theexemplary embodiment, the indexer 410 may have a drive section 412 and acoupling section 414. In the embodiment shown, the drive section 412 mayhave an electro-mechanical drive system with for example a motor drivingbelt or screw drive to raise/lower shuttle 416. Coupling section 414 inthe exemplary embodiment, may be a magnetic coupling that couples theshuttle 416 on the drive section to the port door 4014. The port doormay for example have magnets (permanent, or electromagnets) or magneticmaterial located thereon forming the interior portion 414I of themagnetic coupling 414. The magnetic portion 414I of the door 4014 mayalso lock the port door to the port frame 4012. For example, the portframe 4012 may have suitable magnets (similar to magnets 2028′ in FIG.2B) arranged to operate with the magnetic portion/magnets 414I on theport door and lock the door and port when the door is in its closedposition. In the exemplary embodiment, the magnetic lock elements in theport frame may operate with the magnetic coupling portion 414I on thedoor 4014. In alternate embodiments the magnetic coupling between doorand drive, and magnetic lock between door and frame may have anysuitable configuration. As seen in FIG. 8, the chamber walls 400Wisolate the drive section 412 from the interior of the chamber 400C. Inother exemplary embodiments (see also FIGS. 18-19), the drive section412′ may be linear motors (e.g. linear induction motors, LIM) thatoperate on a reactive portion 414I′ of the port door 4014′ to effectmovement of the port door. The LIM may be located exterior to thechamber walls and isolated from the chamber interior. In the exemplaryembodiment shown in FIGS. 18-19, the drive may include magnetic materialsections 4122′, or permanent magnets forming fail safe locks to hold theport door 4014′ in the open position in the event of power loss to thechamber. In alternate embodiments, suitable accumulators may beconnected to the drive to allow desired control for lowering the portdoor to the closed position. As may be realized from FIGS. 8 and 18-19,the seal between port door and port frame, in the exemplary embodimentis located so that door weight contributes to sealing the interface.

In the exemplary embodiment shown in FIG. 8, the respective section 414Iof the magnetic coupling may also lock the port door 4014 and carrierdoor 216′ to each other. For example, the carrier door may have suitablemagnets (e.g. permanent magnets) or magnetic material 228′ positioned tocooperate with the coupling section 414I (e.g. may includeelectromagnets, or magnets with variable magnetic field) when activatedto lock port and carrier doors to each other. In the exemplaryembodiment, the port door motion may be guided by a guide that is alsoisolated from the chamber. For example, in the embodiment shown, abellows 400B connects the port door to the chamber walls and isolatesthe port door movement guide 4006 from the chamber. The guide in thisembodiment has generally telescoping sections. The telescoping guide isshown as made from hollow cylindrical telescoping sections for examplepurposes, and may have any suitable configuration in alternateembodiments. In other alternate embodiments, the indexer may have anyother desired configuration. For example, suitable indexing motors maybe located in the chamber walls, but isolated from the chamber interiorsuch as disclosed in U.S. patent application Ser. No. 10/624,987, filedJul. 22, 2003, and incorporated by reference herein in its entirety,capable of effecting controlled movement of the port door withoutmechanical guides for the port door. The bellows 400B may be pressurizedto assist port door closure. The bellows may also house umbilicalsystems such as vacuum line, and power/signal lines connected to theport door. In the exemplary embodiment, the port door may have a portPD10 connected to a vacuum source forming the chamber pump down port aswill be described further below.

Referring now to FIG. 9, there is shown a carrier 300′ on a vacuumchamber 400′ in accordance with another exemplary embodiment. In theexemplary embodiment shown, the carrier 300′ may be a bottom openingcarrier (similar for example to carrier 300 described before, see alsoFIG. 3). In the exemplary embodiment, the port door 4014′ may be loweredinto the chamber when opened. The indexer (not shown) may be similar tothat shown in FIGS. 8, 18-19 but arranged to move the port door down.The chamber and port door may have magnetic locks 4028′, 4026′ forlocking the door in the closed position to the chamber frame. In theexemplary embodiment the port frame may have one or more coil elements4028′ (defining what may be referred to as the frame side portion of themagnetic locks). The coil element(s) 4028′ may be positioned as desiredand may generate a magnetic field that operates on door lock components4026′. The magnetic lock components 4026′ on the door may be permanentmagnets or magnetic material. In the exemplary embodiment, the coilelements 4028′ are shown located in the chamber for example purposes. Inalternate embodiments, the coil elements may be located outside. Thechamber walls, isolated from the chamber interior. The coil elements maybe fixed or stationary relative to the frame. Field strength may bereduced when desired to reduce magnetic forces in the magnetic lock andease movement of the port door. In alternate embodiments, the coilelements may be movable, for example mounted to the shuttle of the drivesystem and may form part of the magnetic coupling between port door andindexer. In alternate embodiments, the magnetic locks may be similar tothose for locking the carrier door to the carrier described before. Thepermanent magnets or magnetic material 4026′ on the port door 4014′ thateffect magnetic locking to the frame, may also provide coupling to theindexer similar to that shown in FIG. 8. The chamber in the embodimentshown in FIG. 9 may also have a bellows and port door guide similar tothat shown in FIG. 8. The bellows may be pressurized to assist raisingthe port door and maintain in closed position, especially when carrierdoor and cassette are seated on the port door. In alternate embodiments,the chamber may have a bellows without a port door guide therein. Vacuummay be connected to the port door to effect chamber pump down throughthe port door to carrier door interface. Thus, as in the embodimentshown in FIG. 8, the chamber pump down port, in the exemplaryembodiment, may be located in the port door.

Referring again to FIG. 8, in the exemplary embodiment load lock chamberpump down may be performed for example with the carrier interfaced tothe chamber port and the port door moved by the indexer 410 from itsclosed position. As may be realized from FIG. 8, in the exemplaryembodiment pump down of the load lock chamber, via vacuum port PD10 inthe port door, may be through the carrier door 216′ to port door 4014interface. The suction flow of chamber/carrier gas through the carrierdoor to port door interface generates a negative pressure on theinterface preventing inadvertent escape of contaminants into thechamber. FIG. 10 illustrates load lock chamber pump down through theport door 5014 in accordance with another exemplary embodiment. In thisembodiment, purge of the port door to carrier door space 5430, and ofthe carrier chamber 202 may be performed prior to load lock chamber pumpdown. For example, purge gas may be introduced into space 5430 byapplying vacuum and cracking a port door to port seal 5223 (or withsuitable valving). The carrier 200 may be purged by cracking the carrierdoor 216 allowing load lock chamber 5400 gas to enter the carrier, oragain by suitable valving. For example, a gas supply from the chamber(shown in phantom in FIG. 10) may be provided to the carrier tointroduce a desired gas species in the carrier 200. As seen in FIG. 10A,which illustrates the load lock chamber 5400 and carrier 200 with theport door and carrier door moved to the open position the load lockchamber 5400 may have a vent (or gas species supply) 5440 disposed asdesired in the load lock walls, to vent the load lock chamber.Accordingly, the purge line may, in the exemplary embodiment, be usedfor purging, and venting of the chamber may be performed independent ofthe carrier door to port door interface.

FIG. 11 illustrates an exemplary embodiment where the carrier door 316Aand port door 6414 have respective mechanical “failsafe” locksrespectively locking the carrier door to carrier 3140 and port door toport 6412 or chamber 6400D. The carrier 314D, carrier door 316D, port6412 and port door 6414 may be passive (no articulated locking parts).In this embodiment, the indexer may be capable of both Z axis indexingof the port door and of rotating the port door (for example about the Zaxis) for engaging/disengaging the lock tabs on the port door andcarrier door. In alternate embodiments, Z axis movement and rotation ofthe port door may be provided via different drive shafts. FIGS. 12A-12Brespectively show bottom views of the carrier shell 314D and the carrierdoor 316D. FIGS. 13A-13B respectively show top plan views of the port6412 in the (load lock) chamber 6400 and the port door 6414. In theexemplary embodiment, the lower surface of the carrier shell hasengagement tabs/surfaces 360D, that are engaged by engagement surfaces362D on the carrier door 316D. As may be realized,engagement/disengagement between engagement surfaces 360D, 362D may beeffected via rotation of carrier door relative to the carrier 314D.Rotation of the carrier door is imparted by the port door 6414 as willbe described below. In alternate embodiments the engagement surfacesbetween door and carrier may have any desired configuration. The carrierdoor 316D may have a male/female torque coupling feature 365Dcomplementing a torque coupling member on the carrier door 6414T. In theexemplary embodiment shown, the port 6412 and port door 6414 may haveinterlocking or engagement surfaces generally similar to the engagementfeatures of the carrier and carrier door. As seen best in FIGS. 13A,13B, the port may have engagement surfaces 6460 (for example projectinginwards), and the port door 6414 may have complementing engagementsurfaces 6462 to overlap and engage port surfaces 6460. As may berealized, in the exemplary embodiment the engagement surface 3600, 3620on the carrier, and the engagement surfaces 6460, 6462 on the port arelocated relative to each other to allow simultaneousengagement/disengagement between carrier and carrier door, and port andport door when the port door is rotated.

FIG. 14 illustrates load lock chamber 400E and indexer 6410E and carrier300E. In the exemplary embodiment the indexer may be locatedsubstantially axially in series with the load lock chamber. Similar topod 200, 300, 3000, pod 300E in the exemplary embodiment shown in FIG. 4may be a vacuum compatible top or bottom opening pod with featuressimilar to those described before. Chamber 6400E may be similar to thechambers described previously. FIG. 15 shows a load lock chamber andcarrier 300F having a reduced pump down volume configuration. In theexemplary embodiment shown, the carrier door 316F may have top 350F andbottom 321F door to carrier shell 314F seals. The bottom seals 3270F(similar for example to seals 221) engage the shell 314F when thecarrier door is closed, as shown in FIG. 15. The top seals 350F sealagainst the carrier shell when the carrier door is opened (for exampleseal 350F may seat and seal against carrier seat surface 351F). The topseal 350F isolates the carrier chamber from the load lock chamber, hencereducing the pump down volume when pumping the load lock chamber tovacuum.

FIGS. 16A-16B show a carrier 300G and load lock chamber 6400Grespectively in docked and undocked positions in accordance with anotherexemplary embodiment. Carrier 300G has a bottom wall 316G, annularsection 314G and a top wall 314PD. In this embodiment the annularsection 314G or one or more portions thereof may operate as a carrierdoor. The top and bottom walls 316G, 314PD may be fixed together and themovable section 314G, defining the door, may have seals 350G, 321G bothtop and bottom for respectively sealing to the top and bottom walls316G, 314PD. Load lock chamber 6400G may have an open port 6402G throughwhich the carrier 300G may be nested into the load lock chamber as seenin FIG. 16B. The load lock chamber 6400G may have a recess 6470G forlowering the carrier door 314G to open access to the carrier. The topwall 314PD of the carrier may seal against the load lock chamber portthereby sealing the load lock chamber and allowing pump down of thechamber. A suitable elevator may be provided to raise/lower the carrierdoor 314G. FIGS. 17-17C, show another top sealing carrier 300H and loadlock chamber 6400H in accordance with another exemplary embodiment. Thecarrier 300H may have a top sealing flange 314H and side opening 304H(along a carrier edge for loading/unloading of workpieces). In theexemplary embodiment, the carrier top sealing flange 314H seats andseals against the rim 6412H of the chamber port as shown best in FIG.17B. The carrier door 314DR may be opened by radial outward androtational motion indicated by arrow 0 in FIG. 17C. The carrier openingis aligned with a slot valve in the load lock chamber. Although theexemplary embodiments have been described with specific reference to aload lock chamber, the features described are equally applicable to aload port chamber such as shown in FIG. 18. The interior of the loadport chamber may have a controlled atmosphere, but may not beisolatable.

Referring to FIGS. 29A and 29B, there is shown a schematic plan view ofan automated material handling system 10, 10′ in accordance with anotherexemplary embodiment. The automated material handling system 10, 10′shown for example, in FIGS. 29A and 29B generally includes one or moreintrabay transport system section(s) 15, one or more interbay transportsystem section(s) 20, bay queue sections 35, transport sidings or shuntsections 25 and workpiece carriers or transports. The terms intrabay andinterbay are used for convenience and do not limit the arrangement ofthe transport system 10110′ (as used herein inter generally refers to asection extending across a number of groups, and intra refers generallyto a section extending for example within a group). The transport systemsections 15, 20, 25, 35 may be nested together (i.e. one transport loopwithin another transport loop) and are generally arranged to allow thehigh-speed transfer of semiconductor workpieces, such as for example,200 mm wafer, 300 mm wafers, flat display panels and similar such items,and/or their carriers to and from, for example, processing bays 45 andassociated processing tools 30 in the processing facility. In alternateembodiments, any suitable material may be conveyed in the automatedmaterial handling system. The transport system 10 may also allow for theredirection of workpieces from one transport section to any anothertransport section. An example of an automated material handling systemfor transporting workpieces having interbay and intrabay branches can befound in U.S. patent application entitled “Automated Material HandlingSystem” having Ser. No. 10/697,528 previously incorporated herein byreference in its entirety.

The configurations of the automated material handling system 10, 10′shown in FIGS. 29A and 29B are representative configurations, and theautomated material handling system 10, 10′ may be disposed in anysuitable configuration to accommodate any desired layout of processingbays and/or processing tools in a processing facility. As can be seen inFIG. 29A, in the exemplary embodiment the interbay transport sections 15may be located on one or more side(s) of and connected to each other byany number of transport sections 20, corresponding for example to one ormore processing bay(s) 45. In alternate embodiments the outer or sidetransport sections may be intrabay sections, and the sections traversingin between may be linking the intrabay sections to groups or arrays ofprocessing tools within a bay. The interbay transport sections 15 ofFIG. 29A, in the exemplary embodiment, may also be connected by across-shunt 50 that allows the movement of a workpiece transportdirectly between interbay transport sections 15 without passing througha processing or fab bay 45. In yet other alternate embodiments, thetransport sections 15 may be connected to each other by additionalintrabay transport sections (not shown). In other exemplaryembodiment(s), such as shown in FIG. 29B, the interbay transport section15 may be located between any number of processing bays 45, henceforming for example a generally center isle or a transport centralartery between the branch sections serving bays or tool groups 45. Inother alternate embodiments, the intrabay transport section may form aperimeter around and enclose any number of processing bays 45. In yetother alternate embodiments, there may be any number of nested loopsections such as for example N number of systems, such as system 10 or10′ as shown in FIGS. 29A and 29B, connected generally in parallel bytransport sections that directly connect each of the interbay transportsections 15. In still other alternate embodiments, the transportsections 15, 20 and processing tools may have any suitableconfiguration. In addition, any number of intrabay/interbay systems maybe joined together in any suitable configuration to form nestedprocessing arrays.

The interbay transport section 15, for example may be a modular tracksystem that provides for the movement of any suitable workpiecetransport. Each module of the track system may be provided with asuitable mating means (e.g. interlocking facets, mechanical fasteners)allowing the modules to be joined together end to end duringinstallation of the interbay transport sections 15. The rail modules maybe provided in any suitable length, such a few feet, or in any suitableshape, such as straight or curved, for ease of handling duringinstallation and configuration flexibility. The track system may supportthe workpiece transport from beneath or in alternate embodiments, thetrack system may be a suspended track system. The track system may haveroller bearings or any other suitable bearing surface so that theworkpiece transports can move along the tracks without substantialresistance over the rollers. The roller bearing may be tapered or thetracks may be angled towards the inside of a curve or corner in thetrack to provide additional directional stability when the workpiececontainer is moving along the track.

The intrabay transport sections 20 may be a conveyor based transportsystem, a cable and pulley or chain and sprocket based transport system,a wheel driven system or a magnetic induction based transport system.The motor used to drive the transport system may be any suitable linearmotor with an unlimited travel capable of moving workpiece containersalong the intrabay transport sections 20. The linear motor may be asolid state motor without moving parts. For example, the linear motormay be a brushed or brushless AC or DC motor, a linear induction motor,or a linear stepper motor. The linear motor may be incorporated into theintrabay transport sections 20 or into workpiece transports orcontainers themselves. In alternate embodiments, any suitable drivemeans may be incorporated to drive the workpiece transports through theintrabay transport system. In yet other alternate embodiments, theintrabay transport system may be a pathway for trackless wheeledautonomous transport vehicles.

As will be described below, the intrabay transport sections 20 generallyallow for uninterrupted high-speed movement or flow of the workpiecetransports along the path of the intrabay transport sections 20 throughthe use of queue sections and shunts. This is highly advantageouscompared to conventional transport systems that have to stop the flow ofmaterial when a transport container is added or removed from a transportline.

As noted before, in the exemplary embodiment, the intrabay transportsections 20 may define processing or fab bays 45 and may be connected tothe interbay transport section(s) 15 through queue sections 35. Thequeue sections 35 may be located for example on either side of theinterbay or intrabay transport sections 15, 20 and allow a workpiece orworkpiece container to enter/exit the intrabay transport sections 20without stopping or slowing down the flow of material along either theinterbay transport sections 15 or the flow of material along theintrabay transport sections 20. In the exemplary embodiment, the queuesection 35 are schematically shown as discrete sections from transportsections 15, 20. In alternate embodiments the queue section, or thequeue paths between transport sections 15, 20 may be formed integral tothe transport sections but defining discrete queue transport pathsbetween transport sections. In alternate embodiments the queues may bepositioned on the interbay and intrabay sections as desired. An exampleof a transportation system having a travel lane and an access or queuelane, allowing selectable access on and off the travel lane withoutimpairment of the travel lane, is described in U.S. patent applicationentitled “Transportation System” with Ser. No. 11/211,236 previouslyincorporated herein by reference in its entirety. The intrabay transportsections 20 and the queue sections 35 may have track systems that aresubstantially similar to that described above for the interbay transportsections 15. In alternate embodiments, the intrabay transport sectionsand the queue sections tying intra and inter transport sections may haveany suitable configuration, shape or form and may be driven in anysuitable manner. As can best be seen in FIG. 29A, in the exemplaryembodiment the queue sections 35 may have an input section 35A and anoutput section 35B that correspond to the direction of movement R1, R2of the intrabay and interbay transport sections 20, 15. The conventionused herein for example purposes defines section 35A as input to section20 (exit from section 15) and section 35B as exit/output from section 20(input to section 15). In alternate embodiments the travel direction ofthe queue sections may be established as desired. As will be describedbelow in greater detail, workpiece containers may exit the interbaytransport sections 15 via the input section 35A and enter the interbaytransport sections 15 via the output section 35B. The queue sections 35may be of any suitable length to allow for the exiting or entering ofthe workpiece transports on and off the transport sections 15, 20.

The intrabay transport sections 20 may extend within corridors orpassages connecting any number of process tools 30 to the transportsystem 10, 10′. The intrabay transport sections 20 may also connect twoor more interbay transport sections 15 to each other as shown in FIG.29A and as described above. The intrabay transport sections 20 are shownin FIGS. 29A and 29B as having an closed loop shape however, inalternate embodiments they may have any suitable configuration or shapeand may be adaptable to any fabrication facility layout. In theexemplary embodiment, the intrabay transport sections 20 may beconnected to the process tool(s) 30 through a transport siding or shunt25, which may be similar to the queue section 35. In alternateembodiments, shunts may be provided on the interbay transport sectionsin a similar manner. The shunts 25 effectively take the workpiecetransports “off line” and have for example input sections 25A and outputsections 25B corresponding to the direction of travel R2 of the interbaytransport sections 20 as can be seen in FIG. 29A. The shunts 25 allowthe workpiece transports to exit and enter the intrabay transportsections 20, through the input and output sections 25A, 25B,substantially without interrupting the substantially constant velocityflow of workpiece transports on the intrabay transport sections 20.While in the shunt 25, the workpiece container may, for example, stop ata tool interface station that corresponds to the location of the processtool station 30, so that the workpieces and/or the container itself maybe transferred into the process tool load port or any other suitableworkpiece staging area by or through any suitable transfer means, suchas for example, an equipment front end module, sorter or any othersuitable transfer robot. In alternate embodiments, workpiece transportsmay be directed to desired shunts to effect reorder (e.g. reshuffling)of the transports on the given transport section.

The switching of the workpiece carriers or transports from and betweenthe different sections 15, 20, 25, 35 may be controlled by a guidancesystem (not shown) connected to a controller (not shown). The guidancesystem may include positioning devices allowing for positiondetermination of the transports moving along the sections 15, 20, 25,35. The positioning devices may be of any suitable type such ascontinuous or distributed devices, such as optical, magnetic, bar codeor fiducial strips, that extend along and across the sections 15, 20,25, 35. The distributed devices may be read or otherwise interrogated bya suitable reading device located on the transport to allow thecontroller to establish the position of the transport on the section 15,20, 25, 35 as well as the kinematic state of the transport.Alternatively, the devices may sense and/or interrogate a sensory item,such as a RFID (rapid frequency identification device), on thetransport, workpiece carrier or workpiece, to identifyposition/kinematics. The positioning devices may also include, alone orin combination with the distributed devices, discrete positioningdevices (e.g. laser ranging device, ultrasonic ranging device, orinternal positioning system akin to internal GPS, or internal reverseGPS) able to sense the position of the moving transport. The controllermay combine information from the guidance system with the position feedback information from the transport to establish and maintain thetransport paths of the transport along and between the sections 15, 20,25, 35.

In alternate embodiments, guidance system may include or have grooves,rails, tracks or any other suitable structure forming structural ormechanical guide surface to cooperate with mechanical guidance featureson the workpiece transports. In still other alternate embodiments, thesections 15, 20, 25, 35 may also include electrical lines, such as aprinted strip or conductor providing electronic guidance for theworkpiece transports (e.g. electrical lines sending a suitableelectromagnetic signal that is detected by a suitable guidance system onthe transports).

Still referring to FIGS. 29A and 29B, an exemplary operation of thetransport system 10, 10′ will now be described. A workpiece container,located for example in a shunt 25 may enter the transport system 10,10′. To maintain the flow of the intrabay transport section 20substantially uninterrupted and moving at a generally constant velocity,the workpiece container may access the interbay transport section 20 viashunt 25. The workpiece transport accelerates within the shunt 25 sothat the transport is traveling the same speed as the flow of materialin the intrabay transport section 20. The shunt 25 allows the workpiecetransport to accelerate, and hence the transport may merge into the flowof the intrabay transport section 20 without hindering that flow orcolliding with any other transports traveling in the interbay transportsection 20. In merging with the intrabay transport section 20, theworkpiece transport may wait in the shunt 25 for suitable headway sothat it may enter the flow of the intrabay transport section freely,without colliding with any other workpiece carriers or transports orcausing reduction in velocity of transports traversing the intrabaysection. The workpiece transport continues, for example, along theintrabay transport section 20 at a substantially constant speed andswitches, with the right-of-way, onto the output queue area or section35B for example to switch an interbay section 15. In one embodiment, ifthere is no room within the output queue section 35B, the transport maycontinue to travel around the intrabay transport section 20 until theoutput queue section 35B becomes available. In alternate embodiments,cross shunts may be provided connecting opposing travel paths of thetransport section, allowing transports to switch between transport pathsto, for example, return to a bypassed station without traveling thewhole loop of the transport section. The transport may wait in the bayoutput queue section 35B for suitable headway, then accelerate and mergeinto the generally continuous constant velocity flow of the interbaytransport section 15 in a manner substantially similar to the mergedescribed above for the intrabay transport section 20. The transport mayfor example continue at a generally continuous speed along the interbaytransport section 15 to a predetermined bay and is switched onto theassociated queue input section 35A for entry to desired intrabay section20. In one embodiment, if there is no room within the input queuesection 35A, the transport may continue to travel around the intrabaytransport section 15 until the input queue section 35A becomes availablein a manner similar to that described previously. The transport may waitin the input queue section 35A for suitable headway and accelerate tomerge onto a second intrabay transport section 20, the second intrabaytransport section 20 again having a continuous constant velocity flow.The transport is switched off of the second intrabay transport section20 and onto the transport shunt 25 where the transport interfaces withthe process tool 30. If there is no room in the shunt 25 for thetransport, due to other transports in the shunt 25, the transportcontinues to travel along the intrabay transport section 20, with theright-of-way, until the shunt 25 becomes available. Because the flow ofmaterial in the interbay transport sections 15 and the intrabaytransport sections 20 is substantially uninterrupted and travels at agenerally constant velocity, the system can maintain a high throughputof workpiece transports between processing bays and processing tools.

In the exemplary embodiment shown in FIG. 29A, the transport may traveldirectly between processing bays via an extension 40 that may directlyconnect the queue sections 35, processing tools, intrabay transportsections 20 or interbay transport sections 15 together. For example, asshown in FIGS. 29A and 29B, extensions 40 connect the queue sections 35together. In alternate embodiments, the extensions 40 may provide accessfrom one processing tool to another processing tool by connecting thetransport shunts, similar to shunts 25, of each of the tools together.In yet other alternate embodiments, the extensions may directly connectany number or any combination of elements of the automated materialhandling system together to provide a short access route. In largernested networks, the shorter path between destinations of the transportcreated by the extensions 40 may cut down traveling time of thetransports and further increase productivity of the system.

In still other alternate embodiments the flow of the automated materialhandling system 10, 10′ may be bi-directional. The transport sections15, 20, 25, 35, 40, 50 may have side by side parallel lanes of traveleach moving in opposite directions with exit ramps and on ramps loopingaround and connecting the opposite lanes of travel. Each of the parallellanes of the transport sections may be dedicated to a given direction oftravel and may be switched individually or simultaneously so that thetravel for each of the respective parallel lanes is reversed accordingto a transport algorithm to suit transport loading conditions. Forexample, the flow of material or transports along the parallel lanes ofa transport section 15, 20, 25, 35, 40, 50 may be flowing in itsrespective direction. However, if at a later time it is anticipated thatsome number of workpiece transports are situated in the facility and aregoing to a location where it would be more efficient to move along oneof those parallel lanes in a direction opposite the current flowdirection, then the travel directions of the parallel lanes may bereversed.

In alternate embodiments, the bi-directional lanes of travel may belocated in stacks (i.e. one above the other). The interface between theprocess tool and the transport shunts 25 may have an elevator typeconfiguration to raise or lower a transport from a shunt to the processtool load port, for example, such as where a shunt having a clockwiseflow of material is located above a shunt with a counterclockwise flowof material. In alternate embodiments, the bi-directional shunts andother transport sections may have any suitable configuration.

FIG. 20 shows a portion of a transport system track 500 of a transportsystem, for transporting carriers between tool stations in accordancewith another exemplary embodiment. The track may have a solid stateconveyor system, similar to that described in U.S. patent applicationSer. No. 10/697,528 previously incorporated by reference. The track mayhave stationary forcer segments cooperating with reactive portionintegral to the carrier shell/casing. The carrier may thus betransported directly by the conveyor. The transport system 500 shown inan asynchronous transport system in which transport of carriers issubstantially decoupled from the actions of other carriers on thetransport system. The track system is configured to eliminatedetermining factors affecting transport rate of a given carrier due toactions of other carriers. Conveyor track 500 employs main transportpaths with on/off branching paths (see also FIGS. 297-298) that routes acarrier away from the main transport path to effect routing changesand/or interface with tool stations (buffer, stocker, etc.) withoutimpairing transport on main transport path. Suitable example oftransport system with branching on/off paths is disclosed in U.S. patentapplication Ser. No. 11/211,236 previously incorporated by reference. Inthis embodiment segments 500A, C, D may have winding sets for A1-Dlinear motor causing movement along the main travel path 500M (this isshown in FIG. 20A). Segment 500B is illustrated for example in FIG. 20as an off/exit to what may be referred to as access path 500S. Thewindings of the forcer in this segment be arranged to provide in effecta 2-D planar motor to allow both motion along main path 500M and whendesired effect movement of the carrier(s) along path 500S (see FIG.20B). The motor controller may be a zoned controller similar to thedistributed control architecture described in U.S. patent applicationSer. No. 11/178,615, filed Jul. 11, 2005 incorporated by referenceherein in its entirety. In this embodiment, the drives/motors may bezoned, efficiently controlled by zone controllers with appropriate handoff between zones. The conveyor 500 may have suitable bearings tomovably support carrier. For example, in segments 500A, 500C and 500D,bearings (e.g. roller, ball may allow 1 degree of freedom movement ofthe carrier along path 500M).

Bearings in segment 500B may allow 2-degree of freedom movement of thecarrier. In other embodiments, bearings may be provided on the carrier.In still other embodiments air bearings may be used to movably supportthe carrier on the track. Guidance of the carriers between path 500M anddirection onto path 500S may be effected by suitable guide system suchas steerable or articulated wheels on the carrier, articulated guiderails on the track, or magnetic steerage as shown in FIG. 20B.

FIG. 20A illustrates an exemplary transport element 500A of system 500.The exemplary embodiment shown illustrates a segment with single travellane or path (e.g. path 500M). As seen in FIG. 20A, in the exemplaryembodiment the segment has linear motor portion or forcer 502A andsupport surface(s) 504(A) for motive supports on the transport. As notedbefore, in alternate embodiments the transport segment may have anyother desired configuration. In the exemplary embodiment, guide rails506A may be used to guide the transport. In alternate embodiments, thetransport segment may have magnets or magnetic bearings in lieu of railsfor transport guidance. An electromagnet on the carrier may be used toassist decoupling the carrier from the track. FIG. 20B illustratedanother transport segment of the transport system 500 in accordance withanother exemplary embodiment. Segment 500A′ may have multiple travellanes (for example intersecting lanes similar to segment 500B shown inFIG. 20) or substantially parallel main travel lanes (similar to paths500M) with switching therebetween. As seen in FIG. 20B, in the exemplaryembodiment, the travel lanes (similar to paths 500M, 500S) are generallydefined by the 1-D motor sections 502A1 and corresponding carrier motivesupport surfaces/areas 504A′. The intersection or switch between thetravel lanes is formed by an array of 2-D motor elements capable ofgenerating desired 2-D forces on the transport to effect traversebetween travel lanes 500M′, 500S′.

FIG. 21 shows an intersection, or turn segment of the conveyor transportsystem in accordance with another exemplary embodiment. In the exemplaryembodiment shown, the transport segment 500A″ defines multiple travellanes 500M″, 500S″ that intersect. The travel lanes are generallysimilar to lane 500M (see FIG. 20A). In the exemplary embodiment, thetransport vehicle may traverse a given lane 500S″, 500M″ until generallyaligned with the intersecting lane. When aligned, the 1-D motor of thedesired lane commences to move the transport along the intersectinglane. In alternate embodiments, the intersection may not be oriented at90° FIG. 20C shows the bottom of the carrier 1200 and the reactiveelements therein. As may be realized the reactive elements may bearranged to coincide with the orientation of the respective forcersections at the intersection (see for example FIG. 21). This allows thecarrier to change tracks at the intersection substantially withoutstoppage. FIG. 20D shows the reactive elements 1202FA positioned on apivotal section of a carrier 1200A that may be rotated to desiredposition in accordance with another exemplary embodiment. FIG. 22 showsa track segment 500H′″ with a beside track storage location 500S′″,generally similar to the intersection shown in FIG. 21. FIGS. 23-23Ashow track segments 500, with cutouts or openings 15000 for lift arms ofa carrier lift or shuttle, (not shown) as described further below. Inthe exemplary embodiment, the openings 15000 allow side access to thecarrier for a bottom pick of the carrier from the conveyor track. FIG.24 shows a track segment 2500A with the forcer (such as a linear motor)2502A located offset from carrier/track centerline indicated by arrow2500M.

FIGS. 25A-25B show a linear motor conveyor 3500 (having grounded forcersegments and reaction elements embedded within the carrier 3200) fortransporting substrates within a semiconductor FAB. In the exemplaryembodiment shown, the conveyor 3500 may be inverted (e.g. carrier issuspended from and is located below conveyor), as shown such that thecarrier is accessible from directly below. The conveyor 3500 mayotherwise be similar to transport system segments 500A, 500A″, 500A′″described previously. In the exemplary embodiment, a magnetic retentionforcer 3502 may be employed to maintain the coupling between theconveyor 3500 and carrier 3200. This force may arise from the linearmotor coils (e.g. in a linear synchronous design) and/or via separateelectromagnets and/or permanent magnets (not shown) providedspecifically for that purpose. Coupling and decoupling of the carrier tothe conveyor is rapid and may be achieved without moving parts (e.g., anelectro-magnetic switch). Failsafe operation may be assured via fluxpath and/or passive mechanical retention features between carrier andconveyor.

In the exemplary embodiment intersections and branch points (i.e.,merge-diverge locations similar for example to segment 500B in FIG. 20)may be achieved with coil switching. In alternate embodiments,turntables or other routing devices, may be used to transfer carriersbetween travel paths of the conveyor 3200.

In the exemplary embodiment the carrier 3200 may be arranged such thatthe reaction elements are on the top, and the substrates are accessedfrom the bottom of the carrier. In the exemplary embodiment, carrier3200 may have a magnetic platen located to cooperate with the forcer ofconveyor 3500. The carrier platen=, or platen section may includerollers, bearing or other motive support surfaces (e.g. reaction surfacefor air bearings in the conveyor). The platen may also include anelectromagnetic coupling allowing the container portion of the carrierto decouple from the platen portion that may remain connected to theconveyor when the workpiece container portion is loaded on a processingtool 3030.

In the exemplary embodiment, to load a tool, the conveyor 3200 positionsa carrier at the tool loadport, and for example a dedicated verticaltransfer mechanism 3040 may be used (see also FIGS. 26A-26B) to lowerthe carrier from the conveyor elevation to the (controlled environment)loading interface 3032 of the tool 3030. The vertical transfer devicemay also be used as an indexer, thereby positioning the wafers foraccess by a wafer-handling robot. A suitable example of a verticaltransfer device is described in U.S. patent application Ser. No.11/210,918, filed Aug. 25, 2005 and previously incorporated by referenceherein.

In alternate embodiments, the conveyor may be a powered-wheelaccumulating conveyor positioned in an inverted arrangement and having asuitable magnetic attractive force to hold the carrier on the conveyorwheels. In other alternate embodiments, the general arrangement may beinverted such that the conveyor is below the loadport, the carrier hasreaction features on the top.

FIGS. 26A-26B show other examples of direct lower/lift carriers fromtransport system to load port/tool interface. In the exemplaryembodiments shown in FIGS. 26A-26B, the carriers may have a reactionplaten that may be integral to the carrier. In other embodiments theplaten, as noted before, may be detachable from the carrier, for exampleremaining on/coupled to the conveyor when the carrier is removed. Insuch a case, each platen in the transport system corresponds in asubstantially 1:1 relationship to the carriers in the FAB.

FIG. 27 illustrates a carrier 4200 having a conveyor vehicle hybridconfiguration in accordance with another exemplary embodiment. Carriervehicle(s) 4200 may be provided for automated conveyance of payloads(such as carriers containing semiconductor substrates). The vehicles maycarry stored energy for self-propulsion, a steering system, at least onemotor-powered drive wheel, sensors for odometry and obstacle detection,and associated control electronics. In addition the vehicles areoutfitted with one or more reaction elements (similar to magneticplatens described before) that can cooperate with stationary linearmotor forcer segments of a conveyor 4500, similar to conveyor system 500(see also FIG. 20).

In the exemplary embodiment, when a vehicle(s) 4200 is traveling alongthe path (similar to paths 500M, 500J) defined by one or more forcersegments, the drive motor may be disconnected from the drive wheel(s),and the vehicle be passively urged along the path via electromagneticcoupling with the reaction elements in the conveyor 4500. If the storedenergy device (e.g. batteries, ultracapacitors, flywheel, etc.) withinthe vehicle needs to recharge, the motion of the traction wheel(s) alongthe guideway may be used to convert energy from the linear motor to thevehicle storage. In the case of electrical energy storage, this may beaccomplished by re-connecting the vehicle drive motor to be used as agenerator with suitable monitoring and conditioning electronics. Such“on-the-fly” charging has the benefit of simplicity and ruggedness, andsuch an arrangement affords significant flexibility and fault tolerance.For example, vehicle(s) 4200 may be capable of driving autonomously pastfailed conveyor segments, around obstacles or between work areas notserviced by a conveyor (see FIGS. 27A,27B). The number and length ofconveyor forcer segments may be tailored to an operating scheme such asa conveyor for interbay transport, and using autonomous vehicle motionwith the bay for example. Self-directed steering may be used forflexible route selection. Self-directed cornering could be used toeliminate curved forcer segments. High-speed travel may be effectedalong conveyor runs and, if desired, separated from operators by safetybarriers. Conveyor sections may be used for long runs, such as links toadjacent FABs. Conveyors may be used for grade changes, mitigating thedifficulties encountered by vehicles using exclusively stored energy.

FIG. 28 shows another example of an integrated carrier and transportvehicle. In contrast to conventional vehicle-based semiconductorautomation, in which vehicles are dispatched to transport workpiececarriers, within a FAB, in the exemplary embodiment each carrier 5200 isa vehicle. The integrated carrier/vehicle 5200 in the exemplaryembodiment may be similar to vehicle 4200 described before. In alternateembodiments, the carrier vehicle may have any desired vehicle features.In the exemplary embodiment vehicle 5200 may include integral carrier5202 and vehicle 5204 portions. The carrier 5202 is shown as front/sideopening in FIG. 28 for example purposes. In alternate embodiments, thecarrier may be top opening or may have any other suitable workpiecetransfer opening. The vehicle may drive directly to the loadport wherework pieces are to be transferred, or may be engaged by anotherautomation component such as a tool buffer. Substantially permanentlyfixing the carrier 5202 and vehicle 5204 eliminates the time waiting fora free vehicle to be dispatched when a lot transfer is desired, as wellas the associated deliver time variance. Further, the carrier vehicle5200 eliminates “empty-car” moves and hence may reduce the total trafficon the transport network improving the system capacity. In alternateembodiments, the carrier and vehicle may have a coupling for detachingcarrier from vehicle. Though vehicles in the system may be apportionedto carriers in a 1:1 relationship to eliminate delays in carriertransport awaiting for vehicles, system knowledge in a suitablecontroller may be used to allow separation in limited instances (e.g.repair/maintenance or either vehicle or workpiece carrier sections).Otherwise, the carrier and vehicle remain an integral unit duringtransport or when engaged to a tool loading station or other automationcomponent of the FAB.

FIG. 29C shows a plan view of a horizontally arrayed buffering system6000 that may interface between a conveyor system 500 (or any otherdesired carrier transport system) and tool stations 1000 in accordancewith another exemplary embodiment. The buffering system may be locatedunder tool stations or portions thereof or above the tool stations. Thebuffering system may be positioned away (i.e. below or above) fromoperator access ways. FIG. 30 is an elevation view of the bufferingsystem. FIGS. 29C-30 show the buffering system located on one side ofconveyor 500 for example purposes. The buffering system may be extendedto cover as large a portion of the FAB floor as desired. In theexemplary embodiment shown, operator walkways may be elevated above thebuffering system. Similarly, the buffering system may be extendedanywhere in the FAB overhead. As seen in FIGS. 29C-30, in the exemplaryembodiment the buffering system 6000 may include a shuttle system 6100(which may have suitable carrier lift or indexer) capable of at least3-D movement and an array of buffer stations ST. The shuttle system maygenerally include guide system (e.g. rails) 6102 for one or moreshuttle(s) 6104 capable of at least 2-D traverse over the guide system.The arrangement of the shuttle system illustrated in FIGS. 29C-30 ismerely exemplary and in alternate embodiments the shuttle system mayhave any other desired arrangement. In the exemplary embodiment, theshuttle system shuttles or interfaces between the conveyor 500, bufferstations ST and tool loading stations LP (see FIG. 29C). The shuttle(s)6102 are capable of traversing between horizontally disposed conveyor500 (for example via an access lane 602 between the segments 600 of theconveyor) and buffer storage ST or loading locations LP on the toolstations to shuttle carriers 200 therebetween. As seen best in FIG. 30,in the exemplary embodiment, the shuttle(s) 6104 may include an indexer6106 for picking/placing the carrier on the conveyor 600, or bufferstations ST or tool loadport LP. The buffering system may be configuredin modular form allow the system to be easily expanded or reduced. Forexample, each module may have corresponding storage location(s) ST andshuttle rails and coupling joints for joining to other installed modulesof the buffering system. In alternate embodiments, the system may havebuffering station modules (with one or more integral buffering stations)and shuttle rail modules allowing modular installation of the shuttlerails. As seen in FIG. 29C, the access lane(s) 60L of the conveyor 500may have shuttle access ways allowing the shuttle indexer to access thecarrier through the conveyor lane. FIG. 31 shows elevation of abuffering system 6000 communicating with the merge/diverse lane of theconveyor 500. In the exemplary embodiment, the buffering system shuttle6104 may access carriers directed onto the access lane of the conveyors.Stops (or lack of accessways similar to lanes 602 in FIG. 29C) may limitthe shuttle from accessing or interfering with the travel lane of theconveyor. FIG. 32 is yet another elevation showing multiple rows ofbuffering stations. The buffering system may have any desired number ofbuffering stations in any desired number of rows. Shuttle traverse (inthe direction indicated by arrow Y in FIG. 32) may be adjusted asdesired by modular replacement of traverse guide 61087. In otheralternate embodiments, the buffering stations may be arrayed in multiplehorizontal planes or levels (i.e. two or more levels that may bevertically separated (to allow carrier height pass through betweenlevers). Multilevel buffering may be used with reduced capacitycarriers. FIG. 33 shows another plan view of a buffering system with aninterface to a guided vehicle carrier V. FIG. 34 shows an elevation viewof an overhead buffering system 7000 otherwise similar to the under toolbuffering system 6000 described before. The overhead buffering system7000 may be used in conjunction with the under tool buffering system(similar to system 6000). The overhead buffering system is showninterfacing with an overhead conveyor 500. In alternate embodiments, theoverhead system may interface with a floor conveyor system or floorbased vehicles. Suitable control interlocks (e.g. hard) may be providedto prevent horizontal traverse of shuttle with lowered payload that mayimpinge walkway vertical clearances. Top shields over the walkway may beused for preventing suspended loads from crossing through walkway space.

FIG. 35 shows a looped buffering system 8000. The buffering stations STof the system may be movable, mounted on a track 8100 (in the exemplaryembodiment shown as being closed looped) that moves the buffer stationsST between loading position(s) R in which carriers may be loaded intothe buffer stations ST (for example with overhead loading) and loadingstation(s) LP of a tool interface. The tool interface may have anindexer for loading the carrier to the tool station.

Referring now to FIGS. 36A-36C there is shown respectively perspective,side and bottom views of a substrate carrier 2000 in accordance with yetanother exemplary embodiment. The carrier 2000 is a representativecarrier and is shown as having an exemplary configuration. The carrier2000 in the embodiment shown is illustrated as being a bottom openingcarrier for example purposes, and in alternate embodiments the carriermay have any other desired configuration such as top opening, or sideopening. The carrier 2000 in the exemplary embodiment shown in FIGS.36A-36C may be generally similar to carrier 200, 200′, 300 shown inFIGS. 1-3, and similar features are similarly numbered. Carrier 2000thus has a shell or casing 2012 with one or more opening(s) 2004 (onlyone of the opening(s) is shown in FIGS. 36A-36C for example purposes)through which wafer(s) may be transported in/out of the carrier. Thecarrier shell may have removable wall(s) or section(s) 2016 that mayform closure(s) or door(s) for opening and closing the respectiveopening(s) 2004. As noted before, in the exemplary embodiment shown theshell 2012 may have a bottom wall 2016 that is removable in order toopen and close opening 2004. In alternate embodiments any other sectionor wall of the carrier shell may be removable to allow wafer transportin and out of the carrier. The removable sections 2016 may be sealed tothe rest of the casing 2014 in a manner similar to that shown anddescribed before, and the casing may be capable of holding an isolatedatmosphere such as an inert gas, high cleanliness air with a pressuredifferential to ambient atmosphere or vacuum for example. The shell 2014and removable wall(s) 2016 may be passive structure(s) similar to wall216 and shell 214 described before, and may be locked to each othermagnetically for example or any other desired passive lock. In theexemplary embodiment, the wall(s) 2016 may include magnetic elements2016C (for example ferrous material) and the shell 2014 may have amagnetic switch 2014S actuated to lock and unlock the wall and shell.The magnetic elements in the wall, and the operable magnets 2014S in theshell may be configured to allow cooperation with magnetic locks in theport door interface (as will be described further below) so that lockingthe carrier door (either wall or shell, see FIGS. 36A, 36C) to the portdoor causes unlocking of the carrier door from the rest of the carrier.In alternate embodiments, the magnetic locks between wall and shell mayhave any other desired configuration. The metal passive carrier 2000 andcarrier door 2016, 2014 provide a clean, washable carrier that is vacuumcompatible.

In the exemplary embodiment shown in FIGS. 36A-36C, the carrier 2000 isillustrated as configured to carry multiple wafers. In alternateembodiments, the carrier may be sized as desired to carry but a singlewafer with or without an integral wafer buffer, or any desired number ofwafers. Similar to carriers 200, 200′, 300 in the earlier describedexemplary embodiments, carrier 2000 may be a reduced or small lot sizecarrier, relative to conventional 13 to 25 wafer carriers. As seen bestin FIGS. 36A-36B, the carrier shell may have a transport systeminterface section 2060. The transport system interface section 2060 ofcarrier 2000 may be arranged to interface with any desired transportsystem, such as a conveyor system similar to the exemplary embodimentsshown in FIGS. 20-30. For example, the carrier may include reactiveelements, such as ferrous magnetic material pads or members, disposed orconnected to the carrier casing, capable of cooperating with forcersections of a linear or planar motor of the conveyor system transport topropel the carrier along the conveyor. An example of a suitableconfiguration of reactive elements, of a linear or planar motor,connected to the carrier casing is described in U.S. application Ser.No. 10/697,528, filed Oct. 30, 2003 and previously incorporated byreference herein. In the exemplary embodiment shown in FIGS. 36A-36C,the carrier interface section 2060 may also have carrier supportmember(s) or surface(s) 2062 that may interface with the transportsystem to support the carrier from the transport system when the carrieris moving and/or stationary on the transport system. The supportsurface(s) may be non-contact or contact support surfaces and may bearranged on or facing the sides (e.g. surface(s) 2062S) or bottom (e.g.surface(s) 2062B) or any other desired location or facing to stablysupport the carrier from the transport system. The non-contact supportsurfaces, for example may be substantially flat areas, surfaces or pads,connected to or otherwise disposed on the casing and formed by anysuitable means, capable of interacting with air bearings (not shown) ofthe transport system to stably hold the carrier (either on the basis ofthe air bearings alone or in combination with motive forces imparted onthe carrier by the transport system motor; e.g. magnetic forces). Inalternate embodiments, the carrier casing may have one or more (active)air bearing(s) directing air (or any other desired gas) against(passive) transport system structure to provide floating (e.g.non-contact) but stable support of the carrier from the transport systemstructure. In this embodiment, a suitable source of air/gas (e.g. a fanor gas pump) may be connected to the carrier to feed the air bearings ofthe carrier. In other alternate embodiments, the carrier casing and thetransport system may have both active air bearings and passive airbearing surfaces (e.g. lifting air bearings in the transport system andhorizontal guidance air bearings in the carrier). The carrier 2000 mayhave other handling members, flanges or surfaces such as for examplehandling flange 2068 as shown in FIG. 36B.

In the exemplary embodiment, carrier 2000 may have a tool interfacesection 2070 that allows the carrier to interface with the loadingsection (for example a load port) of a processing tool. The processingtool may be of any kind. In the exemplary embodiment, the interface 2070may be located on the bottom of the carrier. In alternate embodiments,the carrier may have tool interfaces on any other desired sides of thecarrier. In still other alternate embodiments, the carrier may havemultiple tool interfaces (e.g. bottom and side) enabling the carrier tointerface in different configurations with tools. The tool interfacesection 2070 of the carrier 2000 in the exemplary embodiment is seenbest in FIG. 36C. The configuration of the tool interface section 2070shown in FIG. 36C is merely exemplary, and in alternate embodiments thecarrier may have a tool interface section having any other desiredconfiguration. In the exemplary embodiment, interface section 2070 mayhave features and generally conforms to the criteria set forth in theappropriate SEMI standards for a carrier (such as SEMI E.47.1 and E57and any other appropriate SEMI or other standard) all of which areincorporated by reference herein in their entirety. Thus, in theexemplary embodiment, carrier interface section 2070 may includekinematic coupling (KC) receptacles, arranged in compliance with thecriteria in SEMI STDS. E.47.1 and E57, for receiving primary and/orsecondary KC pins (not shown) located in conventional load portinterfaces. The carrier interface 2070 may also have a section with oneor more info pads in compliance with the SEMI STDS. for the carrier. Inalternate embodiments, the carrier interface section may not be providedwith one or more of the SEMI specified features (for example, theinterface section may not be provided with kinematic coupling features)but may never the less have reserve areas on the interface side of thecasing corresponding to the such features. In the exemplary embodiment,the carrier interface section 2070 may thus be capable of interfacingthe carrier 2000 to conventional loading interface of conventionalprocessing tools. As may be realized, and is noted before with respectto the previously described embodiments, in order to mate the carrier toa load port coupling the carrier to the process environment (or forexample to maintain a vacuum in the process apparatus), it is desired tomate the carriers so that the carrier interior may be substantiallysealed to the process environment, and what may be referred to asunclean surfaces on the carrier, may be substantially isolated andsealed off from the process environment. As may be realized, thecarrier/load port contact interfaces, for sealing the carrier, such aspreviously described, and the kinematic coupling between carrier andloadport may give rise to an over constrained condition between carrierand loadport. To relax the over constraints, the kinematic couplingbetween carrier and loadport may be compliant allowing repeatablepositioning of carriers on the loadport interface. Coupling compliancemay be actuated with preload from the loadport interface. Referring nowto FIG. 36E, there is shown a schematic cross-section of arepresentative interface portion 2272 of the compliant kinematiccoupling 2072 in accordance with an exemplary embodiment. The couplinginterface portion 2072 may generally have a pin 2274 and grooves ordetent 2276 arrangement, and compliance or flexibility may be providedin one or more desired directions (such as indicated by arrows X, Z) torelax over constraints on the carrier in any desired degrees of freedom(e.g. carrier pitch, roll, yaw). By way of example, the coupling pin2274 may be compliant (such as by spring load, e.g. flexurally mountedgenerally spherical pin, pin made of resiliently flexible material,etc.) The coupling grooves 2276 may also be compliant (such as byflexural mounting, or forming grooves in resiliently flexible materialallowing flexure of the groove surface when compressed under preload.

Moreover, in the exemplary embodiment, the carrier interface section2070 may further be configured to allow non-contact coupling interfaceof the carrier to a loading interface of a processing tool, as will bedescribed in greater detail below.

As may be realized, generally a wafer carrier, such as carrier 2000, maybe located with respect to the process tool for processing. Closealignment of the wafer carrier to the loadport of the tool is desired toautomate the transport of the wafers into the tool. Conventionallocating methods may generally use conventional mechanical couplingsthat contact the bottom surface of the carrier. For example, theseconventional mechanical couplings provide a lead-in or cam to compensatefor gross misalignments and aid in guiding a wafer carrier to thealigned position. Unfortunately, this feature relies on the lead-insurface of a carrier to make sliding contact with the mating pin of aloadport, thereby possibly causing wear and generation of contaminants.A second issue related to the use of conventional mechanical coupling isthe desire for the carrier to be coarsely located within the capturerange of the conventional coupling to function properly. The carriertransport system is responsible for achieving adding to eithercomplexity of the transport system and/or time in effecting properplacement (e.g. retries). Hence, the design of the carrier transportsystem should be sufficiently repeatable to place the carrier within thecapture range of the conventional mechanical coupling or in conventionalapplications the nominally aligned position to prevent wear. Inevitably,the carrier transport system cannot achieve repeatability over manycycles and consequently results in sliding contact instigating particlegeneration. The interface of carrier 2000 may provide the samerepeatability in locating a wafer carrier to the process tool but withthe use of a non-contact (e.g. magnetic) coupling. This capabilityenables the transport system to fully realize a lead-in feature thatloosens the placement tolerances and subsequently speed up the carrierload/unload step. Secondly, all motions to compensate for the placementerror may be performed without physical contact between carrier and loadport eliminating any relative sliding motion for cleanliness.

As seen in FIG. 36C, in the exemplary embodiment the carrier interfacesection 2070 may have a non-contact coupling 2071 for non-contactinterface and coupling of the carrier to a loadport. The non-contactcoupling 2071 may include generally non-contact support or lift area(s)2072 and non-contact coupling section(s) 2074. In the exemplaryembodiment, the lift area(s) 2072 may be substantially flat and smoothsurfaces arranged to cooperate with air bearings of the load port (aswill be described below) to allow controlled and stable lifting of thecarrier by the air bearings in the load port. In the exemplaryembodiment the carrier lift area(s) are passive, but in alternateembodiments the carrier may include one or more active air/gas bearingsto lift the carrier. Referring again to FIG. 36C, in the exemplaryembodiment the lift area(s) 2072 may have three sections that aregenerally similar to each other and distributed on the interfacing (e.g.bottom) side of the carrier casing so that lift acting on the carrierfrom the load port air bearings is generated substantially by thepressure, from air bearings impinging on the lift area(s) sections, andthe resultant lift is substantially coincident with the center of mass(CG) of the carrier. The shape and number of the lift area(s) sections2072 shown in FIG. 36C is merely exemplary and in alternate embodimentsthe lift area(s) may have any desired shape and number. For example, thelift area(s) may be a single continuous (or substantially uninterruptedsection extending around the perimeter of the carrier interface). In theexemplary embodiment, the lift area(s) is located on the carrierinterface 2070 as not to interfere with the SEMI compliant interfacefeatures (e.g. kinematic coupling receptacles, info pads, etc.). Thelift area(s) 2072 may be located as far from the CG as possible withinthe constraints of the interface, and may be sized as desired forgenerating desired pressure distribution and accommodating as large asdesired translational (i.e. x-y plane) misalignment between carrier andload port. In the exemplary embodiment, the lift area(s) 2072 arearranged symmetrically about a single axis (indicated by axis X in FIG.36C, e.g. the bilateral datum axis) but not any other axes of thecarrier interface. Hence, the carrier interface 2070 is polarized sothat non-contact interface with the tool loading interface may beaccomplished in but a single proper orientation. Placement of thecarrier in an incorrect orientation may result in instability of thecarrier lift, that may be sensed by suitable sensors of the transportsystem placing the carrier, or of the carrier itself or of the loadport, and causing a signal to be sent to stop the incorrect placement.The lift area(s) 2072 may also have a desired pitch or bias to aid inproper alignment of the carrier to the load port. In alternateembodiments, the lift area(s) may be movable or tiltable, such as bymechanical, electromechanical, piezoelectric, thermal or any othersuitable means, in order to generate when impinged upon by the airbearing desired horizontal resultant force on the carrier of thevariable magnitude and variable direction to effect alignment betweencarrier and load port.

Still referring to FIG. 36C, in the exemplary embodiment the non-contactcoupling section(s) 074 may have one or more permanent magnet(s)2074A-2074C (three magnets 2074A-2074C are shown for example purposesand more or fewer magnets may be provided in alternate embodiments). Thecoupling magnet(s) 2074A-2074C may be part of the reactive section ofthe transport system linear/planar motor or may be independent of themotor reactive section. The coupling magnet(s) 2074A-2074C may be ofsufficient size to overlap coupling magnets of the load port (as will bedescribed below) for a desired misalignment between carrier and loadport. In the exemplary embodiment shown the coupling magnet(s)2074A-2074C are arranged symmetrically about a single axis (such as axisX in FIG. 36C) but are asymmetric about all other axis of the carrierinterface. Hence, the non-contact coupling section of the carrier ispolarized preventing the carrier from coupling to a load port if thecarrier is not in the desired orientation relative to the load port. Inother words the non-contact coupling of the carrier may nevertheless be“keyed” to the load port for correct orientation and all otherorientations would not be engaged by the coupling and thus would notattempt to load. A suitable sensor(s) may be provided on the load portor carrier, to detect when the carrier may be incorrectly placed on theload port and coupling cannot be properly effected and send a suitablesignal causing the transport system to remove, and if possiblereposition the carrier in the proper orientation. In alternateembodiments, the non-contact coupling sections, and/or the lift area(s)may be arranged symmetrically about multiple axes of the carrierinterface.

Referring now to FIG. 36D, there is shown a bottom view of a carrier2000′ in accordance with another exemplary embodiment carrier 2000′ issubstantially similar carrier 2000 described before and similar featuresare similarly numbered. Carrier 2000′ may have a carrier interfacesection 2070′ with a non-contact coupling 2071′ generally similar tonon-contact coupling 2071 described before with reference to FIGS.36A-36C. In the exemplary embodiment shown in FIG. 36D, the non-contactcoupling section 2074′ may have ferrous magnetic material sections2074A′, 2074B′, 2074C′ (that may be part of or independent of thetransport system motor reactive components in the carrier) in place ofpermanent magnets. The ferrous material sections 2074A′, 2074B′, 2074C′may be of any desired shape such as rectangular, round cylindrical orspherical. Each of the sections 2074A′-2074C′ may be similar to eachother, though in alternate embodiments different shared section definingdesired magnetic coupling and directional characteristics may be used ineach of the sections. The sections may be of sufficient size to bewithin the magnetic field of the load port coupling points andaccommodate a desired initial misalignment between carrier and load portwhen the carrier is initially placed on the load port. The couplingsections 2074A′, 2074B′, 2074C′ may be sized and arranged on the carrierinterface so that the magnetic forces on the carrier bias the carrierinto an aligned position relative to the load port. As seen in FIG. 36D,the coupling sections 2074A′, 2074B′, 2074C′ in the exemplary embodimentmay be distributed on the carrier interface to define a single a singleaxis of symmetry (axis X) and thereby keying the non-contact coupling2071′ of the carrier to allow coupling to the load port in but oneorientation. In alternate embodiments the coupling sections may have anyother desired arrangement.

Referring now to FIGS. 37A-D there is shown respectively a perspective,end, side elevation and top plan view of a tool loading station or loadport 2300 in accordance with another exemplary embodiment. The load portin the exemplary embodiment shown may have a configuration forinterfacing with and loading wafers to and from a bottom opening carriersimilar to carrier 2000, 200, 200′ 300 described previously. Inalternate embodiments, the load port may have any other desiredconfiguration. Load port 2300 may have a suitable mounting interface,such as a SEMI STD. Comprises BOLTS interface, allowing the load port tobe mated to any desired processing tool or work station. For example theload port may be mounted/mated to a controlled atmosphere section suchas and EFEM of a processing tool (as will be described further), or maybe mated to an atmospherically isolated chamber (e.g. vacuum transferchamber) of a processing tool (in a manner similar to that shown in FIG.14) or to an atmospherically open chamber of a processing tool. The loadport in this exemplary embodiment is similar to the load ports describedpreviously. The load port 2300 may generally have a carrier loadinginterface 2302, and loading cavity or chamber 2304 (into which thewafer(s), individually or in a cassette are received from the carrier orreturned to the carrier). The chamber 2304 may be capable of holding anisolated atmosphere (thereby allowing the load port to function as aload lock of the processing tool) or a controlled (highly clean) airatmosphere. The carrier loading interface 2302 may have a loading plane2302L, supporting the carrier when interfaces to the load port, that,unlike conventional load ports, is substantially free of protrusions inthe carrier placement zone. As seen in FIG. 37A, the loading plane mayhave bumpers or snubbers exterior to the carrier placement zone to subcarrier movement in the event of cross misalignment between carrier andload port. The loading interface 2302 of the load port, may have aloading opening and, (or port 2308) (communicating with the loadingchamber 2304) and port door closing the port similar to the load portsdescribed before. In the exemplary embodiment, the port door 2310 may besubstantially flat and level with the loading plane of the loadinginterface. The port door 2310 may be sealed to the port rim in a sealarrangement similar to that described before and shown in FIGS. 4A-4B.As may be realized, when interfaced and coupled to the load portinterface 2302 of the load port, the carrier casing and carrier door aresealed respectively to the load port rim 2308R and the port door 2310with what may be referred to as a substantially “zero volume purge” sealhaving an arrangement similar to that shown in FIGS. 4A-4B. In alternateembodiments the seals between the port rim, port door, carrier casingand carrier door may have any other desired configuration. The port door2310 in the exemplary embodiment may be coupled to the port with passivemagnetic coupling or latch in a manner also similar to that describedbefore. In the exemplary embodiment, the magnetic coupling/latchingelements between the port door and port may be located and configured toactuate the passive magnetic latching between carrier door and casingsimultaneous with the actuation of the latching between port door andport. Thus, for example, unlocking of the port door from the port alsocauses unlocking of the carrier door from the carrier, and locking ofthe port door locks the carrier door to the carrier. In the exemplaryembodiment, the load port may include an indexer 2306 and a purge/ventsystem 2314 similar to that shown in FIGS. 8-14.

Referring also to FIG. 37D, the carrier loading interface of the loadport of in the exemplary embodiment may have a substantially non-contactinterface section 2371 that may cooperate with the non-contact interfacesection 2071 of the carrier 2000, for example for interfacing andcoupling the carrier 2000 to the load port 2300. As seen in FIG. 3710,in the exemplary embodiment, the interface section 2371 may have one ormore air bearings 2372 and a non-contact coupling section 2374. The airbearing(s) 2372 of the load port may be of any suitable type andconfiguration, and may be located for example in a “keyed” arrangement,generally corresponding to the arrangement of the lifting areas 2072 onthe carrier interface. The air bearings 2372 may thus be symmetricallyarranged with respect to the reference datum X that defines thealignment of the carrier 2000 when coupled to the load port. A suitablesource (not shown) of air/gas surprises the air bearings. Suitableregulators (not shown) may be used to maintain desired gas flow from theair bearings. The gas supply and regulators for the air bearings may belocated as desired. For example exterior or interior to the loadingchamber 2304 of the load port, but maybe isolated from the interioratmosphere of the chamber for example, the gas supply 2372S to the airbearings 2372 (see FIG. 37C) may extend within a bellows or otherflexible sealed sleeve to the air bearings that isolates the gas supplyfrom the loading chamber. As a further example, the gas supply to theair bearings may extend in a manner similar to the purge and vent linesshown in FIG. 14 within a bellows seal isolating the indexing device. Inthe exemplary embodiment, the air/lift areas of the carrier may be onthe carrier door, and hence the air bearings 2372 of the load port(located substantially under the lift areas) in the exemplary embodimentmay be located within the bounds of the port door 2310. In alternateembodiments, the air bearings may be located on the port frame or portrim, and the gas supply for the air bearings may be located entirelyexterior to the loading chamber of the load port. In the exemplaryembodiment, the air bearing(s) 2372 may be orifice bearings (having asubstantially localized exhaust) or may be porous media air bearingshaving a distributed substantially uniform exhaust. The exhaust flowfrom each of the air bearing(s) 2372 may be fixed (may remainsubstantially constant) in terms of pressure, mass flow and direction(indicated as substantially vertical by AB in FIG. 37C for exampleonly). In alternate embodiments, the air bearings may have a variableexhaust flow allowing for example changing the exhaust flowcharacteristics (e.g. pressure, mass or direction) to offset movement ofthe carrier relative to the load port and facilitate carrier to loadport alignment. As may be realized, the air bearings 2372 and lift pads2072 on the carrier may be sized in order to provide a desiredmisalignment tolerance band or placement zone for the initial placementof the carrier onto the load port.

Referring now to FIG. 37E, there is shown a plan view of a load port2300′ in accordance with another exemplary embodiment, load port 2300′is similar to load port 2300 and similar features are similarlynumbered. One or more of the air bearing(s) 2372′ in this exemplaryembodiment may have an array of nozzles. The exhaust AB1-AB4 from thearray nozzle may combine to provide a directable resultant exhaust. Byway of example, each nozzle of the array may have an exhaust angledrelative to other nozzle exhaust. The exhaust flow from one or more ofthe nozzles may be fixed or variable. When air nozzles of the array areoperating at full flow, the resultant exhaust has a first desired direct(e.g. substantially vertical). Stopping or reducing the flow through oneor more of the nozzles of the array causes a change in the resultantexhaust direction, resulting in a directional component in the loadingplane. In alternate embodiments, the air bearing nozzle may be movable(e.g. air bearing nozzle mounted on tiltable platform), or capable ofchanging geometry (e.g. by use of piezoelectric materials or sharememory materials) to directionally steel the exhaust. As may berealized, the directional component of the air bearing exhaust in theloading plane imparts impetus of the carrier riding on the air bearingsin the loading plane in the opposite direction of the directionalcomponent of the exhaust, and generates lateral motion of the carrier inthe loading plane.

Referring again to FIGS. 37A-37D, the non-contact coupling section 2374of the load port may comprise magnet sections 2374A-2374C located tocooperate with the magnets 2074A-2074C (see FIG. 36C) or magneticmaterials sections 2074A′-2074C′ of the carrier to define a magneticlockable/unlockable coupling between carrier and load port (such asbetween carrier door 2016 and port door 2310 and, if also desiredbetween carrier casing and load port frame). In the exemplaryembodiment, the magnet sections 2374A-2374C of the load port may also,in cooperation with the magnets 2074A-2074C, or magnetic materialsections 2074A′-2074C′1 of the carrier, form a carrier positioncompensation device capable of adjusting the position of the carrier onthe load portion to achieve desired alignment as will be describedbelow. The arrangement of the magnet sections 2374A-2374C shown in thefigures is merely exemplary, and in alternate embodiments the magnetsections of the load port non-contact carrier coupling section may bearranged/configured in any desired manner. The magnet sections2374A-2374C may be operable magnets to effect a magnetic switch, thatwhen actuated generates a desired magnetic field that biases the magnetor magnetic section in the carrier in a desired direction (such as toeffect locking/coupling of carrier and load port) and/or impartcorrection forces on the carrier). As seen best in FIGS. 37A and 37D,the load port interface in the exemplary embodiment may have anon-contact alignment system 2380 to effect teaching of the carriertransport system the location/position of the load port and enableinitial placement of the carrier onto the load port interface. As notedbefore, the placement zone of the load port is substantially free ofprotrusions, and initial placement of the carrier onto the placementzone is substantially without contact (i.e. no rubbing contact) betweencarrier and load port in the exemplary embodiment. In the exemplaryembodiment shown, the alignment system 2380, may have an array orpattern of registration marks that are capable of being imaged by asuitable sensor. The pattern of marks shown in FIG. 37D is merelyexemplary, and in alternate embodiments any suitable marking pattern maybe used that is capable of being imaged with a suitable sensor anddefines positional information in all desired degrees of freedom. Thesensor (not shown), that may be positioned for example on a carrierholding portion of the transport system, (see for example FIG. 26B) maybe for example a CCD or CMOS imaging sensor capable of imaging thepattern and its spatial characteristics. The image data embodying thepattern may be communicated to a suitable processor that also registersand relates the positional data of the carrier transport to the patternin order to determine the position of the load port placement zone withrespect to the carrier transport and teach the carrier transport saidposition.

In the exemplary embodiment, the carrier 2000 may be placed by thetransport system onto the loading plane that is free of protrusions inthe placement zone 2302P. The placement zone in the exemplary embodimentcan be an area formed by the size of the carrier +/− for example about20 mm with respect to the alignment axis of the load port. The actualplacement error can be any value and is not dependent on the valuesstated, and may be specified in proportion to the compensation mechanismused to position the carrier after placement. Thus, the alignmentrepeatability of this coupling is substantially the same as conventionalcoupling method, while at the same time increasing the allowable carriertransport placement error. Once the carrier is sensed by the load port,a film of air (air bearing) is activated lifting the carrier andeliminating friction between the carrier and load port interface. Atthis point the forces on the carrier are its mass and the relativelocation of the center of gravity to the horizontal datum plane and thelifting force itself. The carrier lift areas interface with the air padson the load port to lift the carrier and establish repeatablepositioning (both angular and transverse) of the carrier to the loadport. The carrier floating on the film of air may now be positioned inalignment with the load port. As noted before, the magnetic coupling canbe used to impart forces on the carrier to translate and rotate thecarrier. Any method other than magnetic can be used to impart forces onthe carrier as long as it is of sufficient stroke and can predict thetarget position. Completing the coupling of the carrier and load port isclamping the two objects together and hold position.

By way of example, and with particular reference to the exemplaryembodiment illustrated in FIGS. 36A-36C, when carrier 2000 is in theplacement zone, the permanent magnet(s) 2074A-2074C overlap magnet(s)2374A-2374C on the load port interface. The air bearing may be energizedand the load port magnetic is activated either electronically or bymechanical means to present the opposite magnetic pole to the carriermagnet. The absence of friction at the interface allows the carrierfreedom to move in X, Y and Theta Z axes until the magnet polesnaturally align but do not make physical contact. Throughout this stepthe air bearing is preloaded by the magnetic force of the magnets in thecarrier and load port. The preload is useful in maintaining control ofthe carrier and increases the stiffness of the air bearing. The airbearing is deactivated for example after a predefined time period or bymeans of sensor feedback, allowing the carrier to lower onto the loadport's port door. The magnets are now in full contact and provide aclamping force to hold the carrier to the port door.

In the exemplary embodiment shown in FIG. 36D the carrier 2000 possessesferrous material pad(s) 2074A and 2074C (see FIG. 36D) of sufficientsize to be within the magnetic field of the load port coupling pointsafter placement (by the carrier transport system). The air bearing maybe activated and the magnets on the load port are activated eitherelectronically or by mechanical means introducing the magnetic field(s)to the carrier ferrous pad(s). The absence of friction at the interfacepermits the attractive force between the magnet and the ferrous pad(s)to translate or rotate the carrier to the aligned position. The airbearing is preloaded by the magnetic force. The preload is useful inmaintaining control of the carrier and increases the stiffness of theair bearing. After a predefined time period or by means of sensorfeedback for example, the air bearing is deactivated for exampleallowing the carrier to lower onto the load ports port door. Themagnetic force on the ferrous pad(s) provide a clamping force to holdthe carrier to the port door.

In accordance with yet another example, the carrier may be driven by adirected air nozzle 2372′ (see FIG. 37E) integrated into the air bearingsurface such as in the exemplary embodiment shown in FIG. 37E. In theembodiment, the air nozzle 2372 may provide a laterally applied pressureto the bottom surface which imparts a motion to the carrier. The motioncan be controlled by the controller energizing the appropriate set ofnozzles to direct the carrier in the X or Y axis until the magnet on thecarrier is aligned to the load port. In the alternate embodiment wherethe array of nozzles is mounted to a platen that rotates/tilts theplaten may be energized to provide the desired direction to the nozzles.The nozzles direct the exhaust opposite of the intended direction ofmotion of the carrier. This action imparts the lateral force totranslate the carrier until alignment of the magnets. Some form ofsensor feedback including for example feedback from the magneticcoupling may be used to detect the actual position of the carrier andcompare to the aligned position. This information may determine whichdirection the carrier should be translated, and how the forces to beapplied to the carrier by the air nozzles. In alternate embodiments, thenozzles and magnetic coupling may be used in combination together toalign the carrier to its desired position.

FIG. 37F shows a plan view of load port interface in accordance withanother exemplary embodiment. Load port 2300″ in this embodiment issimilar to previously described, except the magnet(s) 2374″ positionedin the load port is attached to a movable X-Y stage movement directionsindicated by arrows in FIG. 37E). In this embodiment the carrier isplaced onto the load port and the air bearing is activated the carriermagnet is attracted to the load port magnet coupled to X-Y stage 2374S″.The X-Y stage 2374S″ can be either for example air cylinder, threadlessscrew or electric solenoid and is linear encoded to report thetranslated position. The coupled carrier magnet and load port magnet aredriven back to a learned (aligned) position. At arrival to thedestination the bearing may be deactivated and the carrier lowers to theport door and is clamped. Similarly, this method could be adapted toexisting kinematic coupling approach used whereby each kinematic pin iscoupled to an X-Y stage. In this example, two of the kinematic pins aredriven to align X, Y and theta Z. Although, this would not operatewithin the premise of non-contact it is a viable method to increase thecarrier placement tolerance with minimal wear.

FIG. 37G shows another exemplary embodiment of a similar load port 2300Aexcept the carrier may be driven by a mechanically actuated pusher arm2374M to position the carrier and align the coupling points of thecarrier to the load port. In the exemplary embodiment shown, the loadingplane may be pivotally mounted (as indicated by the arrows R, P) abouttheta X and theta Y. The degree of freedom in combination with an airbearing can be used to tilt the load plane shifting the center ofgravity of the carrier to impart translation in the direction of thepivot angle. This method uses position feedback to intelligently actuatethe load plane in the appropriate carrier direction to align the carrierand load port magnets. Once the carrier is in position, the air bearingmay be deactivated and the carrier is clamped to the port door. Finally,the load plane is pivoted back to the original position to achieveproper alignment to the port for door removal.

As noted before, the environment within a carrier may vary, for exampledepending on the prior process and environment to which the wafer(s) andcarrier interior were subjected. Accordingly, carriers coupled to theload port or loading station may have an environment therein (e.g. gasspecies, cleanliness, or pressure) that is different than theenvironment of the current process. For example, a given process for thewafers of a carrier may employ an inert gas. Accordingly, the interfacebetween the carrier and the load port of the given tool allows thesuitable gas species to be input or vented as desired to minimizepressure differentials or introduction of undesired gas species duringcarrier opening. By way of another example, the tool environment may bevacuum, and the carrier mated to the load port of the tool may beevacuated to a low pressure, via the interface, allowing wafers from thecarrier to be loaded directly to a vacuum load lock. The interfacebetween the carrier and load port and environmental control systemallowing environment matching between carrier and tool may besubstantially similar to that previously described and shown in FIGS.10-10A and 14. Another suitable example of a carrier load port interfaceand environmental matching system is described in U.S. application Ser.No. 11/210,918, filed Aug. 25, 2005 and previously incorporated byreference herein. Referring now to FIG. 38A there is shown a flow chartillustrating a process for matching the environment in a carrier to aload port that may have a different controlled environment. In theexemplary embodiment of FIG. 38A, the carrier and load port may bothhold the same gas species (e.g. same species of inert gas). In thisembodiment, if the carrier is at a higher pressure than the processpressure, the carrier may be vented (via the interface) for example tothe load port chamber (or other suitable plenum) until equilibrium isachieved, and if the carrier is at a lower pressure, then gas from theload port or other suitable supply may be inserted (via the interface)into the carrier until equilibrium is achieved between carrier and loadport/tool environment. In the exemplary embodiment of FIG. 38B, the loadport may have an atmospheric environment (e.g. highly clean air) andequilibrium between carrier and load port may be established for examplein a manner similar to that described before with respect to FIG. 38A.FIG. 38C illustrates the process in an exemplary embodiment where theload port has a vacuum environment. In alternate embodiments in whichthe carrier and load port may have initially different gas species, theinitial environment of the carrier may be evacuated and gas species suchas in the load port may be input (e.g. from the load port) into thecarrier before the door is opened.

Referring again to FIG. 37A, and as noted before, in the exemplaryembodiment the load port has an indexer 2306 that may raise and lowerthe port door 2310 (to open and close the port) and also may raise andlower a wafer cassette from the carrier to the desired height in theload port chamber for wafer processing. The indexer 2306 may be similarto the exemplary embodiments previously described and shown in FIGS. 8,9, 10-10A, 14 and 18, with the indexing mechanism isolated from thevolume/environment occupied by the wafers. In summary, suitable examplesof indexing mechanisms may have the following arrangements:

-   1. Lead Screw with Bellows—this mechanism employs a lead screw    driven by an electric motor which is attached the port plate of the    load port. The portion of the lead screw which enters the clean area    is enclosed by a bellows. The bellows can be of any material such as    metal, plastic or fabric as long as it is generally clean during    operation and can remain flexible without fatigue. The bellows    provides a barrier between the contaminant producing mechanism and    the clean area where wafers are located. The flexible nature of the    bellows provides this isolation throughout the entire stroke of the    actuator. The feedback of the mechanism can be by rotary encoder on    the motor, or lead screw; or by linear encoder along the path of    motion. (see FIG. 14)-   2. Pneumatic cylinder with Bellows—similar to earlier embodiment (1)    except the drive mechanism is by pneumatic cylinder. May be used for    example for movement between two positions; e.g. pod closed and    lowered. (see FIG. 9)-   3. Lead Screw of Pneumatic Cylinder remote drive—similar to prior    embodiment except the drive mechanism is remotely located outside    the wafer volume (see FIG. 10). The port plate of the load port is    attached to the drive with supporting structure. The drive may be    exposed to the clean areas but contamination is controlled through    the airflow path or a labyrinth seal. Use of the airflow entails    placing the drive downstream of the wafers to that contaminants    which might be generated are below the wafer and swept down and away    from the wafer. The addition of a labyrinth or other “no rubbing”    seal can further limit the introduction of particles providing a    solid barrier between the drive and the clean area. Secondarily, the    drive can be remotely located outside the process tool environment    altogether. This places the potentially dirty mechanism in the less    clean FAB environment but uses labyrinth seal to protect the process    tool environment from the less clean FAB. 4. Drive mechanism with    magnetically coupled port plate—this embodiment employs a magnetic    coupling between the port plate and the drive mechanism (see FIG. 8    for example but inverted). The magnetic coupling may operate through    a non-ferrous wall across an air gap permitting the drive to be    isolated outside the clean area. The drive method can be of any type    previously described such as lead screw, pneumatic cylinder or    linear motor. The later could reside inside the clean area because    of its inherent ability to operate cleanly in combination with an    air bearing guide to constrain the direction of motion.

Referring now to FIG. 39, there is shown a cross sectional view of aload port 2300A and carrier 2000A interfaced thereto, and a wafer airflow management system in accordance with another exemplary embodiment.The carrier 2000A and load port 2300A may be respectively similar tocarriers and load ports of previously described exemplary embodiments.In the embodiment shown in FIG. 39, the port door is opened and thecassette is indexed into the load port chamber and positioned forprocessing for example purposes. When the carrier is opened and thewafers are positioned for processing the air flow around the wafers maycontribute to maintaining the cleanliness of the wafers. For example,depending on the process the wafers may remain in the lowered positionfor a lengthy time increasing the risk of particles from within theenvironment depositing on the wafer surface. In addition anycontaminants generated by the load port mechanisms could deposit on thewafer surface without proper airflow. In the exemplary embodiment shown,at least a portion of the airflow inside the process environment may be“captured” and redirected to flow across the wafers. The air is thenexhausted back to the process environment downstream of the wafertransfer plane (WTP). In the exemplary embodiment, the airflow patternpasses horizontally in a parallel direction to the wafer top surface andexits out the back of the wafer cassette. The exhaust routing pulls theair vertically after it exits the cassette and directs it out an exhaustport directed to the floor. This approach is capable of maintaining aclean constant flow or air across the wafer surface while operating in aopen loop or a sealed environment. For example, when the load portoperates in an environment with a process dependent gas species likenitrogen or argon, redirecting existing airflow and depositing back intothe main stream as shown supports a closed loop environment used for acontrolled gas species.

As seen in FIG. 39, in the exemplary embodiment a supply air foil ismounted for example, above the zone where wafers are accessed, to thevertical surface of the process mini-environment. This location is areserved space for FOUP door openers on the existing SEMI E63 standards.The air foil is designed to capture a volume of the existing laminar airflow from the mini-environment and bend the air stream from a verticalto horizontal direction. In the exemplary embodiment, positioned at theback of the wafer cassette when it is lowered interior of the externalskin of the loadport is a diffuser element. The diffuser for example maybe constructed of a solid panel which is partially open depending on theflow characteristics. The diffuser is configured to manage theuniformity of the horizontal airflow as it passes over the wafers whileproviding a pressure differential prior to the air entering the exhaustside of the duct. In the exemplary embodiment, the exhaust side of thecircuit be force inducted to ensure a steady and uniform stream of airacross the wafers. For example, an axial fan mounted internal to theexhaust side duct with the output directed to the process toolmini-environment port. Alternatively, the unit could be used without afan and the configuration of the supply air foil, the diffuser andexhaust ducting may be arranged to ensure stable uniform air flow acrossthe wafers.

Referring now to FIGS. 40A-40D, there is shown schematic cross sectionalviews of wafer restraints of an exemplary carrier in accordance withrespective exemplary embodiments. The exemplary embodiment shown in FIG.40A illustrates a radial clamp wafer restraint. Clamping maybe providedby translating side walls of cassette. Mechanism resides within cassetteand is actuated either by loadport or the pod shell to cassetteinterface (Z axis). In alternate embodiments there may be translatingside wall internal to pod shell. Mechanism resides with pod shell and isactuated either by loadport, pod shell to port door (Z axis of OHT) orpod to cassette (Z axis of loadport). Use of advanced materials foractuation (i.e. shape memory metals or magnetorestrictive etc.). Theexemplary embodiment shown in FIG. 40B illustrates a wafer restraintemploying clamping force directed substantially normal to the wafer topsurface. In the exemplary embodiment, a vertically translating fingerintegral to cassette. Mechanism resides within cassette. Mechanism isactuated either by loadport, pod to port door (Z axis of OHT) or pod tocassette (Z axis of loadport). In alternate embodiments, an off-axistranslating finger integral to pod shell or cassette. Mechanism canreside on either the cassette or pod shell. Finger translates at anoff-horizontal angle to wafer (see FIG. 40C). Mechanism is actuatedeither by loadport, pod shell to port door (Z axis of OHT) or pod shellto cassette (Z axis of loadport). In another exemplary embodiment a 2DOF finger integral to pod shell or cassette. Finger rotates thentranslates vertically to engage wafer (see FIG. 40D). Mechanism isactuated either by load port, pod shell to port door (Z axis of OHT) orpod shell to cassette (Z axis of load port). In alternate embodiments,the wafer restraint in the carrier may have any other suitableconfiguration. For example, the wafer may be wedged between wafer edgecontact supported, such as support fingers on the cassette that form alinear edge contact with the wafer.

Referring now to FIGS. 41-41B, there is shown respectively a schematicperspective view, an end elevation view, and top plan view of arepresentative processing arrangement with processing tools PT and atransport system in accordance with another exemplary embodiment. Theprocessing tools PT are illustrated in an exemplary array such as toolsarrayed in a processing bay of a FAB. The transport system 3000 in theexemplary embodiment may service the tools of the processing bay forexample, the transport system 3000 may be an intra-bay portion of a FABwide transport system. The transport system 3000 in the exemplaryembodiment may be generally similar to a section of the AMHS systemexemplary embodiments described previously and shown in FIGS. 29A-29D.The transport system 3000 may communicate with other (e.g. interbay)portions 3102 of a FAB AMHS system via suitable transport interfacesseen in FIG. 41. As noted before, the arrangement of the processingtools PT in the tool array shown is merely exemplary, with multiple toolrows (in the example two rows R1, R2 are shown, but alternateembodiments may have more or fewer tool rows). In the example shown, thetool rows may be arranged substantially parallel (geometrically, but maybe angled relative to each other) and may define substantially parallelprocess directions. Process direction along different tool rows may bethe same or opposite to each other. Also process direction along a givenrow may reverse so that the process direction along one portion or zoneof the tool row may be in one way and the process direction of anotherportion or zone of the same tool row may be the opposite way. Theprocess tools in row R1, R2 may be distributed to define differentprocess zones ZA-ZC (see for example FIG. 41). Each process zone ZA-ZCmay include one or more process tools in rows R1, R2. In alternateembodiments, a process zone may have tools located in but a single row.As may be realized, the process tools in a given zone may be processrelated, such as having complementing processes and/or having similartool throughput rates. For example tool zone(s) ZA may have tools with ahigh throughput, (e.g. about 500 wafers per hour (WPH)), tools withmedium throughput (e.g. roughly 75 WPH to less than 500 WPH) may belocated in zone ZB, and tools with a low throughput (e.g. roughly 15 WPHto 100 WPH) may be located in zone ZC. As may be realized, the toolsdefining any given zone may not be identical, and one or more toolswithin a given zone may have a throughput or process that may bedifferent than the other tools in the given zone, but a relationship maynevertheless exist between the tools in the zone so that it isorganizationally appropriate, at least with respect to a transportingaspect, to have the tools organized within the same zone. The tool zonesillustrated in FIG. 41 are merely exemplary, and the tool zones may haveany other desired arrangement in alternate embodiments.

As seen in FIG. 41, the transport system 3000 is capable of transportingcarriers to/from tools. The transport system 3000 may be generallysimilar to the transport system in the previously described exemplaryembodiment and shown in FIGS. 29-35. In the exemplary embodiment shownin FIGS. 41-41B, the transport system 3000 may have an overheadconfiguration (e.g. transport system is located above/over the tools).In alternate embodiments, the transport system may have any othersuitable configuration, such as having an underneath configuration (e.g.transport system is located underneath the tools for example similar tothe transport system illustrated in FIG. 30-33). As seen in FIGS.41-41B, the transport system may generally have a number oftransportation sub-systems or sections. In the exemplary embodiment, thetransport system 3000 may generally have a bulk material/rapid transportsection 3100, such as a conveyor section (e.g. similar to thesolid-state conveyor previously described and shown in FIGS. 20-25B orany other suitable conveyor). The conveyor section may extend throughall tool zones, and may transport carriers, for example, at asubstantially constant transport rate without stopping/slowing whencarriers are placed/removed from the conveyor section. The transportsystem 3000 in the exemplary embodiment may also include storagestations/locations 3000S (see also FIG. 41B), shuttle system section3200 with shuttles 3202 capable of accessing one or more storagestations/location (see also FIG. 42), and an interfacing transportsystem section 3300. In the exemplary embodiment, the interfacingtransport system section may be capable of accessing carrierstransported by the bulk transport conveyor section 3100, or at thestorage stations, and transferring the carrier to loading sections ofthe processing tools. In the exemplary embodiment, the storage stations,shuttle system section 3200 and interfacing transport system section maybe formed in selectably installable portions capable of selectableinstallation along the transport system. In the exemplary embodiments,the transport system sections 3100, 3300, 3200 may be modular for easeof installation of the portions of the system sections selected forinstallation in the transport system. The portions of the transportsystem shuttle system, interface system, and storage system sectionsselected for installation along the transport system may correspond tothe zones ZA-ZC of the processing tool. As may be realized, thetransport system 3000 may be configurable to correspond to theprocessing tools or processing tool zones. Moreover, in the exemplaryembodiment the transport system may be configurable in zones TA-TC,generally commensurate with and corresponding to the processing toolzones ZA-ZC. Thus, the transport system may have different zones withdifferent system sections configurations. In the exemplary embodiment,the storage system and shuttle system sections may be configurable ineach zone TA-TC of the transport system. Also, in the exemplaryembodiment, the interface transport system section may be configurablein each zone. The interface transport system, in the exemplaryembodiment may have selectably installable interface transporter (in theexample shown in FIG. 41 gantry) portions 3310, 3320 that may be added,removed and may be installed in a number of different orientations ineach transport system zone TA-TC. The desired interface transport systemportion, may be installed in the transport system zones to provide adesired tool interface and access rate, for example commensurate withthe throughput rate of the process tool of a corresponding tool zoneZA-ZC. As seen best in FIG. 41A, the interface transport system sectionmay have a selectably variable number of transporter travel planes (e.g.some zones TC may have a single interface transporter travel plane, seeFIG. 48, and other zones TA, TB may have more than one transportertravel plane ITC1, ITC2, (see FIGS. 41A, 46). In the zones with multipleplanes, transporters may be capable of traversing past one another.Though two planes are shown, more or fewer transporter planes may beprovided. Although in the exemplary embodiment the transport system isarranged with the travel planes substantially horizontally, in alternateembodiments the transport system may have any other desired arrangementincluding having vertical travel planes for interface transporterbypass.

The Overhead Gantry System (OGS) can be configured for low, medium, orhigh throughput. Changing factor or process capability can be metthrough field reconfigurable modular assemblies. These modularassemblies can be broken for example into three categories; lowthroughput, medium throughput, and high throughput. Arrangement of thevarious modules may be dependent upon many factors such as desired moverate, storage capacity, and distribution of the desired throughput in abay.

Low Throughput:

By way of example, low throughput tools or tool zones can besufficiently accommodated with a single gantry 3310. This configurationmay provide all the desired moves without the use of a “feeder” robot3320 or a shuttling system 3200. The gantry may pick carriers from theintrabay conveyor and transfer to a storage location in addition totransferring carriers from storage to the tool. In order for carriers tobe moved to an adjacent gantry zone, the carrier may be placed on theintrabay conveyor or placed in a storage nest for retrieval by theadjacent gantry. With this configuration one gantry to cross pastanother gantry until the intervening gantry has moved. In situationswhere two or more gantries are working side by side one fails, theadjacent gantry can take on the work of the failed unit. Although thework capacity will decrease, it will not be shut down completely.

Medium Throughput:

For example, a medium throughput tool or tool zone can be satisfied withthe addition of a “feeder” robot 3320 (e.g. an additionalgantry/transporter level). This configuration is generally similar tothe low throughput arrangement with the addition of a feeder robot 3320and sorter/shuttle 33200. In the exemplary embodiment, the feeder robotand sorter/shuttle may be dedicated device for executing intrabayconveyor to storage moves only. For every feeder robot it may be desiredto employ two gantry loader robots 3310, 3312 on either side (see FIG.44) of the feeder. However, in alternate embodiments, the feeder may bepaired with one loader robot. The sorter/shuttle's purpose is to acceptthe carrier from the feeder and queue it for storage. With thisconfiguration the “loader” robot can focus on storage to tool moves andvice versa without the added burden of picking carriers from theintrabay conveyor. The system can work with adjacent low, medium, orhigh throughput modules. In the event of a loader robot failure it ispossible for an adjacent loader robot to move in and work the failedrobot's zone. (see FIGS. 46 and 47). If a feeder mechanism was to fail,the individual loader robots behave in the same manner as the lowthroughput configuration. In both failure cases the system remainsactive but at a reduced capacity.

High Throughput:

By way of example, for high throughput applications the gantry modulescan be reconfigured to meet the demand of the specific tool or toolzone. The high throughput arrangement may have a loader robot on eachside of the bay, a similar feeder robot arrangement as in the mediumthroughput zone, and a similar sorter/shuttle for queuing the carriersto storage. (see FIG. 45). The loader robot is responsible for the toollocated on one side of the bay, which allows for shorter moves. Carriersenter and exit the high throughput zone via the intrabay conveyorsystem. The high throughput configuration has fault tolerance to both aloader robot failing and/or the feeder robot failing. If a loader robotwas to fail the other loader robot may work both sides of the bay afterthe failed robot is moved out of the zone. If the feeder fails theloader robots become responsible for picking carriers from the intrabayconveyor system. If both a loader robot and a feeder robot fail, oneloader robot becomes accountable for all desired moves.

Each configuration; low, medium, and high can operate as a single entityor adjacent to any of the three arrangements depending on the desiredmove rate. The system does not have any single point failures thatcompletely incapacitate the flow of carriers through the system. Inaddition to fault tolerance for individual or multiple componentfailures, the system can exploit multiple available move paths for acarrier. The host controller employs a standard set of moves withsuccessive levels of priority moves for a particular carrier undernormal operating conditions. To overcome periodic surges in carriertraffic, tool failures, or upstream restrictions, a host's control logiccan initiate schemes to reroute and divert carrier flow away fromproblem areas. FIG. 50 demonstrates the many methods to move a carrierfrom point A to B in accordance with the exemplary embodiment.

In the exemplary embodiment the “feeder” robot may retrieve carriersfrom the intrabay conveyor system and place them in the appropriatestorage location. If desired the feeder robot allows the tool loadingrobot to focus solely on storage to tool moves and increases the systemstotal move capacity. The feeder utilizes quick short moves allowing theintrabay conveyors to move with limited or no interruption (e.g. noconveyor interruption may exist when accessing carriers from accesslanes similar to FIG. 20). The feeder mechanism relieves the workload ofa gantry system. Anticipated drive mechanisms to support the variousmotions include linear motors, ball screws, pneumatic drives, beltdrives, friction drives, and magnetic propulsion. The followingembodiments can be implemented based on the previously describedpremise:

1. The feeder robot is similar to the gantry loading robot except it isfixed in the x direction (length of the bay) and has degrees of freedomin the y (transverse to bay) and Z (vertical) directions. The feedermechanism is located on a plane below the tool loading robot to allowthe loader robot to pass over without a payload. The area above the loadport zones is free to allow the loader robot to move across the feederwith a payload. The feeder system is vertically located such that whenthe vehicle is in the raised position it can pass over the intrabayconveyor and have enough space to move over and grasp a carrier. Thefeeder accesses carriers from above, utilizing short vertical strokes topick and place carriers from the intrabay conveyor system to the storageflange desired. In this configuration the storage lanes exist coplanarto the intrabay conveyors. The storage lanes possess a bi-directionalsorter/shuttle mechanism used to shuttle a carrier to the next locationalong the storage row. The shuttle drive mechanism is designed forexample such that it can move a carrier at least one pitch distancealong the length of the bay. A pitch distance can be defined as thedistance that allows the gantry tool loading robot to travel adjacent tothe feeder robot and pick the carrier without interference. Thesorter/shuttle is also used to transport carriers between adjacentloader robot zones and storage lanes when desired. For example, acarrier move sequence is as follows:

-   -   Intrabay conveyor momentarily stops at feeder robot's fixed X        position along the bay length.    -   Feeder robot travels from previous Y position to location        directly above carrier on intrabay conveyor.    -   Feeder robot picks carrier.    -   Feeder robot travels in Y direction (transverse to bay) to        specific shuttle lane.    -   Feeder robot places carrier onto shuttle and proceeds to next        move.    -   Shuttle/sorter mechanism drives carrier in X direction.    -   Gantry tool loading robot moves to storage location, then picks        and places carrier to the appropriate tool.

Examples of some of the advances of the system in accordance with theexemplary embodiment are increased wafer throughput over conventionalsystems, multiple move paths to complete carrier moves, and increasedfault tolerance.

In accordance with another exemplary embodiment shown in FIG. 48, thefeeder robot is implemented as a linear stage that resides on a planejust below the shuttle and intrabay conveyor system. The stage has thesame degrees of freedom as embodiment 1 and grips the carrier from belowrather than above. Once the carrier is captured from the intrabayconveyor it is driven transverse to the bay and release on theappropriate shuttle. This architecture has the benefit of allowing theconveyor lanes to be positioned anywhere between the equipment boundary.For example, the intrabay conveyors could exist in the center ratherthan the outside as in embodiment 1. Another advantage with thisarrangement is the loader robot can now pass over the feeder mechanismwith payload in any Y position in the bay whereas with embodiment 1 theloader is limited to performing this move only when it is located insidethe load port zone. Furthermore, there is no need for the loader robotto communicate with the feeder geometry for collision avoidance. Boththe feeder and loader robots can occupy the same vertical space withpayloads and not interface with one another. The move sequence for thisconfiguration is the same as embodiment 1 with the exception of graspingcarriers from below rather than above.

In alternate embodiments, the overhead or mechanism from below can movein the X (length of bay), Y (transverse to bay), and Z (vertical)directions. In this configuration a shuttle/sorter may not be usedbecause the 3 axis feeder can move to the specific storage lane and slotas necessary. For example, a carrier is removed from the intrabayconveyor, positioned to the appropriate storage lane then translatedperpendicularly to the initial queuing the carrier in storage. As seenbest in FIG. 49, in accordance with an other exemplary embodiment,increased storage capacity may be generated by providing verticalstorage columns that allow for carrier storage in a volume consistentwith the carrier geometry that extends from the FAB floor to the highestreachable point by the OHT system can be arranged throughout the lengthof the bay.

As may be realized, in the exemplary embodiment, such as illustrated inFIG. 41, the interface or loading and unloading stations (see also forexample FIGS. 37A-37C and 39) of process tools PT served by transportsystem 3000 may have different facings relative to each other. Thefacing of a loading station and/or process tool as described hereaftermay not specifically refer to the position or orientation of any side orface of the loading station or process tool, but rather refers to thecharacteristics (whatever they may be) of the loading station or processtool that specify a predetermined orientation of the loading stationand/or process tool relative to the carriers mated to the loadingstation and/or wafers loaded from the carriers into the process tool.Carriers, transported by transport system 3000 to and from the processtools PT, when mated to the loading stations of different tools, withdifferent facings, may be mated in different orientations correspondingto the facing of the respective loading stations. Hence carriers matedto loading stations of different process tools, served by transportsystem 3000, may have different orientations relative to each other. Theseating interface mating carriers to the loading stations(s) of processtools may be polarized to permit mating with the carrier in the desiredorientation, for example corresponding to the facing of the loadingstation. Carriers (that may be generally similar to carriers 200 inFIGS. 1-5, and 36A-36D) may not have an isomorphic configuration withrespect to mating to the loading station(s) of process tools PT. By wayof example, the carriers may have a casing or housing, that may begenerally isomorphic in appearance or shape (see for example FIGS. 1 and36A), but may be loaded with substrate(s) in a desired orientationrelative to the reference frame of the process tool(s). Thus, when matedto the loading station(s) of the process tool(s) PT the carriers may beloaded so that the substrate(s) therein are in the desired orientationspecified for the processing tool. In alternate embodiments, the carriercasing may have a non-isomorphic shape (e.g. the carrier may be similarto a FOUP, having a casing such as with a substrate transfer opening inbut one desired side or face of the casing) defining a desiredorientation for mating the carrier to the loading station of the processtools. In the exemplary embodiment, the carrier(s) CAR 200 may havesuitable discriminators or indicia (for example structural orelectronic) to indicate orientation of the carrier. As may be realized,the control system (not shown) of the transport system 3000 may besuitable configured or programmed to identify and/or track theorientation of the carrier(s) CAR 200 from the discriminators or indiciaof the carriers as the carrier of the transported between tools PT,throughout the FAB by transport system 3000. The control system may alsobe configured or programmed to relate the orientation of the carrier(s)CAR 200 to the facing of the loading stations so that carriers may beloaded and mated by transport system 3000, to the loading station(s) inan orientation corresponding to the given facing of the loading station.In the exemplary embodiment illustrated in FIGS. 41 and 50, thetransport system 3000 may include, what may be referred to fordescription purposes, as a θ drive system 3600 arranged to provideindependent θ motion (e.g. rotation of the carrier, such as indicated inFIG. 41A, to change carrier orientation) to the transported carriers.Drive system 3600 of the transport system 3000 may effect θ motion orrotation of the carriers independent of carrier movement in any otherdirection (such as in the x, y, z directions see FIG. 41) as will bedescribed further below. Thus, transport system 3000 in the exemplaryembodiment may be capable of four degrees of freedom movement (x, y, z,θ) for transporting carriers to and from process tools. In alternateembodiments, the transport system may have carrier transport movementwith more or fewer degrees of freedom. In the exemplary embodiment, theθ drive system 3600 may be arranged to effect independent θ motion ofthe carrier with the carrier “on the fly” as will also be describedfurther below.

As has been noted before, the process tools PT may have loading stationsLSR1, LSR2 with different facings, relative to each other, that maycause the carriers to be placed on the loading stations, by transportsystem 3000, in different loading orientations (corresponding to thefacing of the loading stations). Referring again to FIGS. 41 and 50, inthe exemplary embodiment illustrated, the process tools PT served bytransport system 3000, may be arranged in rows R1, R2 (though as hasalso been noted before, in alternate embodiments, the process tools, andtheir corresponding loading stations may be located in any desiredarrangement that may or may not use rows or columns and may have anydesired array or serial arrangement). As seen best in FIG. 41A, in theexemplary embodiment the process tools PT in the respective rows R1, R2may be positioned so that the corresponding loading stations LSR1, LSR2of the process tools may be generally facing each other. Accordingly, asmay be realized from FIG. 41A, the loading stations LSR1 or processtools in row R1, may be facing in a direction (indicated by arrow LSA1in FIG. 41A) that may be substantially opposite (e.g. about 180° apart)than the facing direction (indicated by arrow LSR2) of the loadingstations LSR2 in row R2. The facing directions of loading station may besimilar in each row (e.g. loading stations LSR1, LSR2 in correspondingtool rows R1, R2 may generally be facing in directions LSR1, LSR2respectively), though in alternate embodiments, one or more tools in oneor more rows may have loading stations with different facing than otherloading station(s) of tools in the same tool row. In other alternateembodiments, the loading stations may be facing in different directionsmore or less than 180° apart. In still other alternate embodiments, theloading stations of tools served by the transport system may have asimilar facing direction. FIG. 41A shows, for example purposes, CAR 200mated to loading station LSR1. The carrier CAR 200 on the loadingstation LSR1, in the embodiment shown, may be oriented (as indicated byorientation features CAR A, depicted schematically for example purposes)to correspond to the facing (indicated by arrow LSA1) of the loadingstations LSR1. FIG. 41A also shows the carrier CAR 200′ (indicated inphantom) when mated to loading station(s) LSR2 oriented (as indicated byfeature CAR A′) to correspond to the facing (indicated by arrow LSR2) ofloading station LSR2. As may be realized from FIG. 41A, in the exemplaryembodiment the orientation of carriers CAR 200 mated to loadingstation(s) LSR2 may be about 180° from the orientation of carriers whenmated to loading station(s) LSR1. In alternate embodiments, thedifference in the orientation of carriers mated to loading stations withdifferent facings may be more or less than 180°. In the exemplaryembodiment, transport system 3000, for example using θ drive system 3600is capable of rotating the carrier CAR 200 (such as θ rotation) toorient the carrier to the desired orientation CAR A, CAR A′ for matingthe carrier with the desired loading station. As may be realized fromFIG. 41A, the θ drive system 3600 of the transport system 3000 may becapable of effecting θ rotation of the carrier of about 180° and, in theexemplary embodiment θ rotation of the carrier CAR 200 by the θ drivesystem 3600 may be about 270° as will be described further below. Inalternate embodiments, the θ drive system may be capable of effecting θrotation of the carrier in any desired amount.

Referring still to FIG. 41, in the exemplary embodiment, the transportsystem 3000, as described before, may generally comprise rapid transportsection 3100 (such as a conveyor or other suitable mass or bulk materialtransport without or with discrete transport vehicles) and an interfacetransport system section 3300 (interfacing carriers between the rapidtransport section and tool loading stations so that transport section3100 can, when operative, maintain substantially continuously asubstantial constant transport rate independent of loading and unloadingof the container to the loading stations). In FIG. 42, the interfacetransport section 3300 is illustrated as having an overhead gantry 3310configuration for example purposes, and in alternate embodiments, theinterface transport section may have any other suitable configuration.In the exemplary embodiment shown in FIG. 42 the gantry(ies) 3310 (theinterface transport system may be modularly configured with a desirednumber of gantries) may generally comprise a translation platform 3312with traverser 3314 arranged to provide two axis travel (e.g. x, y axes,see also FIG. 41). The traverser 3314 may have any suitableconfiguration and may include a hoist device so that the carrier grip ofthe gantry, for capturing and holding carrier(s) CAR 200, may be forexample raised and lowered, thus effecting Z axis travel. A suitableexample of a traverser vehicle may be the Aeroloader™ transport vehicleavailable from Brooks Automation, Inc. As was noted before, the gantry3310 may be arranged (see also FIGS. 43-45) to pick or place carriersoff or on the conveyor section 3100 and to pick and place carriers ontothe loading station(s) of the process tools. In the exemplaryembodiment, storage stations 3000S may also be provided (see for exampleFIG. 41B), and the interface transport section (e.g. gantry 3310) mayaccess containers on any of the transport conveyor sections 3100, or atthe storage stations 3000S or at the loading stations of the processtools, and may move the carriers CAR 200 therebetween in any desiredsequence as has been described before. As noted before, FIG. 50illustrates representative examples of some carrier moves, such asbetween any of the conveyor section 3100R1, 3100R2 and any loadingstation LSR1, LSR2 in either tool row R1, R2, or between any two loadingstations LSR1, LSR2 in the same or different tool rows, or between anyloading station LSR1, LSR2 and storage stations 3000S, that may beeffected by the gantry 3310 of the interface transport section 3300.

In the exemplary embodiment, the gantry 3310 may include the θ drivesystem 3600 as will be described further below. As seen in FIG. 50, inthe exemplary embodiment the carrier CAR 200 may be rotated (asindicated by arrow θ) such as during transport by the interfacetransport section 3300, to change carrier orientation as desired. By wayof example, when being conveyed by the conveyor sections 3100R1, 3100R2,the carrier(s) CAR 200 may have any orientation. In other words, theorientation of the carrier(s) CAR 200 on the conveyor transport may bedifferent than the orientation in which the carrier is positioned at theloading station LSR1, LSR2. For example, the carrier CAR 200 may bepositioned on conveyor transport 3100R2 in an orientation (indicated byfeature CAR A shown in FIG. 50) that may be about 270° (clockwise) fromthe desired orientation (indicated by feature CAR A′) of the carrierwhen mated to its destination loading station. The carrier CAR 200 maybe moved by the gantry(ies) 3310 of the interface transport section 3300from the conveyor 3100R2 to the desired loading station LSR1, generallyas indicated by arrow C2L1 in FIG. 50. In the exemplary embodiment,orientation of the carrier may be changed by the transport sectionduring the move (e.g. θ rotation of about 270° clockwise) from theinitial orientation (indicated by feature CAR A), on the conveyor, tothe desired loading orientation (indicated by feature CAR A′) for matingthe carrier CAR 200 to the loading station LSR1. FIG. 42A is a partialschematic perspective view of gantry 3310 of the interface transportsection 3300 in an exemplary position with the carrier CAR 200 held bythe traverser 3314 in proximity to a representative loading stationLSR2. The carrier CAR 200 is shown hoisted, by the gantry proximate tothe loading station LSR2 and oriented to correspond to the facing of theloading station. The position shown may be representative of positionsprior to mating or after unmating the carrier from the loading station.As may be realized, the carriers transported by the transport system3000, such as along move paths shown in FIG. 50, (e.g. move path C2L1)for loading and unloading loading stations LSR1, LSR2 may be positionedby the gantry 3310 as shown in FIG. 42A. In the exemplary embodiment,the θ rotation of the carrier CAR 200 to change orientation, such as toallow mating with the load station, may be effected “on the fly” as thegantry is moving the carrier to the loading station. The θ rotation ofthe carrier may be effected at any desired time during the carrier moveby the gantry. In alternate embodiments, the θ rotation of the carriermay not be performed “on the fly”. In the exemplary embodiment, thegantry may unload the carrier from the loading station LSR1, LSR2 andmove the carrier to the desired conveyor 3100R1, 3100R2 and may changethe orientation of the carrier, by θ rotation during the move. Forexample, the carrier may be rotated to preposition the carrier in adesired orientation, such as an orientation corresponding to its nextexpected destination or loading station (both the next expecteddestination and its corresponding carrier orientation may be identifiedby the transport system controller). As noted before, carriers CAR 200when moved between conveyor transports 3100R1, 3100R2 and loadingstations LSR1, LSR2 or between loading stations in the same or differenttool rows R1, R2 may be stationed, at least temporarily at one or morecarrier storage stations 3000S. The orientation of the carriers whenpositioned in the storage station(s) may also be different from desiredcarrier orientation when mated to the loading stations. For example, thecarrier when placed into the storage station 3000S, such as by interfacetransport section 3300 (e.g. gantry 3310 or feeder robot 3320, see alsoFIGS. 42, 44) may have an orientation corresponding to some priorcriteria (e.g. may be in an orientation corresponding to the loadingstation the carrier was last unloaded from). This orientation may bedifferent than that corresponding to the next loading station to whichthe carrier is to be mated. Accordingly, in the exemplary embodiment thegantry may effect θ rotation of the carrier to change its orientation asdesired when moving the carrier from the storage station 3000S to theloading station (such as along the path indicated by arrow SL1 in FIG.50). The θ rotation of the carrier may be performed “on the fly” similarto that described previously. The carrier may also be placed by thegantry into a storage station 3000S in the desired orientation forsubsequent interface. For example, in a manner similar to that describedbefore, when unloading a carrier from a loading station. The gantry maychange may change the orientation of the carrier, by θ rotation, whenmoving the carrier from the loading station to a storage station. In theexemplary embodiment, the gantry may also rotate the carrier topre-orient the carrier, when moving the carrier from conveyor transportsto storage stations. In the exemplary embodiment, the gantry 3310positioned to effect transport of carriers to the loading stations LSR1,LSR2 of the different rows R1, R2, may move the carriers from loadingstations of one row R1, R2 to loading stations of the other row R1, R2(in one move or a series of moves) and may change the carrierorientation (from an initial orientation corresponding to the loadingstation from which the carrier is removed to a final orientationcorresponding to the destination loading station) by θ rotation duringthe move.

Referring now also to FIGS. 42B-D, in the exemplary embodiment the θdrive system 3600 of the gantry 3310 may be included in the traverservehicle 3314. The configuration of the θ drive system shown in thefigures and described below is merely exemplary, and in alternateembodiments, the θ drive system may have any other suitableconfiguration. In the exemplary embodiment, the traverser vehicle 3314may generally have a base vehicle section 3340, a hoist mechanism 3342and a carrier gripper section 3344. The base vehicle section 3340, inthe exemplary embodiment, is movably supported on the translationplatform of the gantry (see FIG. 42). The hoist mechanism 3342 attachesthe carrier gripper section 3344 to the base vehicle section 3340. Thehoist mechanism 3342 may be raised and lowered in order to raise andlower the carrier gripper section relative to the base vehicle section.The carrier gripper section may be configured to interface with and gripand release the carrier. Referring now to FIGS. 42C-42D, there isrespectively shown a schematic perspective view and top plan view of thecarrier gripper section 3344. In the exemplary embodiment, the θ drivesystem 3600 may be included in carrier gripper section 3344. Inalternate embodiments, the θ drive system may be incorporated into thegantry traverser in any other desired manner. In the exemplaryembodiment, the carrier gripper section 3344 may include upper and lowerparts 3344F, 3344R that are pivotally joined (such as rotary shaft) toeach other to allow relative rotation between parts (in the directionindicated in by arrow θ in FIG. 42C). In the exemplary embodiment, theupper part 3344F may be joined to the hoist bands or members 3342H (seeFIG. 42B). The lower part 3344R may have the carrier gripper mechanismto engage the carrier. As may be realized, when gripped by the grippingmechanism the carrier may be locked relative to the lower part 3344R ofthe traverser carrier gripper section. In the exemplary embodiment shownin FIGS. 42B-D, the θ drive system 3600 may generally comprise a motor3602 (such as a suitable servo or stepper motor), a shaft 3604 and anencoder 3606. The motor 3602 may have a stator fixed to the upper part3344F of the carrier gripper section, and the rotor mounted on shaft3604. The shaft 3602 may be fixed to the lower part 3344R of the carriergripper section. Hence, the motor may be capable of rotating the lowerpart 3344R, and hence the carrier gripped by the carrier gripper. Theencoder 360 (which may be of any suitable type) may identify bothabsolute and progressive positions of the shaft to the control system(not shown). As noted before, in the exemplary embodiment, the θ drivesystem may be arranged to provide about 270° or θ rotation. Accordingly,this allows the transport system to rotate a carrier at least about ±90°from any initial orientation. In alternate embodiments, the θ drivesystem may have any desired configuration and may be capable of rotatingthe carrier through any desired range of rotation.

In alternate embodiments, cylindrical carrier nests can be placed asdesired to allow for higher storage density in the FAB. The cylindricalstorage nests can hold carriers one on top of another and provide amechanism for raising or lowering carriers to a specified height. Themechanism for the vertical motion can be pneumatic, mechanical, ormagnetic.

Referring now to FIG. 51 there is shown a schematic plan view of atransport system 4000 in accordance with still another exemplaryembodiment. The transport system in the exemplary embodiment illustratedin FIG. 51 is a representative section, such as for example an interbayportion of a FAB-wide transport system, and in alternate embodiments,the transport system may have any desired size and configuration. Thetransport system 4000 in the exemplary embodiment shown in FIG. 51 maybe generally similar to the transport system 3000 described before andillustrated in FIGS. 41-50. Similar features are similarly numbered.Similar to transport system 3000, the transport system 4000 in theexemplary embodiment shown in FIG. 51 may have a bulk or rapid masstransport section 4100 (e.g. conveyor) and an interface section 4200.The interface section 4200 shown in this embodiment is merely exemplary,and in alternate embodiments may have any desired configuration with anydesired number of subsections (e.g. storage sections, shuttling sectionssuch as similar to those previously described). Generally the interfacesection 4200 may have a number of feeder robot(s) capable of interfacingcarriers between the bulk transport system section 4100 and the processtools. The bulk transport system section 4100 may generally be similarto the transport system 500 described before and a portion of which isshown in FIG. 20. In the exemplary embodiment, shown in FIG. 51, thebulk transport system section 4100 may comprise a track with a solidstate conveyor system. The track may be similar to the conveyor tracksdescribed in U.S. patent application Ser. No. 10/697,528 and Ser. No.11/211,236 previously incorporated by reference herein in theirentirety. In the exemplary embodiment shown in FIG. 51, the transportsystem 4100 may be an asynchronous transport system (similar totransport system 500) in which transport of carriers by the transportsystem is substantially decoupled from the actions of other carriersbeing transported. Hence, one or more carriers may be capable ofindependent actions during transport (e.g. accel/decel, stopping,load/unload) without affecting the transport rate of other adjoining orproximate carriers in the carrier transport stream of the transportsystem.

In the exemplary embodiment shown in FIG. 51, the bulk transport systemsection, referred to from hereon as bulk transport 4100, generallycomprise a main transport track(s) 4100M. The bulk transport 4100 mayalso have a number of siding track(s) 4100S. The main transport track(s)4100M, shown in FIG. 51 as a loop for example purposes, and which mayhave any other desired shape in alternate embodiments, may define a maintransport path (or stream) for carriers being transported by the bulktransport. Though the description of the exemplary embodiment refersparticularly to carriers, the features described herein are equallyapplicable to alternate embodiments where the (substrate) carrier may beseated on a payload platen or other motive device that is transported bythe bulk transport. The main transport path, in the exemplary embodimentmay have a continuous, and substantially constant speed. Hence, carrierstransported on main transport track(s) 4100M may be capable of asustained, high rate of travel throughout the transport on the main pathwithout impediment from carriers that stopped on the transport system.The siding or branching track(s) 4100S in effect enable decoupling ofthe transport rate deterministic operations of carriers on the bulktransport from the main transport path. As noted before, such ratedeterministic operation may be performed from the siding track withoutimpairment to the main transport path. Accordingly, the siding track4100S may define for example a carrier buffer, loading/unloading stationor path switching device. In the exemplary embodiment, one siding trackis shown for example and in alternate embodiments, there may be anydesired number of siding tracks. The configuration of the siding in theexemplary embodiment shown, bifurcating and rejoining on a substantiallystraight segment of the main track, is also merely exemplary and inalternate embodiments the siding track may have any other desiredconfiguration. For example, the siding track may shunt between opposingsides of the main track loop (within a given bay) or may shunt betweenmain tracks of different interbay (e.g. inter-inter) transport sections,or inter-intra (or vice versa) transport sections such as shown forexample in FIGS. 29A, 29B. In alternate embodiments the siding may havea different orientation than the main track and may cross over or underthe main track. In other alternate embodiments, the intersection betweenmain and siding tracks may be arranged as desired such as asubstantially orthogonal intersection or switch.

In the exemplary embodiment, the main and siding track(s) 4100M, 4100Smay comprise modular track segments A, B, C, D, L that are modularlyconnected to assemble the tracks of the bulk transport. The carriers maybe driven on the tracks 4100S, 4100M of the bulk transport by forexample linear motors. Similar to track 500 described before, the forcerof the linear motor may be located in/on the track(s) 4100M, 4100S andthe reaction portion of the linear motor may be on the carrier. Thecarrier(s) may be movably supported on the track by suitable devicessuch as contactless or lubricious bearings (e.g. air/gas bearings)maglev systems, or contact bearings (e.g. rollers, ball/roller bearings)in the track that act on suitable solid state support members of thecarrier(s). In alternate embodiments, the carrier(s) may have the motivesupports integrated therein such as wheels, rollers, gas/air bearings.As may be realized, the motive supports supporting carrier(s) on themain and siding tracks may have any desired arrangement on the track tostably support each carrier over the track, and may be distributed alongthe main and siding tracks to allow the carriers to move freely alongthe track. In the exemplary embodiment, the linear motor may be forexample a linear induction motor (LIM), a linear brushless DC motor(etc.), though in alternate embodiments any desired linear motor or anyother type of motor/drive may be used to urge the carrier(s) along themain and siding tracks of the bulk transport. As noted before, in theexemplary embodiment, the forcer (or phase windings) 4120, 4120M, 4120Sof the LIM are located in the track modules A, B, C, D, L forming themain and siding tracks of the transport, and the carrier(s) has thereaction rate/members of the LIM as will be described in further detailbelow. In alternate embodiments the motor coils may be mounted to thecarrier or vehicle platen and the magnetic reaction elements may bemounted to the track.

Still referring to FIG. 51, the modular segments A, B, C, D, L of themain 4100M and siding 4100S tracks in the exemplary embodiment shown arerepresentative and in alternate embodiments may have any desiredconfiguration. The track segments A, B, C, D, L are generally similarexcept as otherwise noted. As seen in FIG. 51, in the exemplaryembodiments the track segments (modules) may generally include singletrack segments (e.g. A, C, D, L) and junction (track switching)segments. In alternate embodiments, any other desired modular tracksections may be used. For example, in alternate embodiments, a giventrack module may include multiple tracks (each forming a differentcarrier transport path) generally extending alongside each other in whatmay be referred to as a non-junction multi track module. In theexemplary embodiment, the single track segments may includesubstantially straight segments A, D, L and curved segments C, though inalternate embodiments, the single track segments may have any otherdesired shape. In the exemplary embodiment shown, the track sections aredepicted as being at a substantially common elevation for descriptionpurposes. In alternate embodiments, the main and siding tracks mayinclude sections at different elevations. For example a siding may belocated at a different elevation (e.g. lower or higher) than the maintrack and/or other sidings. Also the main track and/or siding track mayhave track sections at different elevations along the track, such ashigher and lower track portions. Suitable ramps (not shown) may jointrack sections at different elevations allowing the carrier(s) travelingthe track to transition between. As may be realized from FIG. 51, thejunction segments B, 4102, 4102′ may be located where the siding orbranch tracks 4100S merge with the main track 4100M or where somejunction may be desired. In the exemplary embodiment shown in FIG. 51,two junction track segments 4102, 4102′ are shown for example purposes.The configuration of the junction segments 4102, 4102′ shown in FIG. 51is merely exemplary, with a single branching track merging/diverging onone side (e.g. left side relative to the direction indicated by axis Xin FIG. 51) of the main track 4100M. In alternate embodiments, thejunction segment may branch to the right of the main track. In otheralternate embodiments, the junction segments may have any other desiredconfiguration, such as for example multiple branching in one segmentwith branches on opposite sides of the main track that may besubstantially directly opposite from each other or staggered, ormultiple branching on one (e.g. left and/or right) side of the maintrack. In the exemplary embodiment, the single track segments A, C, D,L, though having different shapes (e.g. straight, curved, etc.) may beotherwise generally similar. Each track segment A, C, D, L may includecorresponding sections in the motor forcer 4120. As may be realized, andalso as shown in FIG. 51, when the modular track segments are assembledthe motor forcer sections (of the various track sections) whenintegrated operably (using a suitable controller) may define asubstantially continuous motor forcer 4120M, 4120S for the main andsiding track(s) to operate on the reaction plate(s) in thecarrier(s)/platen(s) and drive the carriers/platens throughout thelength of the main and siding tracks. In alternate embodiments, thetracks may include one or more segments without integral forcersections.

As may be realized, the forcer 4120 or what may be otherwise referred toas the primary coil assembly of the linear motor, may for example in thecase of a LIM arrangement, generally comprise steel laminations andphase windings that may be formed integral to the track segments or maybe housed in a forcer housing that is joined to the track segment. Inalternate embodiments, the phase windings of the linear motor forcerintegrated into the track segments may have any other suitablearrangement. The forcer section in each segment A, C, D, L (see forexample segment C in FIG. 52) may be itself segmented or may becontinuous. Curved track segments C, may have forcer sections 4120C inwhich the phase windings may be arranged so that the coil assemblydefines a curve commensurate with the curvature of the track, or mayhave a forcer section that is segmented, with the segments arranged todefine a generally curved forcer section. In alternate embodiments, theforcer section of the track segments may have any other desired shape.The forcer section of the track segments A, C, D, L may be arrangedsymmetrically relative to the track and the carrier(s) riding the track.In alternate embodiments, the forcer may be located asymmetric to thetrack and carrier(s) thereon.

FIG. 54 shows a schematic end view of a representative track segment Aand representative carrier 5000 movably supported thereon. As notedbefore, the track(s) (main(s) and siding(s) 4100M, 4100S, generallyprovide motive force/impetus, motive support and guidance to thecarrier(s) 5000 to effect controlled movement of the carrier(s) alongthe track(s). As also noted before, in the exemplary embodiment, thelinear motor driving the carrier(s) such as for example a LIM, bias theforcer 4120M, 4120S in the tracks operating on the reactionplate(s)/elements 5100 on the carrier(s). Referring also to FIG. 53,there is shown a schematic bottom view of a representative carrier 5000and the reaction plate(s) 5100 of the carrier. The arrangement of thereaction plate(s) 5100 on the carrier shown in FIG. 53 is merelyexemplary and in alternate embodiments, the reaction plate(s) on thecarrier may have any other suitable arrangement. In alternateembodiments there may be more or fewer reaction plates. In the exemplaryembodiment, the reaction plate(s) 5100 are shown on the bottom of thecarrier, though in alternate embodiments the reaction plates may belocated on any other desired sides or portions of the carrier. In theexemplary embodiment, the reaction plate(s) 5100, such as defining aLIM, may be made of metal such as steel or aluminum, though any othersuitable material may be used. One or more of the reaction plates may bemade of ferrous (magnetic) material as will be described below. Inalternate embodiments the reaction elements may include permanentmagnets arrayed to operate with the motor phase windings, such as of alinear brushless DC motor. The reaction plate(s) on the carrier mayinclude one or more plate(s) 5102 corresponding to the forcer 4120M,4120S in the track(s) 4100M, 4100S providing propulsion along the mainor siding tracks. This is schematically illustrated in FIG. 54. Thereaction plate(s) 5102, is shown schematically in FIG. 53 as one plate,but may include any desired number of plates, for example having anarrangement as shown in FIGS. 20C, 20D. As noted before, the forcer 4120in the tracks (and hence the forcer sections 4120A, 4120C, see FIGS. 52,54, of the respective segments) and the corresponding reaction plate(s)5102 may be arranged substantially symmetrically with respect to thecarrier and track. In alternate embodiments, the motor forcer may beasymmetric.

In the exemplary embodiment shown in FIG. 54, the carrier(s) 5000 ismovably supported on the track by suitable air bearings 4200. Thedistribution of the gas/air/fluid bearings shown in FIG. 54 is merelyexemplary, and in alternate embodiments the exhaust ports may bearranged to provide any other desired gas pressure distribution stablysupporting the carrier from the track. In alternate embodiments, the gasports may be in the carrier exhausting gas to lift the carrier from thetrack. As noted before, in other alternate embodiments the motivesupports between carrier and track may be of any other desired type andmay be dependent from either the track segments or the carrier(s). Thegas ports for air bearings 4200 and/or the gas impingement areas on thecarrier may be configured to generate a resultant directional force(s)that effect horizontal guidance of the carrier relative to the track. Asmay be realized, the gas ports may be communicably connected to asuitable source of gas (not shown). The track sections, in the exemplaryembodiment may have gas conduits for feeding gas from the gas supply tothe gas ports of the fluidic bearings. Suitable valving and controls maybe included for example to operate gas ports in the proximity of wherecarriers are present on the track. Control may be active (e.g. sensoridentifies presence of carrier causing switch on/off of gas portsoperated for track sections where carrier activity is known).

In the exemplary embodiment shown in FIGS. 51-52 and 54, the tracks4100M, 4100S may include control and guide system(s) 4130 to guide themovement of the carriers as they are propelled down the tracks. Guidesystem 4130 may be a non-contact system extending along the main andsiding tracks 4100M, 4100S. In the exemplary embodiment, each of thetrack segments A, C, D, L may include corresponding sections of theguide system 4130A, 4130C, (see FIGS. 52, 54) that, when the segmentsare joined, may be combined to form the substantially continuous guidesystem(s) of the tracks. In alternate embodiments the guide system maybe independently mountable to the track. In other alternate embodiments,the guide system may be of any suitable type, and may be for example,integral to the support system of the tracks (e.g. rollers or wheels onthe track or carrier that interface therebetween and help maintainorientation and horizontal alignment of the moving carrier along thetrack), and/or may be integral to the linear motor (as will be describedfurther below), and/or may be independent from the carrier supports andlinear motor. In the exemplary embodiment, the guide system 4130 intrack 4100M, 4100S, may generally comprise a guide magnet track 4130M,4130S that extends substantially parallel to the linear motor forcer4120 in the track. The guide magnet track may comprise for examplepermanent magnets serially arrayed to form the magnet tracks. Portionsof the track such as OT switches/junctions may also includeelectromagnets that may be cycled on/off to allow switching. Inalternate embodiments, the guidance may include providing the motor inthe track section with windings capable of generating guidance forces onthe carriers. Such guidance windings may be integrated into the linearforcer, or may be separate and independent from the forcer providingpropulsion along the track. As may be realized the guide forcer in thetrack may interact with suitable guide plates/elements 5104 (such asmagnetic material (e.g. ferrus) or permanent magnets in the carrier tomaintain the carrier(s) in a desired horizontal position relative to thetrack 4100M, 4100S. In other alternate embodiments, the locks forgenerating guidance forces on the carrier may be mounted on the carrier,and operate with stator elements in the track to effect carrierguidance. As noted before, in the exemplary embodiment, the tracksegment modules A, C, D, L may each have corresponding sections 1430A,1430L of the guide track as shown in FIGS. 52 and 54. In the exemplaryembodiment, the guide track section 1430A, 1430L of track sections A, C,D, L may comprise two guide tracks 4132, 4134 (for example see FIG. 54)located along but on opposite sides of the forcer 4120A. The position ofthe guide tracks shown is exemplary. In alternate embodiments, the moreor fewer guide tracks may be provided in any desired location. The guideplate(s)/elements of the carrier, that interact with the guide tracksmay be off axis (relative to axis X) linear motor reaction plates 5104R,5106R, 5104L, 5106L (see FIG. 53) for other sections of the linear motoras will be described below, or may be other suitable ferrousplates/elements independent of the linear motor reaction plates. Inother alternate embodiments, the carrier may guide magnet elements, andthe tracks may have ferrous/magnetic material tracks positioned tointeract with the magnets on the carrier to define a track guide system.The guide system may also include positioning/position sensingsystem/devices, such as Hall effect sensors, LVDT's etc. communicablyconnected to a controller to effect control of the movement of thecarrier along the track. The positioning system/devices may be similarto that described in U.S. application Ser. No. 11/211,236 previouslyincorporated by reference. By way of example, positioning feedback alongthe main and siding tracks may also be provided by suitable Hall effectsensors of the LIM.

Referring now again to FIG. 52, there is shown a schematic plan view oftrack segment C, described above, and representative junction segment B.Other junction segments of the bulk transport 4100 are generally similarto junction segment B. In the exemplary embodiment, the junction segmentmay have forcer sections for both main and siding tracks 4120M, 4120S.In the exemplary embodiment the segment B may also have a switchinglinear motor forcer section 4125. As may be realized, in the exemplaryembodiment an independent linear motor, independent from the linearmotors of the main track and the siding track, may be located atjunctions to effect carrier switching between main and siding tracks aswill be described below. In the exemplary embodiment, the switchinglinear motor may be a LIM, though any other suitable linear motor suchas a brushless DC motor may be used. In alternate embodiments, any othersuitable electrical or mechanical switching system may be used. As seenin FIG. 52, in this embodiment the forcer 4125 (for the switch motor)may be located offset from the forcers 4120M, 4120S of the main andsiding tracks. The forcer section for the main track may be furthersub-sectioned 4122, 4124, 4126 as shown. The subsections 4122, 4124,4126 of the main track forcer may be physically separated as shown, ormay be virtually separated via the controller, from each other to allowsection 4124 across from the switching LIM forcer 4125, to bedeenergizable independent of the other adjoining main track LIM forcersections 4122, 4126. The configuration of the forcer sections 4122,4125, 4124, 4126 and guidance system on the junction segment shown inFIG. 52 is merely exemplary, and in alternate embodiments, the junctionsegments may have any other desired configuration. As seen in FIG. 52,in the exemplary embodiment the switching forcer 4125 may be offset fromboth main and siding track forcer in the direction (e.g. left from axisX) that the siding track merges/diverges. The switching forcer 4125, inthe exemplary embodiment, may have one end 4125M that may be alignedgenerally parallel to the direction of the main track (indicated by axisX), and another end 4125S that may be aligned generally parallel to thelocal direction of the siding track (indicated by axis b in FIG. 52). Inthe exemplary embodiment, the local direction of the siding (axis b) atthe exit/entry from the main track is oriented at an acute anglerelative to the travel direction of the main track (axis X). Thus, asmay be realized, the carriers may take advantage of momentum along axisX to effect switching and may not cancel momentum along axis X in itsentirety (e.g. may not stop on the main track) when moving to thesiding. In accordance with another exemplary embodiment, (see also FIG.52C), the junction segment may be provided with switching guide 4130S′(tracks 4132S′, 4134S″) in place of the switching forcer (4125),effecting switching by co-opting momentum of the carrier along thetravel axis (e.g. axis X) to effect switching without a motor A′ will bedescribed below. As noted before in alternate embodiments, the anglebetween entry/exit to siding and direction of main track may be providedas desired. (For example orthogonal, and even in such a case, theconfiguration of the switching linear motor may take advantage ofmomentum in the X direction). As seen in FIGS. 52-53, in the exemplaryembodiment the end 4125M of the switching LIM forcer 4125 may be locatedto operate on one or more of the reaction plate(s) 5104, 5106 of thecarrier (see also FIG. 53). Reaction plates 5104, 5106 may be offsetlaterally (along axis Y). In addition, reaction plates 5106L, 5106R mayalso be offset longitudinally (along axis X) from a desired referencepoint (e.g. center) of the carrier. In the exemplary embodiment,reaction plates may be located on diagonal axes located at differentangles α, β relative to lateral axis Y. In alternate embodiments, thecarrier may have any other desired reaction plate arrangement with moreor fewer reaction plates. As noted above one or more of the reactionplate(s) 5104L, 5106L may be used with switching forcer 4125 to switchthe carrier from the main track 4100M to the siding 4100S (and viceversa at the merging junction at the other end of siding 4100S, segment4102′, see FIG. 51).

As seen best in FIG. 52B, in the exemplary embodiment the guide magnetsection 4130 is arranged to effect switching between main and sidingtracks. As seen in FIG. 52B, in the exemplary embodiment guide magnettrack 4134 (on the side proximate the siding entry) may be interrupted,so that at least a portion of switching guide track 4134S′(corresponding to that side) may intermerge with track 4134M. Theinterface of the guide tracks shown in FIG. 52B is merely exemplary, andin alternate embodiments the track interface/interchange may be arrangedin any other suitable manner. The opposite guide magnet track 4132M (onthe opposite side from the siding entry) may be intermerged withcorresponding switching guide 4132S′ as shown. In the exemplaryembodiment, each of the guide tracks 4130M, 4130S′ may include a section4132J (see also FIG. 52), comprising an actuable magnetic field that maybe turned on/off. For example, the section 4132J of the guide track maybe configured with electromagnet coils, for example similar to amagnetic chuck having a permanent magnet(s) and a coil arranged aroundthe windings so that passing electric flow through the coil may ineffect turn the magnetic field of the guide magnet section on/off, hencereleasing the guidance force between the carrier and guide track. Inalternate embodiments, the actuable magnetic section may have any otherdesired arrangement. As may be realized, the guide magnet section 4132Jof the desired guide tracks 4132M, 4132S′, 4134S, 4134S′ is turned “on”and “off” to effect switching for example, when the carrier is tocontinue on the main track, the main guide tracks 4132M, 4134M areturned “on” and the switching guides are turned “off” when the carrieris being switched to the siding the switching guides 4132S′, 4134S′ are“on” and the main guides are “off”. Turning the guide magnet section4132M, 4134M “off” allows the carrier to move freely laterally (off themain track) as it may no longer be held to the main track. In alternateembodiments in which the guide magnets are in the carrier, the junctionsegment guide system may include suitable windings to generate acanceling magnetic field to the carrier magnets. The junction segmentmay further include one or more actuable/operable guide magnets (notshown) generally aligned with the entry (axis b) of the siding, thatwhen turned “on” guide the carrier (moved by forcer 4125) onto thesiding track 4100S. These guide magnet sections may be turned “off” whenthe carrier moves over the junction and continues on the main track.Thus, by way of example to switch the carrier from main track to siding,in the exemplary embodiment, the forcer section 4124 may be deactivated,the guide magnet section 4132M, 4134M is turned “off”, and the switch inguide 4132S′, 4134S′ may be “on”. The carrier momentum may move alongthe track with the switching guides in effect deflecting the trajectoryof the carrier in the direction of arrow b (see FIG. 52) onto thesiding. The forcer 4125 (if provided) may further urge the carrier fromthe main track towards the entry to the siding, though in the exemplaryembodiment carrier momentum may be sufficient to move the carrier towardthe siding until siding forcer 4120S operates on the correspondingreaction plate(s) 5102 to continue motion along the siding track 4100Sas desired. The guide magnet track 4130S acquire the magnetic elementsof the carrier to guide the carrier along the siding track 4100S. In theexemplary embodiment, carrier switching being accomplished in agenerally passive manner, position feedback may not be employed forswitching. In alternate embodiments with active switching positionfeedback during switching of the carrier from main to siding may beperformed by the guidance/positioning system, that for example may bedisposed to positionally acquire the carrier when on the main trackprior to hand off to the switching LIM forcer, continue positionfeedback as the carrier is switching via the switching LIM and allow forhandoff to the siding track LIM. As such, the positioning devices may beof any suitable type, continuous or distributed devices (e.g. optical,magnetic, bar-code, fiducial strips, laser/beam ranging or radioranging) positioned to allow position feed back during the switch.

Referring now to FIG. 52A, there is shown another plan view of ajunction segment B′ of the bulk transporter in accordance with anotherexemplary embodiment. The junction segment B′ in this exemplaryembodiment is similar to segment B shown in FIG. 52 except as otherwisenoted. In FIG. 52A, the guide magnet tracks are not shown for clarity.The main track LIM forcer section 4120M′ on segment B′ may also have asubsection 4124′ that may be independently deenergized from theadjoining forcers 4122′, 4126′. In this exemplary embodiment, the sidingLIM forcer 4120B′ may extend sufficiently towards the main track to beable to operate (if desired) on a reaction plate 5106L′ of the carrierwhen the carrier is on the main track. This is illustrated in FIG. 52A,which shows the reaction plates 5102′, 5106L′ of the carrier (inphantom) located to effect switching. The reaction plates 5102′ for thetrack LIM may be for example located over the main track forcer segment4124′ (and for example clear from adjoining “upstream” main track forcer4122′, and the reaction plates) 5106L′ may be located to operate withthe siding LIM forcer 4120B′. Accordingly, to switch main track segment4124′ may be deenergized and the siding forcer 4120B′ may be energizeddirecting the carrier onto the siding track. Switching from siding tomain track may be accomplished in similar manner. In alternateembodiments, the linear motor for the main and siding tracks may be anysuitable linear motor such as a DC brushless motor or other brushlessiron core motor. In the alternate embodiments the permanent magnetreaction elements may be in the carrier, and in other alternateembodiments, the permanent magnets may be in the track segment (coremotor in the carrier). In the alternate embodiments, phase windings maybe located as desired either in the track (in a manner similar to thatshown in FIGS. 20A, 20B), or the carrier to cancel the magnetic fieldbetween magnets and motor core eliminating the guidance provided by theinteraction of magnets/iron core elements of the motor and allowingcarrier switching from one track to another.

Referring now again to FIG. 51, in the exemplary embodiment one or moretrack segments L may have an area I where the carrier may be lifted fromthe track, such as by the robot of the interface section 4200. As may berealized the guide magnets tracks 4130S in the lift area I may beprovided with sections having an actuable magnetic field similar tosection 4132J shown in FIG. 52. In alternate embodiments, phase windingsmay be provided to cancel the field between magnets either in the trackor carrier and magnetic material whether linear motor iron core, orferrous reaction plates in either the track or carrier in order to“release” the carrier from capture by the track, and facilitate ease oflifting the carrier from the track.

Referring again to FIG. 53, in the exemplary embodiment, one or morecarriers 5000 may have couplings 5200 for coupling one or more carrierstogether in a carrier train. The couplings may be of any suitable typesuch as magnetic couplings that may be operably connected to acontroller to couple or release. In alternate embodiments, the intercarrier couplings may be for example mechanical couplings. The couplings5200 are shown schematically in FIG. 53 and in alternate embodiments maybe positioned as desired on the carrier. The intercarrier couplings maybe used to train two or more carriers together during transport by thebulk transport 4100. As may be realized, this allows one or moreentrained carriers to be engines for the train, while other carriers inthe train may be passive. FIG. 51 shows a carrier train in accordancewith the exemplary embodiment. As may be realized, the entrainedcarriers become batched, during the entrainment, allowing movement ofall carriers to be effected by controlling the movement of the “engine”carrier(s) in the train. This may significantly reduce the burden on thecontroller. Positional information of a given carrier in the train maybe registered in the controlled relative to a desired reference in thecarrier train, (e.g. a fiducial of the “engine” carrier). Accordingly,when desired the controller may identify and locate the desired carrierwithout tracking individual carriers movements of each carrier whenmoving as a train, when desired to commence individual control of agiven carrier in the train, the controller may look up the trainlocation on the track, and position of the given carrier relative to thedesired reference on the train to identify a rough location of thecarrier on the track. Fine positioning may be effected with the trackpositioning system. In alternate embodiments, positioning whendecoupling from the carrier train may be effected in any other desiredmanner. As may be realized, any carrier in the train may be the enginecarrier. Positioning of the engine in the carrier train may beestablished to support desired operating parameters. Moreover, theposition of the engine may be switched by deactivation of an enginecarrier and activation of another carrier in the train to become theengine.

Referring now to FIG. 55, there is shown a schematic end elevation viewof a transport system A4000 in accordance with still another exemplaryembodiment. The arrangement of the transport system in the exemplaryembodiment shown in FIG. 55 is merely exemplary and in alternateembodiments the transport system may have any other suitablearrangement. In the exemplary embodiment shown in FIG. 55, the transportsystem A4000 may be generally similar to transport system 4000,described before and illustrated in FIG. 51, (similar features aresimilarly numbered). Transport system A4000 may generally include arapid bulk or mass transport section A4100 and an interface section4200. The rapid mass transport section A4100 may have one or more rapidmass transport pathways A4102 (two pathways are shown in the embodimentillustrated in FIG. 55 for example purposes). In the exemplaryembodiment, the mass transport pathways A4102 may be configured as toeffect mass transport of carriers A5000 within the FAB, such as in amanner similar to that described previously. In the exemplaryembodiment, the mass transport pathways A4102 of mass transport sectionA4100, may also be arranged to transport the carriers traveling thepathways at a substantially constant speed (at least for some portion ofthe pathways), in the direction of travel of the pathway. The pathwaysof the mass transport section may be connected to each other in a mannersimilar to that described previously. The interface section A4200 in theexemplary embodiment shown in FIG. 55, may for example be generallysimilar to interface section 4200 described before and shown in FIG. 51.In the exemplary embodiment, the interface section A4200 is capable ofinterfacing carriers between mass transport and process tools. Theinterface section A4200 may generally have shuttling section(s) A4202and storage section(s) A4204. As noted previously the storage section(s)A4204 may be arranged with storage location(s) A4204A, for storing orbuffering carriers, for a number of processing tools. The storagelocations A4204A may be arranged in any desired manner in order toefficiently buffer carriers for the processing tools. The shuttlingsection(s) A4202 may have a number of feeder robot(s) A4202 capable ofinterfacing carriers between storage locations of the storage sectionA4204 and the load interface(s) (e.g. load ports) of the processingtools. In the exemplary embodiment, the transport system A4000 may havea transport handoff section A4300 capable of interfacing carriers A5000being transported, for example at a substantially constant rate on thebulk transport section pathways A4100, and the interface section A4200.Hence, in the exemplary embodiment the transport system A4000 may be anasynchronous transport system even for the portions of the transportsystems pathways where carriers traveling the pathways are transportedat a substantially constant rate. In the exemplary embodiment, thetransport handoff section(s) A4300 in effect enable decoupling of thetransport rate deterministic operations of carriers, as they are beingtransported by transport system A4000 from the transport paths A4102where carriers travel at a substantially constant rate.

Referring still to FIG. 55, the pathways A4102 of the mass or bulktransport section may comprise any desired type of bulk conveyor system.Referring now to FIG. 55A, in the exemplary embodiment illustrated, thepathways A4102 of the mass transport section A4100 are shown as belt orribbon conveyor A4103 for example purposes only. As may be realized, thebelt conveyor A4103 has carrier support or carry surfaces A4604, onwhich carrier(s) A5000 are supported from (or on) the belt A4103 fortransport. As also may be realized, the belt A4103, and hence itscarrier carry surfaces, (defined by or depending from the belt) may moveat a substantially constant transport rate along the transport directionof the pathway (indicated by arrow X in FIG. 55A. In alternateembodiments, the conveyance system, for conveying carriers along thepathways of the mass transport system section may be of any desiredconfiguration. For example, the pathways may have a solid state conveyorsystem, as described before, or may have mechanically defined conveyancemeans such as rollers, fluidic bearings, etc.). In other alternateembodiments, the pathways may be tracks for autonomous or semiautonomousvehicles. The conveyance system of the pathways may be configured to beoperable so that the carriers conveyed by the system are transported ata substantially constant rate, or may be operable so that the transportrate may be variable if desired. In the event, the transport handoffsection enables operation of the conveyance system of desired pathways(or portions thereof) to maintain substantially constant transport rateindependent of transport rate deterministic operations of carrierstransported by the conveyance system.

In the exemplary embodiment shown in FIG. 55A, the mass transportsection pathways A4102 are shown as being an overhead system, locatedoverhead the processing tools. In alternate embodiments the masstransport section pathways may be located at any desired elevationrelative to the tools and the loading interface LP of the tools. Thecarriers A5000 in the exemplary embodiment shown in FIGS. 55, 55A-55Care representative. Carriers A5000 may be similar to carriers 2000described before and shown in FIGS. 36A-36B. In the exemplaryembodiment, the carriers A5000 may generally have upper interfacesection A5002 (e.g. arranged to allow interface and engagement of thecarrier generally from above or over the carrier) and lower interfacesection A5004 (e.g. arranged to provide interface and engagement of thecarrier generally from below or under the carrier). The carrier may beside opening, top opening or bottom opening as described previously. Inalternate embodiments, the carrier may have any desired arrangement ofinterface/engagement surfaces (e.g. side engagement) for interfacing thecarrier with the transport system and the loading interfaces of theprocessing tools. The loading interfaces LP, of the processing tools, inthe exemplary embodiment shown in FIG. 55 are representative. In theexemplary embodiment, the loading interfaces LP may be arranged tointerface with the lower interface section A5004 of the carrier, thoughin alternate embodiments the tool loading interface may be configured toengage with complementing carrier engagement features on any desiredside of the carrier. The location of the tool loading interface LPrelative to the transport system A4000, illustrated in FIG. 55 is merelyexemplary, and in alternate embodiments the tool loading interface maybepositioned as desired relative to the transport system. In the exemplaryembodiment, illustrated in FIGS. 55, 55A, the conveyor system of themass transport section pathways A4102 may have carrier support A4104arranged to engage the upper interface section A5002 of the carrierA5000. The configuration of the carrier supports shown in FIGS. 55, 55Ais representative, and the carrier supports may have any suitableconfiguration complementing and operable with engagement features of thecarrier upper interface A5002 to releasably capture and hold the carrierfrom the conveyor during transport. In the exemplary embodiment, thecarrier A5000 may be carried by the conveyor of pathways A4102 suspendedsubstantially under the pathway. The carrier lower interface A5004 maybe accessible (such as from under, or from the side of the carrier)during transport on pathways A4102. In alternate embodiments, thecarrier supports on the conveyor of the pathway may have any desiredconfiguration to engage and support the carrier during conveyance on anydesired side or surface of the carrier (e.g. conveyor may engage orinterface with the carrier bottom).

Referring still to FIG. 55, and as noted before, the interface sectionA4200 of the transport system may be an overhead gantry system generallysimilar to interface systems 3200, 3300, 4200 described previously andshown in FIGS. 41-46 and 51. The interface system A4200 may have aselectably variable number of transporter travel planes (such as definedby gantries A4201) traversed by shuttle(s) and feeder robots A4202. Asalso noted before, in alternate embodiments, the interface system mayhave any other desired configuration. In the exemplary embodiment, thegantries A4201 and storage locations A4204 may be nested between thepathways A4102 of the mass transport section. The feeder robots A4204may be configured to engage the carriers A5000 from the carrier upperinterface A5002, and support the carrier from above. Shuttles (notshown) may support the carrier from above or below. In alternateembodiments, the robots and shuttles of the interface section may haveany suitable arrangement. As noted before, handoff of carriers betweenthe mass transport section A4100 and the interface section 4200 may beperformed with the handoff section A4300 as will be described furtherbelow.

As seen best in FIGS. 55, 55A, the handoff section A4300 generally has acarriage surface capable of accessing and capturing carriers transportedalong the mass transport pathways (such as at the substantially constanttransport rate of the pathway), decoupling the carrier from the pathwayand positioning the carrier at a drop station from which therobots/shuttles of the interface section A4200 are capable of accessingthe carrier. Referring now also to FIGS. 55B-55D, in the exemplaryembodiment, the handoff section A4300 may have a number of carrier(s)A4302 (one is shown for example purposes). As seen in the figures, thecarriage A4302 may be a vehicle or any other suitable conveyancemechanism or system, capable of positioning alignment with the carrier,as it is transported on the pathway at the transport rate. Hence, thecarriage A4302 may be capable of travel in the transport direction ofthe pathway (indicated by arrow X) for a sufficient distance to allowcarriage coupling to the carrier and decoupling of the carrier from themass transport conveyance support A4104. In the exemplary embodiment,the carriage A4302 is schematically illustrated as a vehicle riding atrack or path A4304. The track A4304 may be located below the pathwaysA4102 of the mass transport section (see also FIG. 55). For example thetrack A4304 may be suspended by hangers from the overhead. In theexemplary embodiment shown, the track, and carriage A4302 thereon arealso located below the interface section. As noted before, in alternateembodiments, the handoff section carriage may have any other suitableconfiguration. As may be realized, in the exemplary embodiment, thearrangement of the handoff section allows the carriage to accesscarriers on the pathways in, for example, discrete portions of thepathways. The handoff section may be distributed at appropriate sectionsof the pathways. As seen best in FIG. 55D, the carriage A4302 may have acarrier interface A4306 with which to engage and capture the carrier onthe pathways. The carrier interface A4306 of the carriage A4302 may haveany suitable arrangement. In the exemplary embodiment, the carrierinterface A4306 may have engagement features to engage for example thelower interface A5004 of the carrier (see FIG. 55A). For example, thecarriage interface A4306 may have kinematic coupling features thatcomplement kinematic coupling features of the carrier resulting inpassive alignment at engagement and secure passive lock between carrierand carriage when engaged. In alternate embodiments the carriageinterface may have any other desired passive or active coupling orengagement system (e.g. clamps magnetic chuck(s) etc.) to capture thecarrier. As seen in FIG. 55B, the carriage A4302 may be supported on thetrack A4304 so that the carrier interface A4306 of the carriage A4302may be sufficiently aligned with the carrier A5000 so that coupling maybe effected. As may be realized, the carriage track A4304 may besufficient to allow carriage A4302 to accelerate to match travel rate ofpathway A4102, align and capture a desired carrier A5000 conveyed by thepathway and disengage the carrier from the pathway supports A4204. Inthe exemplary embodiment, the carriage track A4304 may be sufficient toallow the carriage for example to decelerate to a desired speed, toallow handoff to the interface system A4200 at the drop off station DS.In the exemplary embodiment, the drop off station DS may be stationary,though its location may be selectably variable (such as along the handoff section track A4304). In alternate embodiments the carriage may bedisposed on the track, such as on an endless loop track, moving atsubstantially matched travel rates as the pathways.

As seen best in FIGS. 55A, 55D, in the exemplary embodiment the carriagesurface of hand off section A4300 may have movement in the Z directionin order to close with the carrier(s) on the pathway, and to load/unloadthe carriers from the pathway supports. In the exemplary embodimentillustrated, the carriage may be provided with a suitable Z drive (suchas lead screw, pneumatic, electro-magnetic) capable of driving thecarriage interface A4306 in the Z-direction.

Hence, and by way of example, to unload a carrier from the pathway, thecarriage interface A4306 may be raised to contact the carrier interfaceA5004 (with the carriage and carrier aligned). The carrier interface maybe further raised, for example after coupling the carrier to effectrelease of the carrier A5000 from the pathway (by way of example thecarriage travel rate relative to the pathway may be varied, such asadvanced/retarded to facilitate carrier release from the pathwaysupports). The carrier released from the pathway may be lowered by thecarriage A4302, so that the carrier clears the transport envelope ofcarriers conveyed by the pathway. The loading of a carrier onto thepathway with the hand off section A4300 may be accomplished in asubstantially similar but opposite manner. In alternate embodiments, Zdirection movement of the carriage interface may be effected in anyother desired manner, such as the supporting track may have a Z-drive orlift, or may have support surface for the carriage of variable height,such as up and down ramps that raise and lower the carriage to contactthe carrier on the pathway. In other alternate embodiments, movementalong the axis to close the carrier and carriage may be effected by asuitable drive or other displacement means of the pathway or the carrier(e.g. the pathway supports may have a Z-axis drive). In still otheralternate embodiments, the axis of movement or closure axis to closecarrier and carriage for coupling and decoupling the carrier to and fromthe pathway with the hand off section may be in any desired direction(relative to ground reference frame).

As seen best in FIGS. 55, 55B-C, and as noted before the handoff sectionA4300 has drop station(s) DS positioned for example to be accessible byrobots A4202 of the interface section A4200. In the exemplaryembodiments, the drop stations DS may be offset from the transportenvelope TE of the mass transport section pathways and carriers conveyedthereon, such as in the Y axis (though in alternate embodiments theoffset may be along any desired axis). The offset of the drop station(s)DS (seen best in FIGS. 55B-55C), which may be generally referred to as alateral offset from the longitudinal direction defined by the pathway,facilitates access of the interface section A4200 to the upper carrierinterface A5002. Also, in the exemplary embodiment the upper interfaceA500N of the carrier may be free to be engaged by the interface sectionA4200 when the carrier is positioned at the drop station DS by thecarriage A4302, because the carriage interfaces the carrier at anothercarrier interface A5002. Hence, in the exemplary embodiment the carriermay be transferred directly between carriage A4302 and interface sectionrobot A4202 without an intervening pick/place action. In alternateembodiments, the hand off system carriage may be arranged to place thecarrier in a storage location, and the interface section may access thecarrier from the storage location. In other alternate embodiments, thehandoff section carriage and interface section robot may interface thecarrier at a common interface. In the exemplary embodiment, top accessto the carrier enables the interface section to employ its feederrobot(s) A4202 to interface the carrier from the drop station DS. Inalternate embodiments, the drop station of the handoff section may beoffset from the transport envelope in any suitable direction to allowthe interface section to access and interface the carrier at the dropstation.

As seen best in FIGS. 55B-55C, in the exemplary embodiment, the carrierA5000 may be moved to and from the drop station DS by the carriageA4302. By way of example, the carriage may have a suitable Y-drive (thedrive may be as desired to provide the carriage, or at least the portioninterfacing/supporting the carrier freedom of movement in the offsetdirection) allowing the carriage to move the carrier to the dropstation. By way of example, the carriage interface A4306 may be on amovable support capable of movement in the Y-direction. In alternateembodiments, the carriage may be capable of movement, such as a unitwith the carrier, in the Y-direction to move the carrier to the dropstation. In still other embodiments, the track may be shaped, such aswith bends (e.g. endless loop) away from the transport envelope, so thatthe carriage traveling along the track is guided to the drop station.

Referring now also to FIGS. 56-56A, there is shown respectivelyschematic plan and elevation views of a representative transport systemA4000′ in accordance with another exemplary embodiment. The transportsystem A4000′ in the exemplary embodiment illustrated in FIGS. 56-56A issubstantially similar to transport system A4000 described before(similar features being similarly numbered). The transport system A4000′generally has a mass transport section A4100′, with a number ofpathway(s) A4102′, an interface section A4200′ (illustrated for examplepurposes as a gantry) and a hand off section A4300′ to hand off carriersA5000′ between the mass transport and interface sections and allowcarriers conveyed by the desired mass transport section pathways tomaintain a substantially constant travel rate. In the exemplaryembodiment, separation or offset between the drop station DS′ of thehand off section A4300′ and the transport envelope TE′ of the pathwaysA4102′ (allowing the transport rate deterministic carrieroperations/actions to be performed clear of the transport envelope) maybe effected by changes in direction of the pathway(s) A4102′. As seenbest in FIG. 56, in the exemplary embodiment pathway(s) may havesections A4102A′, A4102B′, A4102C′ with different directions relative toeach other. For example this may occur at intersection of shunts/bypasssections, end sections of pathways (see also FIGS. 29A-29B and FIG. 51).Pathways sections A4102A′, A4102B′, A4102C′ with different directions,such as in the example shown in FIG. 56, may also be provided in FABzones where it may be desired to load/unload carriers from the masstransport system pathways. The arrangement of the pathway sectionsA4102A′, A4102B′, A4102C′ in the exemplary embodiment illustrated inFIG. 56, generally defines two bends, each of which is of sufficientsize to provide desired separation between transport envelope TE′ andhand off section to establish a drop station DS. As noted before, thedirection and arrangement of the pathway sections shown is merelyexemplary. In the exemplary embodiment, each section has a handoffsection portion A4300′, that may be substantially similar to each otherand to handoff section A4300 described before and shown in FIGS.55A-55D. Each handoff section portion A4300′ may have carriage andtraversing track A4304′ arranged to load/unload carriers A5000′ (seealso FIG. 56A) from pathway(s) A4102′ (in a manner similar to thatpreviously described). Each handoff section portion A4300D′ may have adrop station DS′ for the carrier. In the exemplary embodiment, the dropstation DS′ may be substantially in line with the track A4304′ (as wellas with the transport envelope TE′ of the pathway at some downstream orupstream portion as shown in FIG. 56). In the exemplary embodiment, oneportion A4300, A4300B of the hand off section may be used to unloadcarriers from the pathway, and the other portion may be used to loadcarriers on the pathway. By way of example, portion A4300′ may interfaceand pick carriers from pathway section A4102A′. Unloaded carriers A5000′may be brought to drop station DS′, for example located at an end oftrack A4304′, for handoff to the interface section A4200′. Carriersdestined for loading onto the pathway may be brought by the interfacesection A4200′ to the drop station DSB′ of portion A4300B′ for handoff.The handoff section portion A4300B′ may then move the carrier, matchingtransport rate and direction with pathway section A4102C′ and load thecarriers on the pathway. In alternate embodiments, each portion of thehandoff section may be capable of loading and unloading carriers to/fromthe pathways (e.g. tracks may have multiple drop stations positioned tosupport carrier load or unload relative to the pathway and/or thecarriage may be cycled along the track to effect both loading andunloading. Transport system A4000′ may thus be asynchronous.

Factory automation uses wafer identification for example to plan,schedule and track each wafer through the process. The ID is machinereadable and is managed with a database on the host server. Waferidentification within the database may be affected by wafer breakageequipment down situations or software error. Hence repetitive readingsteps at each process tool may be used to overcome this. Machine readingof wafer typically may occur for example after the carrier is loaded,wafer is removed and then oriented. The ID is reported back to the hostfor verification then processing begins after authentication.Conventionally if the incorrect wafer is loaded it is not caught untilafter much time was wasted to identify. In addition, when a tool goesdown with an error the wafers must be rescued and re-entered into thecarrier/database creating potential for human error. Carriers may possesan onboard writeable data tag which can store the wafer ID's containedwithin and is read by the loadport. The carriers, in accordance with theexemplary embodiments previously described, may have interlocks thatinterlock the carrier writeable ID tag with the wafer ID's at theloadport. The writeable ID tag on the carrier incorporates an externaldigital I/O signal. The signal is tied to a sensor which can detect theremoval of a pod door. The sensor may be of any suitable type such asoptical, mechanical, acoustic, capacitive etc. By way of example a lowvoltage signal line may run through electrically conductive pads on boththe pod shell and the pod door. The pads are in local contact when thedoor is closed completing the flow of voltage. When the door is removedthe flow of voltage is interrupted and the signal is made to the carrierID tag.

In accordance with one exemplary embodiment implements wafer readingmethods along with a software integrity tag and method to detect if adoor has been opened. For example, the integrity tag is written to thewriteable carrier ID after the wafers are loaded and the door is lockedto the pod. When the pod arrives at the next tool loadport the tag isread along with the integrity tag. If the integrity tag is valid thanthe wafer ID's are assumed untampered and valid. If the integrity tag isinvalid than the door has been removed at some point and the wafer IDaccuracy is suspect. Based on this information the host forces a waferread at the tool to validate integrity.

In accordance with another exemplary embodiment an integral wafer IDreader may be provided into the loadport. The reader is positioned suchthat ID's can be read during the door opening sequence to minimize cycletime. This embodiment has the advantage of reduced cycle time comparedto methods which reside in the process tool and also can execute theentire validation scheme separate from the process tool hostcommunication.

In accordance with another exemplary embodiment a dedicated alph-numericdisplay(s) for each wafer slot within the carrier may be added to thecarrier. The integrated display correlates to the actual wafer IDresident within the carrier. The character height may be sufficientlylarge to be read from a large distance similar to the length between anoperator and a ceiling mounted storage nest. In this embodiment, thedisplay indicates the ID integrity graphically. If the integrity tag isinvalid it is shown graphically on the display by a distinguishingcharacter or color.

In accordance with yet another exemplary embodiment integrates anexternal wafer ID reader. The external wafer ID reader may be located,for example external to the loadport and process tool within the AMHSsystem. Carriers with suspect wafer ID's are loaded to the externalreader and validated. Once the operation is completed the door is lockedand the integrity tag is written to the writeable carrier ID. Thecarrier is now moved to the final destination storage/loadport position.This has the advantage of being performed in parallel to the wafercarrier wait time rather than serial to the tool process time. Inaddition, the external reader can incorporate a wafer orientationmethod.

Referring now to FIG. 57, there is shown a schematic elevation view of acarrier door in accordance with yet still another exemplary embodiment.The carrier door in the exemplary embodiment illustrated in FIG. 57 maybe similar to the carriers in the exemplary embodiment describedpreviously and shown in the drawings, except as noted otherwise. Thecarrier door may for example have a conventionally round or cylindricalshape or perimeter (similar for example to carrier 2000 in FIG. 36 C)though in alternate embodiments the carrier may have any other desiredshape, such as with one or more flat perimeter sides. The carrier door6070, which is removably coupled, as will be described further below, tothe carrier shell 6060, to close the wafer (or other work field) openingin the shell and isolate the carrier interior, is shown as being on thebottom of the carrier 6000 for example purposes only. In alternateembodiments, the carrier door may be located on any other side orsurface of the carrier. As noted before, the carrier may be made frommetallic (nonferrous) material, or from nonmetallic materials such asthermoplastic materials.

As noted before, when the carrier door 6070 is closed, the door 6070 andshell 6060 form a seal 6080, at an interface between carrier door andshell as will be described further below, to isolate the interior of thecarrier from outside atmosphere. The carrier door 6070 may be latched tothis shell 6060, sufficiently to securely hold the door to the shell andallow desired transport of the carrier, by a latching system 6072. Thelatching system 6072 may be substantially solid state (i.e.substantially with no moving parts) in the exemplary embodiments, thoughin alternate embodiments, the latching system may have solid stateactuation as well as mechanically actuating parts. In the exemplaryembodiment shown in FIG. 57, the latching system 6072 may include amagnetic latching system 6074. The magnetic latching system 6074 maygenerally have a magnet or field section 6074M and a reactive or platensection 6074R that reacts with the field section to form the latchingforces and latching the door to become latched to the shell. In theexemplary embodiment the magnet section 6074M may be distributedsubstantially around the perimeter of the container shell, or forexample the perimeter of the door to shell interface, to generate asubstantially uniformly distributed magnetic field at the wafer openingof the carrier shell. In the exemplary embodiment, the magnetic section6074M may be formed by a flexible (i.e. multipole) magnet strip orribbon. The flexible magnet strip is schematically illustrated in FIG.57A. In alternate embodiments, the magnet section or the solid statelatch system may be formed in any other suitable manner. The magnetsection may be continuous or segmented and may be installed on thecarrier to form any desired shape. In the exemplary embodiment shown inFIG. 57A, the multipole magnets may be attached to a flexiblenon-magnetic material (e.g. electromagnetic material) that may beresilient or pliable. In the exemplary embodiment, the magnet section6074M is shown as being mounted on a substantially flat surface of theshell. The reactive section 6074R, which may be a suitable ring orsegments of the ferrous material, is shown as being mounted on anopposing surface of the carrier door. The alternate embodiments, themagnet section may be mounted to the door, and the reactive section tothe shell, and may be positioned on any other desired surface of doorand shell. When the door is closed, the reactive section may be biasedagainst the flexible magnets of the magnet section forming a door sealaround the opening.

Referring now to FIG. 58, there is shown a schematic elevation view of acarrier 6000′ and loadport 6300 in accordance with another exemplaryembodiment. The carrier is generally similar to carrier 6000 in FIG. 57.The carrier is shown coupled, or in a position proximate to couplingwith the loadport 6300. The loadport 6300, is generally similar toloadports previously described and shown in the drawings, except asotherwise described below. The loadport in the exemplary embodiment mayhave solid state latching system to lock the carrier to the load portand lock the carrier door to the port door. For example, the load portmay have magnets (e.g. electromagnets) that operate on portions of thecarrier. Similarly the port door may also have magnets (e.g.electromagnets) that operate on magnetic portions of the carrier door(see for example FIGS. 60-62). In the exemplary embodiments, engagementbetween load port door and carrier door may cause disengagement of thecarrier door from the carrier shell. For example, the magnetic latchbetween loadport door and carrier door (see FIGS. 60-62) may be ofsufficient strength to overpower the magnetic latch between carrier doorand carrier so that the carrier door is unlatched and opened by the loadport door being opened. Conversely, the carrier door is automaticallylatched to the carrier, when the port door is returned to the closedposition. FIGS. 59A-D illustrate the four way (or “X”) interface betweenthe carrier shell, carrier door, loadport shell and loadport door inaccordance with a number of different exemplary embodiments.

Referring now to FIGS. 60-62 the magnetic interaction between thecarrier 6000′ and the load port 6300 is shown. As described above, theloadport may include a solid state latching system to lock the carrier6000′ to the loadport rim 6310 and to lock the carrier door 6070′ to theloadport door 6320. The solid state latching system may include a magnetsuch as, for example, electromagnet 6302 that may be located in theloadport rim 6310 that may interact with a ferrous material 6301 in thecarrier shell 6060′. In alternate embodiments the magnet 6302 may be anysuitable magnet. The ferrous material may be a magnet sectionsubstantially similar to section 6074M described above that may runsubstantially around the perimeter of the carrier shell 6060′. Inalternate embodiments, the magnet section may be any suitable ferrousmaterial having any suitable shape. In still other alternate embodimentsthe magnet section may be continuous or segmented and may be installedon the carrier to form any desired shape. The loadport door 6320 mayalso include a magnet 6304 substantially similar to magnet 6302 whilethe carrier door may include a magnet 6303 substantially similar tomagnet 6301. In alternate embodiments, the magnets 6302, 6304 may belocated in the carrier shell and carrier door while the magnets 6301,6303 may be located in the loadport rim and loadport door.

The loadport 6300 may include alignment features to guide the Z-axismotion of the carrier onto the loadport. The carrier alignment featuresmay be, for example, a friction plate 6330 or a kinematic pin 6330′ thatinteract with the carrier door 6070′. In alternate embodiments anysuitable alignment features may be utilized. In other alternateembodiments the alignment features may interact with any portion of thecarrier 6000′. The alignment features may be spring loaded as shown inthe drawings or they may be stationary. These alignment features maywork in conjunction with the magnets 6301-6304 to align the carrier6000′ with the loadport 6300. In alternate embodiments either themagnets or the alignment features may be used to align the carrier withthe loadport. In other alternate embodiments alignment of the carrierand the loadport may be obtained in any suitable manner. It is notedthat because the interaction between the carrier 6000′ and the loadport6300 is solid state (e.g. no moving parts to lock the carrier with theloadport), minimal guidance may be needed to align the carrier with theloadport. In addition, minimal force may be utilized to latch thecarrier with the loadport due to the solid state latching system. Assuch, the alignment features may be minimal in size and may contact thecarrier 6000′ substantially at the same time the carrier contacts theloadport surface. It is also noted that the minimal guidance andminimized alignment features may reduce friction between the carrier andloadport during mating thereby reducing particulate generation.

During operation the magnets 6302, 6304 in the loadport rim 6310 andloadport door 6320 may be inoperable or turned “off”. The inoperabilityof the magnets 6302, 6304 may allow the carrier to be placed on theloadport 6300 without breaking the latch/seal between the carrier shell6060′ and the carrier door 6070′ formed by latching system 6074. Themagnets 6302, 6304 may be activated or turned “on” substantially at thesame time the carrier 6000′ contacts the loadport 6300 so thatparticulate matter is not allowed to enter the carrier. As can be seenin FIG. 63, seals may be provided to isolate the inside of the carrierfrom, for example, an outside atmosphere. The seals may make contactbefore the latching system for latching the carrier to the loadport isactivated or turned on. The seals may be, for example, flat seals thatmay be located between the carrier shell 6060′ and the loadport rim 6310and between the carrier door 6070′ and the loadport door 6320. The sealsmay also be in the form of an o-ring as can be seen located between thecarrier shell 6060′ and the carrier door 6070′ and between the loadportrim 6310 and the loadport door 6320. In alternate embodiments anycombination of flat seals and or o-rings may be utilized. The seals maybe made of a deformable material, such as foam, rubber and the like. Inalternate embodiments the seals may be made of any suitable material. Inanother exemplary embodiment, the seals may be formed by magnets 7040 ascan be seen in FIGS. 64C-64E.

In one exemplary embodiment, and as can be seen in FIGS. 64A-64E, theseals may be in the form of a molded seal 7050 having a shape capable ofcontacting several surfaces simultaneously. For example, as can be seenin FIG. 64A the seal may have a curved top portion and an angled bottomportion. The seal 7050 may be deformable so that as the carrier 6000′ islowered the curved top portion deforms to contact both the carrier door6070′ and the loadport rim 6310 at points 7060B and 7060A respectively.The seal between the carrier shell 6060′ and the loadport rim 6310 andbetween the carrier shell 6060′ and the carrier door 6070′ may beprovided by magnets, o-rings, flat seals and the like. In alternateembodiments, the seals may be provided in any suitable manner. Inaddition to the contact point 7060A, the angled lower portion of theseal may contact the loadport rim 6310 when the loadport door 6320 is ina closed position to further isolate the interior of the processingtool/loadport from, for example an outside atmosphere. In the figures,the seal 7050 is shown as being attached to the loadport door 6320 butin alternate embodiments the seal may be attached to any one of thecarrier shell 6060′, carrier door 6070′, loadport rim 6310, loadportdoor 6320 or in any other suitable location. In alternate embodimentsthe seal 7050 may have arm like features that extend between the carriershell 6060′/carrier door 6070 and the loadport. In other alternateembodiments the seal may have any suitable shape. In operation the seal7050 may isolate the processing tool via the seal formed at point 7060A.As the loadport door 6320 is opened the seal 7040 may be broken allowingthe carrier door 6070′ to separate from the carrier 6000′. The sealformed by seal 7050 at point 7060B may prevent anycontaminants/atmosphere located between the carrier door 6070′ and theloadport door 6320 from entering the carrier 6000′ or the processingtool/loadport.

The operation of opening the carrier will now be described. The carrier6000′ may arrive at the load port 6300 as described above. The carrier6000′ may be mechanically coupled with loadport 6300 via, for examplethe Z-axis alignment features 6330, 6330′. The carrier shell 6060′ maybe allowed to float during mechanical coupling. The alignment featuresmay minimally guide the carrier 6000′ during activation of thecarrier/loadport latching system. The carrier door 6070′ may be latchedto the loadport door 6320 via the magnets 6303, 6304. The carrier shell6060′ may be latched to the loadport rim 6310 via the magnets 6301,6302. The magnets 6303, 6304 may overpower the magnets holding thecarrier door 6070′ to the carrier shell 6060′ so that the carrier door6070′ is unlatched from the carrier shell 6060′ and removed from theshell 6060′. The wafers may be lowered out of the carrier 6000′ to therobot transfer height. In this exemplary embodiment, a bottom loadcarrier is utilized, however in alternate embodiments any suitablecarrier (e.g. front load, etc.) may be utilized.

To close the carrier, the wafers may be raised from the robot transferheight to the inside of the carrier 6000′. The carrier door 6070′ may beinserted into the carrier shell 6060′. The carrier door may be latchedvia the carrier door/carrier shell latching system described above. Thecarrier shell 6060′ and the carrier door 6070′ may unlatchsimultaneously by, for example, turning off the magnets 6302, 6304. Inalternate embodiments, the carrier shell and carrier door may bereleased at different times and in any order. The carrier may be readyfor departure from the load port.

It should be understood that the foregoing description is onlyillustrative of the invention. Various alternatives and modificationscan be devised by those skilled in the art without departing from theinvention. Accordingly, the present invention is intended to embrace allsuch alternatives, modifications and variances which fall within thescope of the appended claims.

What is claimed is:
 1. A semiconductor workpiece processing systemcomprising: at least one substrate processing tool for processingsemiconductor substrates; a first transport section elongated anddefining a travel direction, and having parts, that interface asubstrate holding container, supporting and transporting the substrateholding container along the travel direction; a second transport sectionbeing separate and distinct from the first transport section, the secondtransport section interfacing with the first transport section and beingconfigured to transport the substrate holding container between thefirst transport section and the at least one substrate processing tool,the second transport section including at least one overhead gantrydisposed above the at least one substrate processing tool.
 2. Thesemiconductor workpiece processing system of claim 1, where the at leastone overhead gantry includes at least one overhead carrier having atleast three degrees of freedom.
 3. The semiconductor workpieceprocessing system of claim 2, where the substrate holding container hasan access side and the at least one overhead carrier includes arotational drive configured to rotate the substrate holding containercarried by the at least one overhead carrier to change a direction inwhich the access side faces.
 4. The semiconductor workpiece processingsystem of claim 1, further comprising at least one overhead storagestation disposed above the at least one substrate processing tool, thesecond transport section being configured to transport substrate holdingcontainers to and from the at least one overhead storage station.
 5. Thesemiconductor workpiece processing system of claim 1, wherein the atleast one gantry is configured to service opposingly arranged load portsof the at least one substrate processing tool.
 6. The semiconductorworkpiece processing system of claim 5, wherein the at least oneoverhead gantry includes at least one carrier configured to rotate asubstrate holding container carried by the carrier so that anorientation of the substrate holding container corresponds to anorientation of a respective one of the opposingly arranged load ports.7. The semiconductor workpiece processing system of claim 6, wherein theat least one carrier is configured for on the fly rotation of thesubstrate holding container.
 8. A semiconductor workpiece processingsystem comprising: at least one substrate processing tool for processingsemiconductor substrates; a first transport section configured totransport substrate holding containers and defining a travel direction;at least one substrate holding container storage disposed above the atleast one substrate processing tool; a feeder shuttle that interfaceswith and crosses the travel direction of the first transport section fortransporting the substrate holding containers between the firsttransport section and the at least one substrate holding containerstorage; a second transport section that is separate and distinct fromthe first transport section and interfacing with at least the at leastone substrate holding container storage, the second transport sectionbeing configured to transport substrate holding containers between theat least one substrate holding container storage and the at least onesubstrate processing tool, the second transport section including atleast one overhead gantry disposed above the at least one substrateprocessing tool.
 9. The semiconductor workpiece processing system ofclaim 8, wherein the second transport section is disposed above thefeeder shuttle such that the second transport carrying a substrateholding container is capable of passing over the feeder shuttle.
 10. Thesemiconductor workpiece processing system of claim 8, where the at leastone overhead gantry includes at least one overhead carrier having atleast three degrees of freedom.
 11. The semiconductor workpieceprocessing system of claim 10, where the substrate holding container hasan access side and the at least one overhead carrier includes arotational drive configured to rotate a substrate holding containercarried by the at least one overhead carrier to change a direction inwhich the access side faces.
 12. The semiconductor workpiece processingsystem of claim 8, where the feeder shuttle includes a rotational driveconfigured to rotate a substrate holding container carried by the feedershuttle.
 13. The semiconductor workpiece processing system of claim 8,wherein the at least one gantry is configured to service opposinglyarranged load ports of the at least one substrate processing tool. 14.The semiconductor workpiece processing system of claim 13, wherein theat least one overhead gantry includes at least one carrier configured torotate a substrate holding container carried by the carrier so that anorientation of the substrate holding container corresponds to anorientation of a respective one of the opposingly arranged load ports.15. The semiconductor workpiece processing system of claim 14, whereinthe at least one carrier is configured for on the fly rotation of thesubstrate holding container.